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Photointerrupter LTH-301-05 Datasheet - Non-Contact Switching - English Technical Document

Complete technical datasheet for the LTH-301-05 photointerrupter, featuring non-contact switching, fast response times, and detailed electrical/optical characteristics.
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PDF Document Cover - Photointerrupter LTH-301-05 Datasheet - Non-Contact Switching - English Technical Document

1. Product Overview

The LTH-301-05 is a reflective photointerrupter, a type of optoelectronic component that combines an infrared light-emitting diode (IR LED) and a phototransistor in a single, compact package. Its primary function is to detect the presence or absence of an object without physical contact, making it a non-contact switch. The core advantage of this device lies in its reliability and longevity, as it eliminates mechanical wear and tear associated with traditional switches. It is designed for direct PCB (Printed Circuit Board) mounting or use with a dual-in-line socket, offering flexibility in assembly. The fast switching speed makes it suitable for applications requiring rapid detection, such as in printers, copiers, vending machines, and industrial automation equipment where position sensing, object counting, or edge detection is needed.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. They are not for continuous operation. Key parameters include:

2.2 Electrical & Optical Characteristics

These parameters are measured at an ambient temperature (TA) of 25°C and define the device's typical performance.

2.2.1 Input (IR LED) Characteristics

2.2.2 Output (Phototransistor) Characteristics

2.2.3 Coupler (Combined) Characteristics

These parameters describe the behavior of the LED and phototransistor working together.

3. Mechanical & Packaging Information

3.1 Package Dimensions

The device features a standard through-hole package with four leads. The exact dimensions are provided in the datasheet drawings. Key notes include:

3.2 Polarity Identification

Correct orientation is crucial. The datasheet diagram clearly indicates the anode and cathode pins for the IR LED and the collector and emitter pins for the phototransistor. Mounting the device incorrectly can lead to non-operation or permanent damage.

4. Soldering & Assembly Guidelines

Proper handling ensures device reliability and longevity.

5. Application Suggestions

5.1 Typical Application Scenarios

5.2 Design Considerations

6. Principle of Operation

The LTH-301-05 operates on a simple optical principle. The internal IR LED emits a beam of infrared light. Opposite the LED is a phototransistor. In the "uninterrupted" state, this light beam travels across a small gap and strikes the phototransistor, causing it to conduct (turn on). When an object is inserted into this gap, it blocks the infrared light. With no light incident on the phototransistor, it stops conducting (turns off). This change in the electrical state of the phototransistor (from conducting to non-conducting, or vice-versa) is detected by the external circuitry, registering the presence of the object. The phototransistor essentially acts as a current source controlled by light intensity.

7. Performance Curve Analysis

The datasheet includes typical characteristic curves which are invaluable for detailed design analysis. While specific graphs are not reproduced in text, they typically illustrate the following relationships:

8. Common Questions Based on Technical Parameters

  1. Q: What is the typical sensing distance? A: The sensing distance is not a single fixed value in the datasheet. It depends on the specific mechanical design of the slot, the drive current to the LED (IF), the sensitivity of the receiving circuit, and the reflectivity of the interrupting object. The designer must determine this based on the IC(ON) parameter and application setup.
  2. Q: Can I drive the LED directly from a microcontroller pin? A: Possibly, but you must check two things: a) The microcontroller pin's maximum current sourcing capability must be greater than your desired IF (e.g., 20mA). b) You MUST include a current-limiting resistor in series as described in the design considerations. Never connect an LED directly to a voltage source.
  3. Q: How do I interface the output with a digital input? A: The simplest method is to use a pull-up resistor on the collector. When the light path is clear, the phototransistor is on, pulling the collector voltage low (close to VCE(SAT)). When the light is blocked, the transistor is off, and the pull-up resistor pulls the collector voltage high (to VCC). This provides a clean logic-level signal.
  4. Q: Why is the response time important? A: Fast response times (microseconds) allow the sensor to detect very fast-moving objects or rapid sequential events without missing counts. This is essential in high-speed machinery, encoder applications, or communication systems using pulsed light.
  5. Q: What happens if I exceed the absolute maximum ratings? A: Exceeding these limits, even briefly, can cause immediate or latent damage to the device. This can include degradation of the LED's light output, increased dark current in the phototransistor, or complete failure (open or short circuit). Always design with a safety margin.

9. Practical Design and Usage Case

Case: RPM Measurement of a Small DC Motor

A designer needs to measure the rotational speed of a motor shaft. They attach a small slotted disk to the shaft. The LTH-301-05 is mounted such that the disk rotates through its sensing gap. Each time a slot passes through the gap, light reaches the phototransistor, causing a pulse in the output. The LED is driven with a constant 15mA current via a resistor. The phototransistor collector is connected to a 5V supply through a 4.7kΩ pull-up resistor and also to a microcontroller's interrupt-capable input pin.

The microcontroller firmware is programmed to count the number of pulses (rising or falling edges) received within a fixed time window (e.g., one second). Since the disk has, for example, 20 slots, the number of pulses per second divided by 20 gives the revolutions per second, which is easily converted to RPM. The fast rise and fall times of the sensor ensure that even at high motor speeds, the pulses are clean and accurately counted, without missing edges due to slow sensor response.

10. Development Trends

Photointerrupters like the LTH-301-05 represent a mature and reliable technology. Current trends in the broader field of optoelectronic sensors focus on:

Despite these advancements, the fundamental reflective photointerrupter remains a cost-effective and robust solution for a vast array of non-contact sensing applications, and understanding its detailed parameters as outlined in this datasheet is the first step towards a successful design.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.