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PLCC-2 Blue LED 67-11-UB0200H-AM Datasheet - Automotive Grade - 120° Viewing Angle - 3.1V - 20mA - English Technical Document

Technical datasheet for the 67-11-UB0200H-AM, a PLCC-2 packaged blue LED designed for automotive interior lighting. Features include 355mcd typical luminance, 120° viewing angle, AEC-Q101 qualification, and RoHS/REACH compliance.
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PDF Document Cover - PLCC-2 Blue LED 67-11-UB0200H-AM Datasheet - Automotive Grade - 120° Viewing Angle - 3.1V - 20mA - English Technical Document

Table of Contents

1. Product Overview

The 67-11-UB0200H-AM is a high-reliability, surface-mount LED component engineered specifically for demanding automotive interior applications. Utilizing a PLCC-2 (Plastic Leaded Chip Carrier) package, this device offers a robust solution for backlighting and indicator functions where consistent performance under varying environmental conditions is critical. Its core advantages include a wide 120-degree viewing angle for excellent visibility, qualification to the stringent AEC-Q101 standard for automotive-grade components, and compliance with RoHS and REACH environmental directives. The primary target market is automotive electronics, with key applications including instrument cluster illumination, switch backlighting, and general interior accent lighting.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Optical Characteristics

The LED emits blue light with a typical dominant wavelength (λd) of 468 nm, ranging from 463 nm to 475 nm. The key photometric parameter is its luminous intensity, which is typically 355 millicandelas (mcd) when driven at the standard test current of 20 mA. The minimum and maximum values for this bin are 224 mcd and 560 mcd, respectively, indicating the production spread. A defining feature is its very wide viewing angle (φ) of 120 degrees, which is the off-axis angle where the luminous intensity drops to half of its peak value. This ensures uniform illumination over a broad area.

2.2 Electrical and Thermal Characteristics

The forward voltage (VF) typically measures 3.1 volts at 20 mA, with a range from 2.75 V to 3.75 V. The absolute maximum continuous forward current (IF) is 30 mA, with a recommended operating current of 20 mA. The device is not designed for reverse bias operation. Thermal management is crucial for LED longevity. The junction-to-solder point thermal resistance is specified with two values: an electrical measurement (Rth JS el) of 100 K/W max and a real measurement (Rth JS real) of 130 K/W max. The maximum permissible junction temperature (TJ) is 125°C.

2.3 Absolute Maximum Ratings and Reliability

Strict limits define the safe operating area: Power dissipation (Pd) must not exceed 112 mW. The device can withstand a surge current (IFM) of 300 mA for pulses ≤ 10 µs with a very low duty cycle (0.005). The operating and storage temperature range is from -40°C to +110°C, suitable for automotive environments. Electrostatic discharge (ESD) protection is rated at 8 kV (Human Body Model), and the component is classified as Moisture Sensitivity Level (MSL) 2.

3. Binning System Explanation

The LED is sorted into bins based on key performance parameters to ensure consistency within a production lot.

3.1 Luminous Intensity Binning

The luminous intensity is categorized into alphanumeric bin codes (e.g., L1, M1, N1...). The bin for this specific part number, as indicated in the characteristics table (Typ. 355 mcd), falls within the "T1" bin, which covers the range from 280 mcd to 355 mcd. The binning structure extends from very low intensity (L1: 11.2-14 mcd) to very high intensity, providing a wide selection for different brightness requirements.

3.2 Dominant Wavelength Binning

The blue color is controlled through dominant wavelength bins. The typical value of 468 nm for this part places it in the "6367" bin, which spans from 463 nm to 467 nm, or potentially the "6771" bin (467-471 nm), depending on the exact minimum/maximum. This tight control (±1 nm tolerance) ensures minimal color variation between individual LEDs in an assembly.

4. Performance Curve Analysis

4.1 Forward Current vs. Forward Voltage (IV Curve)

The provided graph shows the non-linear relationship between forward current and forward voltage. The curve is typical for a blue LED, with a turn-on voltage around 2.7V and a relatively steep slope thereafter. This data is essential for designing the current-limiting circuitry to ensure stable operation.

4.2 Temperature Dependency

Several graphs detail performance changes with temperature. The forward voltage has a negative temperature coefficient, decreasing by approximately 2 mV/°C relative to its value at 25°C. Conversely, luminous intensity decreases as junction temperature rises; at 100°C, the output is roughly 80-85% of its 25°C value. The dominant wavelength also shifts slightly with temperature (typically +0.05 to +0.1 nm/°C for blue LEDs).

4.3 Spectral Distribution and Radiation Pattern

The relative spectral distribution graph shows a peak in the blue wavelength region (~468 nm) with a typical full width at half maximum (FWHM) for an InGaN-based LED. The radiation pattern diagram visually confirms the 120° viewing angle, showing a Lambertian-like emission pattern.

4.4 Derating and Pulse Operation

A forward current derating curve dictates the maximum allowable continuous current as a function of the solder pad temperature (TS). For example, at a TS of 110°C, the maximum current is 30 mA. A separate graph defines the permissible pulse handling capability, showing the peak pulse current (IFP) allowed for a given pulse width (tp) and duty cycle (D).

5. Mechanical and Package Information

The component uses a standard PLCC-2 surface-mount package. The mechanical drawing (implied by the "Mechanical Dimension" section) would specify the exact length, width, height, and lead spacing. The package features a molded plastic body with two leads. Polarity is indicated by the physical shape of the package or a marking on the top, typically a notch or a green dot near the cathode. The recommended solder pad layout is provided to ensure proper soldering and thermal relief during reflow.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The datasheet specifies a reflow soldering condition where the component leads must be exposed to a temperature above 217°C (the solder paste liquidus temperature) for a duration between 60 and 150 seconds. A detailed reflow profile graph would typically show the recommended preheat, soak, reflow peak temperature (which must not exceed the absolute maximum of the LED's soldering temperature rating), and cooling ramp rates.

6.2 Precautions for Use

General precautions include: Avoiding the application of reverse voltage. Using a series resistor or constant current driver to limit forward current. Ensuring the maximum junction temperature is not exceeded by considering ambient temperature, drive current, and PCB thermal design. Handling the devices with appropriate ESD precautions. Following the recommended storage conditions (MSL 2) if the packaging is opened.

7. Packaging and Ordering Information

The "Packaging Information" section details how the LEDs are supplied, typically on embossed carrier tapes wound into reels. Key parameters include reel dimensions, pocket pitch, and the quantity of components per reel. The part number 67-11-UB0200H-AM follows a specific coding system where "67" likely indicates the series, "11" the size or variant, "UB" the color (Blue), and "200H" specific performance bins. The "Ordering Information" would clarify how to specify reel size or other options.

8. Application Recommendations

8.1 Typical Application Scenarios

This LED is ideal for:
Automotive Interior Lighting: Backlighting for buttons, switches, climate control panels, and door handles.
Instrument Clusters: Illumination for gauges and warning indicators, benefiting from the wide viewing angle.
General Indicator Functions: Status lights within the cabin where blue is the designated color.

8.2 Design Considerations

Current Drive: Always use a constant current source or a voltage source with a series resistor. Calculate the resistor value using R = (Vsupply - VF) / IF. Use the maximum VF from the datasheet to ensure current does not exceed limits at low temperatures where VF is higher.
Thermal Management: Connect the thermal pad (if present) to a sufficient copper area on the PCB to act as a heat sink. This is critical for maintaining light output and longevity, especially at high ambient temperatures or drive currents.
Optical Design: The wide viewing angle may require light guides or diffusers to achieve specific illumination patterns and avoid hot spots.

9. Technical Comparison and Differentiation

Compared to standard commercial-grade PLCC-2 LEDs, the key differentiators of this part are its AEC-Q101 qualification, which validates its reliability under automotive stress tests (thermal cycling, high temp/high humidity operation, etc.), and its extended operating temperature range (-40°C to +110°C). The 8 kV ESD rating is also typically higher than commercial parts. The specific binning for luminous intensity and wavelength ensures color and brightness consistency, which is paramount in multi-LED automotive displays.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED directly from a 5V supply?
A: No. With a typical VF of 3.1V, connecting it directly to 5V would cause excessive current and immediate failure. You must use a series current-limiting resistor or a constant-current driver.

Q: What is the expected lifetime of this LED?
A: LED lifetime is strongly dependent on operating conditions, primarily junction temperature and drive current. When operated within the specified ratings (especially TJ < 125°C), automotive-grade LEDs like this typically have L70 lifetimes (time to 70% of initial light output) rated in tens of thousands of hours.

Q: How do I interpret the luminous intensity bin code (e.g., T1) when ordering?
A: The bin code guarantees that the LED's intensity will fall within the specified range (e.g., T1: 280-355 mcd). For consistent brightness in an array, specify a single, tight bin code.

Q: Is a heat sink necessary?
A> For continuous operation at 20 mA or above, especially in high ambient temperatures, proper thermal management via the PCB copper is essential. A dedicated heat sink is usually not required for a single LED, but the PCB layout must facilitate heat dissipation.

11. Practical Design and Usage Case

Case: Designing a backlight for an automotive push-button switch.
1. Requirement: Uniform blue illumination across a 10mm diameter button cap.
2. Component Selection: One 67-11-UB0200H-AM LED is sufficient due to its high brightness and wide viewing angle.
3. Circuit Design: The vehicle's nominal 12V system (14V when running) is used. A series resistor is calculated: R = (14V - 3.1V) / 0.020A = 545 ohms. A 560 ohm, 1/8W resistor is selected. The power dissipated in the LED is P = VF * IF = ~3.1V * 0.02A = 62 mW, well below the 112 mW maximum.
4. PCB Layout: The LED is placed centrally under the button. The solder pads are connected to a generous copper pour on the board's ground plane to aid heat dissipation. The polarity marking is carefully observed during assembly.
5. Optical Integration: A small, milky-white plastic light guide is placed between the LED and the button cap to diffuse the point source into a uniform circle of light.

12. Operating Principle

This is a semiconductor light-emitting diode (LED). When a forward voltage exceeding its bandgap energy is applied across the anode and cathode, electrons and holes recombine in the active region of the semiconductor chip (typically made of Indium Gallium Nitride - InGaN for blue light). This recombination process releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor materials used. The PLCC-2 package encapsulates the tiny semiconductor die, provides mechanical protection, houses the wire bonds, and incorporates a molded plastic lens that shapes the light output to achieve the 120-degree viewing angle.

13. Technology Trends

The trend in automotive interior lighting LEDs is towards higher efficiency (more lumens per watt), enabling brighter displays or lower power consumption and thermal load. There is also a move towards smaller package sizes (e.g., chip-scale packages) for denser PCB layouts and more flexible design. Furthermore, integration of control electronics, such as constant-current drivers or PWM dimming circuits, directly into the LED package ("smart LEDs") is becoming more common to simplify system design. Color consistency and stability over temperature and lifetime remain critical focus areas, driven by the high aesthetic standards of modern vehicle interiors.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.