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Photointerrupter LTH-872-N55T1 Datasheet - English Technical Document

Complete technical datasheet for the LTH-872-N55T1 photointerrupter, featuring non-contact switching, fast response, and detailed electrical/optical specifications for scanner and printer applications.
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PDF Document Cover - Photointerrupter LTH-872-N55T1 Datasheet - English Technical Document

1. Product Overview

The LTH-872-N55T1 is a reflective photointerrupter, a type of optoelectronic component that combines an infrared light-emitting diode (LED) and a phototransistor in a single, compact package. Its primary function is to detect the presence or absence of an object without physical contact by sensing the interruption of the light beam reflected from the object back to the sensor. This device is engineered for applications requiring reliable, fast, and non-invasive object detection or position sensing.

1.1 Core Advantages

The key advantages of this photointerrupter stem from its fundamental operating principle and design. Non-contact switching eliminates mechanical wear and tear, significantly enhancing the operational lifespan and reliability compared to mechanical switches. This is crucial in high-cycle applications. Furthermore, it offers fast switching speed, with typical rise and fall times in the microsecond range, enabling it to detect rapidly moving objects or high-frequency events. The integrated package ensures precise alignment between the emitter and detector, simplifying assembly and improving consistency.

1.2 Target Market and Application

The primary target markets for this component are office automation and precision instrumentation. Its main documented application is within scanners and printers. In these devices, photointerrupters are commonly used for functions such as paper presence detection (e.g., sensing the leading edge of a sheet), paper jam detection, carriage or print head position sensing, and detecting the home position of moving mechanisms. The fast response time is essential for maintaining the high throughput of modern scanning and printing equipment.

2. In-Depth Technical Parameter Analysis

Understanding the electrical and optical characteristics is critical for proper circuit design and ensuring reliable operation within the device's specified limits.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. They are not intended for normal operation.

2.2 Electrical & Optical Characteristics

These parameters are specified at an ambient temperature (TA) of 25°C and define the device's performance under normal operating conditions.

3. Performance Curve Analysis

The datasheet references typical electrical/optical characteristic curves. While the specific graphs are not provided in the text, their purpose is to illustrate the relationship between key parameters under varying conditions, which is essential for robust design.

3.1 Inferred Curve Information

Based on standard practice for such components, the typical curves would likely include:

4. Mechanical & Package Information

The package dimensions are referenced but not detailed in the provided text. The notes specify that all dimensions are in millimeters (with inches in parentheses) and the general tolerance is ±0.25mm unless otherwise stated. The part number LTH-872-N55T1 suggests a specific package style common to reflective photointerrupters, which typically features a molded plastic body with a slot. The emitter and detector face the same direction across this slot, allowing them to detect an object that reflects the emitted light back.

4.1 Polarity Identification and Pinout

While the exact pinout is not listed, standard photointerrupter packages have 4 pins: two for the anode and cathode of the infrared LED, and two for the collector and emitter of the NPN phototransistor. The datasheet would typically include a diagram showing the top view and pin numbering (e.g., 1: Anode, 2: Cathode, 3: Collector, 4: Emitter). Correct polarity connection for the LED is mandatory to prevent damage.

5. Soldering & Assembly Guidelines

The datasheet provides a critical parameter for assembly: the maximum lead soldering temperature. For leads positioned 1.6mm (0.063 inches) from the plastic case, the temperature must not exceed 260°C for 5 seconds. This is a standard rating for wave or hand soldering. For reflow soldering, the component must be compatible with the specific reflow profile used, which typically has a peak temperature around 240-250°C. Exceeding these thermal limits can cause internal damage to the semiconductor junctions or deform the plastic package, affecting optical alignment and performance.

6. Application Suggestions & Design Considerations

6.1 Typical Application Circuit

A basic interface circuit involves two main parts:

  1. LED Driver: A current-limiting resistor is connected in series with the LED. The resistor value (Rseries) is calculated as: Rseries = (VCC - VF) / IF. Using the typical VF of 1.4V and a desired IF of 20mA with a 5V supply gives Rseries = (5 - 1.4) / 0.02 = 180 Ω. A standard 180Ω or 220Ω resistor would be suitable. Driving the LED with a constant current, rather than a constant voltage, provides more stable light output.
  2. Phototransistor Output: The phototransistor is typically used in a common-emitter configuration. A load resistor (RL) is connected between the collector and the positive supply (VCC). The emitter is connected to ground. When light falls on the transistor, it turns on, pulling the collector voltage low (towards VCE(SAT)). When dark, the transistor is off, and the collector voltage is pulled high to VCC by RL. The value of RL determines the output voltage swing and speed; a smaller RL gives faster response but a smaller swing. The datasheet tests with RL=100Ω.

6.2 Design Considerations

7. Technical Comparison & Differentiation

Compared to other sensing technologies, this photointerrupter offers specific advantages:

8. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the purpose of the dark current (ICEO) specification?
A: Dark current is the small leakage current that flows through the phototransistor when it is completely dark (no light from the LED and no ambient light). In the "off" state, this current flowing through the load resistor (RL) creates a small voltage drop. A high dark current could result in an output voltage that is not fully at the "high" logic level, potentially causing misinterpretation by the following circuitry. The specified max of 100 nA is very low, ensuring a clean off-state signal.

Q: How do I choose the right LED drive current (IF)?
A: The drive current affects light output, which directly affects the output current of the phototransistor (IC(ON)) and the device's sensitivity. Operating at the typical test condition of 20mA is a good starting point. You can reduce current to save power if the application has high reflectivity and short distance. Increasing current may improve signal strength for difficult targets but will increase power dissipation and must stay below the 50mA absolute maximum. Refer to the typical CTR vs. IF curve for guidance.

Q: Can I use this sensor outdoors?
A: The operating temperature range (-25°C to +85°C) allows for use in many environments. However, direct sunlight contains strong infrared radiation that can saturate the phototransistor, causing constant "on" detection. For outdoor use, optical filtering (an IR-pass filter that blocks visible light but passes the LED's wavelength) and/or signal modulation techniques are strongly recommended to reject ambient IR light.

9. Operating Principle

The LTH-872-N55T1 operates on the principle of internal reflection modulation. An infrared LED emits light. In the absence of a reflective target within the sensing field, most of this light dissipates. When a suitably reflective object enters the field, a portion of the emitted light is reflected back towards the device. The integrated phototransistor, which is sensitive to the same infrared wavelength, detects this reflected light. The incident photons generate electron-hole pairs in the phototransistor's base region, effectively providing base current. This causes the transistor to turn on, allowing a collector current (IC) to flow that is proportional to the intensity of the reflected light. This change in output current/voltage is then used by external circuitry to signal the object's presence.

10. Industry Trends

While fundamental photointerrupter technology is mature, trends focus on miniaturization, integration, and enhanced functionality. Newer devices may feature:
- Surface-Mount (SMD) Packages: Smaller footprints for high-density PCB assembly.
- Integrated ICs: Some modern photointerrupters include amplification, Schmitt triggers for hysteresis, and even digital output (e.g., I2C) on-chip, simplifying interface design.
- Higher Speed: Development continues for even faster response times to keep pace with increasing machine speeds.
- Improved Ambient Light Rejection: Advanced optical designs and modulation schemes are being employed to make sensors more robust in challenging lighting environments. The core reflective sensing principle, as embodied in components like the LTH-872-N55T1, remains a reliable and cost-effective solution for a wide range of non-contact detection tasks.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.