PLCC-2 Blue LED Datasheet - 65-11-UB0200L-AM - Automotive Grade - 120° Viewing Angle - 3.1V - 20mA - English Technical Document

1. Product Overview

The 65-11-UB0200L-AM is a high-reliability, surface-mount LED designed primarily for demanding automotive and industrial applications. It utilizes a PLCC-2 (Plastic Leaded Chip Carrier) package, offering a robust and compact form factor suitable for automated assembly processes. The device emits a vibrant blue light with a typical dominant wavelength of 468 nm. Its core advantages include a wide 120-degree viewing angle for excellent light dispersion, qualification to the stringent AEC-Q101 standard for automotive components, and compliance with environmental directives such as RoHS and REACH. The target market encompasses automotive interior lighting systems, backlighting for switches and control panels, and instrument cluster illumination where consistent performance and long-term reliability are critical.

2. In-Depth Technical Parameter Analysis

2.1 Optoelectronic Characteristics

The key performance metrics are defined under standard test conditions of a forward current (I_F) of 20 mA. The typical luminous intensity is 355 millicandelas (mcd), with a specified minimum of 224 mcd and a maximum of 560 mcd, indicating the production spread. The forward voltage (V_F) typically measures 3.1 volts, ranging from 2.75V to 3.75V. This parameter is crucial for driver circuit design to ensure proper current regulation. The viewing angle, defined as the full angle where intensity drops to half of its peak value, is a wide 120 degrees, providing broad, even illumination. The dominant wavelength centers around 468 nm, defining the specific shade of blue emitted.

2.2 Absolute Maximum Ratings and Electrical Parameters

These ratings define the operational limits beyond which permanent damage may occur. The absolute maximum continuous forward current is 30 mA, while the device can handle surge currents up to 300 mA for very short pulses (<10 μs). The maximum power dissipation is 112 mW. Critically, the device is not designed for reverse bias operation. The junction temperature must not exceed 125°C, with an operating ambient temperature range of -40°C to +110°C, confirming its suitability for harsh automotive environments. It also features a robust 8 kV ESD (Electrostatic Discharge) protection rating (Human Body Model), enhancing handling reliability.

2.3 Thermal Characteristics

Thermal management is vital for LED longevity and performance stability. The datasheet specifies two thermal resistance values: the real thermal resistance (R_{th JS real}) from the junction to the solder point is a maximum of 120 K/W, while the electrical method-derived value (R_{th JS el}) is 95 K/W. This difference highlights the importance of the measurement technique. A lower thermal resistance indicates more efficient heat transfer from the semiconductor junction to the PCB, helping to maintain lower operating temperatures and thus higher light output and longer lifespan.

3. Binning System Explanation

The production process results in natural variations in key parameters. To ensure consistency for the end-user, LEDs are sorted into bins.

3.1 Luminous Intensity Binning

The luminous intensity is categorized into a detailed alphanumeric binning structure, ranging from L1 (11.2-14 mcd) up to GA (18000-22400 mcd). The 65-11-UB0200L-AM part, with its typical 355 mcd, falls into the T1 bin (280-355 mcd). Designers must specify the required bin or acceptable range when ordering to guarantee the desired brightness level in their application.

3.2 Dominant Wavelength Binning

Similarly, the shade of blue is controlled through wavelength binning. Bins are defined by four-digit codes representing the minimum wavelength in nanometers. For example, bin '6367' covers wavelengths from 463 nm to 467 nm. The typical 468 nm device would be in the '6771' bin (467-471 nm) or '7175' bin (471-475 nm). This ensures color consistency across multiple LEDs in a single assembly.

4. Performance Curve Analysis

The provided graphs offer deep insight into the device's behavior under various conditions.

4.1 IV Curve and Luminous Efficacy

The Forward Current vs. Forward Voltage graph shows a characteristic exponential relationship. The Relative Luminous Intensity vs. Forward Current curve demonstrates that light output increases with current but begins to show signs of saturation as current rises, emphasizing the need for proper current drive rather than voltage drive. The typical operating point of 20 mA is well-chosen for a balance of efficiency and output.

4.2 Temperature Dependency

The temperature characteristics are critical for real-world performance. The Relative Luminous Intensity vs. Junction Temperature graph shows that light output decreases as temperature increases—a typical behavior for LEDs. The Relative Forward Voltage vs. Junction Temperature curve shows a negative temperature coefficient, where V_F drops as temperature rises. This can be used for junction temperature estimation in some monitoring circuits. The Wavelength Shift graph shows a slight increase in dominant wavelength (red-shift) with rising temperature.

4.3 Spectral and Radiation Patterns

The Relative Spectral Distribution graph confirms the monochromatic blue emission peak around 468 nm with minimal emission in other wavelengths. The Radiation Pattern diagram visually represents the 120-degree viewing angle, showing a Lambertian-like distribution which is common for this package type, providing wide, uniform illumination.

4.4 Derating and Pulse Operation

The Forward Current Derating Curve is essential for thermal design. It dictates the maximum allowable continuous current based on the temperature at the solder pad (T_S). For instance, at a T_S of 110°C, the maximum current is 30 mA. The Permissible Pulse Handling Capability chart allows designers to understand safe current levels for pulsed operation at various duty cycles and pulse widths, useful for multiplexing or dimming schemes.

5. Mechanical and Package Information

The PLCC-2 package is a industry-standard surface-mount design. The mechanical drawing (implied by the 'Mechanical Dimension' section reference) would typically show the top and side views with critical dimensions such as overall length, width, height, lead spacing, and pad positions. Clear polarity identification (usually a cathode mark via a notch, dot, or cut corner) is essential for correct PCB orientation. The package is designed for compatibility with infrared reflow soldering processes.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The device is rated for a peak reflow temperature of 260°C for a maximum of 30 seconds. A recommended reflow profile would include a preheat stage to gradually raise the temperature and activate flux, a soak zone to ensure uniform heating, a brief peak above the solder liquidus temperature, and a controlled cooling phase. Adherence to this profile prevents thermal shock and ensures reliable solder joints.

6.2 Recommended Solder Pad Layout

The datasheet includes a recommended solder pad footprint. This design optimizes solder fillet formation, provides adequate mechanical strength, and helps with heat dissipation from the device's thermal pad (if present) to the PCB copper. Following this layout is crucial for achieving good soldering yield and long-term reliability.

6.3 Precautions for Use

General precautions include avoiding mechanical stress on the LED lens, preventing exposure to solvents that may damage the plastic, and implementing proper ESD handling procedures during assembly. The device should be stored in a dry, controlled environment and used within its specified ratings.

7. Packaging and Ordering Information

The 'Packaging Information' section details how the LEDs are supplied, typically in tape-and-reel format compatible with automated pick-and-place machines. Key details include reel dimensions, pocket spacing, and orientation within the tape. The 'Part Number' and 'Ordering Information' sections explain the product code structure. The code '65-11-UB0200L-AM' likely encodes information about the package type (PLCC-2), color (Blue), brightness bin, and other variant-specific details, allowing precise specification.

8. Application Recommendations

8.1 Typical Application Scenarios

As listed, primary applications are:
Automotive Interior Lighting: For map lights, door panel lights, or ambient lighting. The AEC-Q101 qualification is mandatory here.
Switches: Backlighting for push-button or rocker switches, requiring consistent color and brightness.
Clusters: Illumination for instrument panel icons or indicators, benefiting from the wide viewing angle.

8.2 Design Considerations

1. Current Drive: Always use a constant current driver or a current-limiting resistor in series with a voltage source to set I_F to the desired value (e.g., 20 mA).
2. Thermal Design: Ensure the PCB has adequate thermal relief, especially if operating at high ambient temperatures or near maximum current. Use the derating curve.
3. Optical Design: The 120° viewing angle may require diffusers or light guides to achieve specific beam patterns or to hide individual LED points in some applications.
4. ESD Protection: While the LED has built-in ESD protection, incorporating additional protection on the PCB input lines is good practice for robustness.

9. Technical Comparison and Differentiation

Compared to generic PLCC-2 blue LEDs, the 65-11-UB0200L-AM differentiates itself through its automotive-grade qualification (AEC-Q101). This involves more rigorous testing for temperature cycling, humidity resistance, and long-term operational life under stress conditions. The specified 8kV ESD rating is also higher than many commercial-grade parts. The detailed binning structure and comprehensive datasheet with extensive characterization graphs provide designers with the predictability needed for high-reliability applications, unlike cheaper parts with minimal specifications.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED with 3.3V directly?
A: Not reliably. The typical V_F is 3.1V, but it can be as high as 3.75V. A 3.3V supply may not overcome the maximum V_F, especially at low temperatures where V_F increases. Always use a current-limiting circuit set for 20mA.

Q: What is the difference between real and electrical thermal resistance?
A: Real thermal resistance (R_{th JS real}) is measured using a physical temperature sensor. Electrical thermal resistance (R_{th JS el}) is calculated using the LED's own forward voltage as a temperature-sensitive parameter. The latter is often lower. For conservative thermal design, use the higher (real) value of 120 K/W.

Q: How do I interpret the luminous intensity binning code?
A: The alphanumeric code (e.g., T1) corresponds to a specific millicandela range. You must specify the required bin when ordering to ensure brightness uniformity. The datasheet provides the full conversion table.

Q: Is this LED suitable for outdoor use?
A: The operating temperature range (-40°C to +110°C) suggests it can handle wide ambient swings. However, for direct outdoor exposure, consider additional protection against UV degradation of the lens and moisture ingress, which are not covered by the standard package.

11. Practical Design Case Study

Scenario: Designing an automotive dashboard button backlight.
Requirements: Uniform blue illumination across 4 buttons, operating from a vehicle's 12V system, stable brightness over a -30°C to 85°C cabin temperature range.
Implementation:
1. LED Selection: Use four 65-11-UB0200L-AM LEDs, all from the same luminous intensity (e.g., T1) and wavelength (e.g., 6771) bins.
2. Circuit Design: Connect the LEDs in series with a current-limiting resistor. Calculate resistor value: R = (V_supply - 4 * V_F) / I_F. Using nominal 12V (vehicle), typical V_F of 3.1V, and I_F of 20mA: R = (12 - 12.4) / 0.02 = Negative value. This shows a series string of 4 is not feasible with 12V. Use 3 LEDs in series or, more commonly, each LED with its own resistor driven from a regulated 5V or 3.3V rail.
3. Thermal Consideration: At 85°C ambient, refer to derating curve. Ensure solder pad temperature is managed via PCB layout.
4. Optical Design: Use a light guide or diffuser film above the LEDs to blend the light from the four discrete sources into a uniform area behind each button symbol.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the active region. This recombination process releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor materials used. For blue LEDs, materials like indium gallium nitride (InGaN) are typically employed. The PLCC-2 package houses the tiny semiconductor chip, provides electrical connections via two leads, and incorporates a molded plastic lens that shapes the light output and protects the chip.

13. Technology Trends

The trend in LEDs for automotive and industrial applications continues towards higher efficiency (more lumens per watt), improved reliability under harsh conditions, and smaller package sizes enabling denser and more flexible designs. There is also a growing emphasis on precise color control and tighter binning to meet the demands of applications like full-color displays and advanced human-machine interfaces. Furthermore, integration of control electronics (e.g., drivers, thermal sensors) within the LED package is an emerging trend, simplifying system design for the end user. The 65-11-UB0200L-AM represents a mature, reliable solution within this evolving landscape, balancing performance, cost, and proven reliability for its target markets.