1. Product Overview
This document details the technical specifications for a high-reliability, surface-mount Ice Blue LED in a PLCC-2 package. Designed primarily for demanding automotive interior applications, this component combines consistent optical performance with robust construction suitable for harsh environments. Its key advantages include qualification to the AEC-Q101 standard for automotive components, compliance with RoHS and REACH environmental directives, and a balanced set of photometric and electrical characteristics. The target market is automotive electronics, specifically for interior ambient lighting, backlighting for switches, indicators, and other human-machine interface elements where reliability and consistent color output are critical.
2. In-Depth Technical Parameter Analysis
2.1 Photometric and Electrical Characteristics
The core performance is defined under a standard test condition of a 10mA forward current (IF). At this current, the typical luminous intensity is 355 millicandelas (mcd), with a minimum of 140 mcd and a maximum of 560 mcd as per the binning structure. The forward voltage (VF) typically measures 3.00V, ranging from 2.75V to 3.75V. The device emits an Ice Blue color, with typical CIE 1931 chromaticity coordinates of x=0.19 and y=0.25. A wide 120-degree viewing angle ensures good visibility from various perspectives. The luminous flux measurement has a tolerance of ±8%, and the chromaticity coordinate tolerance is ±0.005.
2.2 Absolute Maximum Ratings and Thermal Properties
To ensure long-term reliability, the device must not be operated beyond its absolute maximum ratings. The maximum continuous forward current is 20mA, with a power dissipation limit of 75mW. It can withstand a surge current of 300mA for pulses ≤10μs at a low duty cycle. The junction temperature (Tj) must not exceed 125°C. The operational and storage temperature range is specified from -40°C to +110°C, confirming its suitability for automotive environments. Two thermal resistance values are provided: an electrical RthJS(el) of 125 K/W and a real RthJS(real) of 200 K/W, which are crucial for thermal management in the application design.
3. Binning System Explanation
The device output is categorized into bins to ensure consistency within a production lot.
3.1 Luminous Intensity Binning
A detailed binning table defines groups for luminous intensity, ranging from L1 (11.2-14 mcd) up to GA (18000-22400 mcd). The specific part number covered in this datasheet, 57-11-IB0100L-AM, corresponds to bins within the highlighted range in the table, with the typical value of 355 mcd falling into the T1 bin (280-355 mcd). This allows designers to select the appropriate brightness grade for their application.
3.2 Color Binning
The datasheet references a standard Ice Blue color bin structure chart (graphical representation not fully detailed in the provided text). This chart would define the allowable variance in the CIE x and y coordinates to ensure all devices labeled \"Ice Blue\" fall within a visually acceptable color range. The typical coordinates (0.19, 0.25) serve as the nominal target within this defined bin.
4. Performance Curve Analysis
4.1 Forward Current vs. Forward Voltage (IV Curve)
The graph shows the relationship between forward current (IF) and forward voltage (VF) at 25°C. The curve is characteristic of a diode, showing an exponential rise in current once the forward voltage exceeds a threshold (approximately 2.7V). This data is essential for designing the current-limiting circuitry.
4.2 Relative Luminous Intensity vs. Forward Current
This graph demonstrates that the light output increases with forward current, but not necessarily in a perfectly linear fashion, especially as current approaches the maximum rating. It helps designers understand the efficiency trade-off when driving the LED at different current levels.
4.3 Relative Luminous Intensity vs. Junction Temperature
A critical graph for reliability, it shows how light output decreases as the junction temperature increases. At the maximum rated junction temperature of 125°C, the relative luminous intensity is significantly lower than at 25°C. This underscores the importance of effective thermal management to maintain consistent brightness.
4.4 Chromaticity Shift vs. Temperature and Current
Separate graphs plot the shift in CIE x and y coordinates against both junction temperature and forward current. These shifts, while potentially small, are important for applications requiring strict color consistency, as the perceived color of the LED can change with operating conditions.
4.5 Forward Current Derating and Pulse Handling
The derating curve dictates the maximum allowable continuous forward current as a function of the solder pad temperature. For example, at the maximum pad temperature of 110°C, the current must be reduced to 20mA. The pulse handling capability chart defines the permissible surge current for various pulse widths and duty cycles, which is vital for withstanding in-rush currents or pulsed operation schemes.
5. Mechanical and Package Information
The device uses a PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package. This package type offers good mechanical stability and a low profile. The datasheet includes a detailed mechanical dimension drawing (referenced but not fully detailed in the provided text), which specifies the exact length, width, height, lead spacing, and other critical physical dimensions necessary for PCB footprint design.
6. Soldering and Assembly Guidelines
6.1 Recommended Solder Pad Layout
A recommended solder pad pattern is provided to ensure proper solder joint formation, reliable electrical connection, and optimal heat dissipation during operation. Following this layout is crucial for manufacturing yield and long-term reliability.
6.2 Reflow Soldering Profile
The component is rated for reflow soldering with a peak temperature of 260°C for a maximum of 30 seconds. Adherence to a controlled temperature profile (preheat, soak, reflow, cooling) is necessary to prevent thermal shock and damage to the LED die or package.
7. Packaging and Ordering Information
The device is supplied in industry-standard packaging suitable for automated assembly, such as tape and reel. The part number 57-11-IB0100L-AM follows a specific coding system where \"57-11\" likely indicates the package family/size, \"IB\" denotes Ice Blue color, \"0100\" may relate to performance binning, and \"L-AM\" could specify packaging type or other variants. The ordering information section would detail reel quantities, tape width, and orientation.
8. Application Suggestions
8.1 Typical Application Scenarios
The primary application is automotive interior lighting. This includes dashboard backlighting, ambient footwell or console lighting, backlighting for mechanical or capacitive touch switches, gear shift indicators, and various status indicator lights. Its AEC-Q101 qualification makes it suitable for these harsh, temperature-cycling environments.
8.2 Design Considerations
Current Drive: Always use a constant current driver or a current-limiting resistor in series with the LED. The nominal drive current is 10mA, but the circuit should be designed to never exceed the 20mA absolute maximum under any condition, considering tolerances and temperature effects.
Thermal Management: The PCB layout must facilitate heat dissipation. Use the recommended solder pad design, connect thermal vias to internal ground planes if possible, and avoid placing the LED near other heat-generating components. Monitor the solder pad temperature to stay within the derating curve limits.
ESD Protection: While the device has a Human Body Model (HBM) ESD rating of 8kV, standard ESD handling precautions during assembly are still recommended. In sensitive applications, additional external ESD protection on the PCB may be prudent.
Optical Design: The 120° viewing angle provides wide emission. For focused light, secondary optics (lenses, light guides) will be required. The Ice Blue color coordinates should be considered when matching with light guides or diffusers to avoid unwanted color shifts.
9. Technical Comparison and Differentiation
Compared to generic PLCC-2 LEDs, this device's key differentiators are its automotive-grade qualification (AEC-Q101) and compliance with RoHS/REACH. The detailed binning structure for both intensity and color provides higher consistency, which is critical in automotive interiors where multiple LEDs are used in close proximity. The comprehensive set of derating and performance graphs across temperature allows for more robust and predictable design compared to parts specified only at room temperature.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: Can I drive this LED at 20mA continuously?
A: You can, but only if the solder pad temperature is kept at or below 25°C, which is often impractical. You must consult the forward current derating curve (Section 4.5). At a more realistic pad temperature of 80°C, the maximum allowable continuous current is significantly lower than 20mA.
Q: Why is the typical luminous intensity given at 10mA, not the maximum current?
A: 10mA represents a standard test condition that balances good light output with efficiency and longevity. Operating at the absolute maximum current (20mA) increases stress, reduces lifetime, and generates more heat, which in turn reduces light output (as seen in the temperature graphs).
Q: How do I interpret the two different thermal resistance values (125 K/W and 200 K/W)?
A: The electrical thermal resistance (125 K/W) is derived from the temperature-sensitive electrical parameter (the forward voltage). The real thermal resistance (200 K/W) is measured directly via the temperature rise on the case. For worst-case thermal design, the higher value (200 K/W) should be used.
Q: The color coordinates shift with temperature. How significant is this for my application?
A: The graphs in Sections 4.3 and 4.4 quantify this shift. For most general indicator applications, the shift may be negligible. However, for applications where precise color matching between multiple LEDs is critical (e.g., a multi-LED backlight panel), you must ensure all LEDs are at a similar temperature during operation to maintain color uniformity.
11. Practical Design and Usage Case
Scenario: Designing an Automotive Switch Backlight. A cluster of four switches on a center console requires Ice Blue backlighting. The design calls for uniform brightness and color. Implementation: 1) Specify LEDs from the same intensity and color bin (e.g., T1 bin) to minimize initial variation. 2) Drive all LEDs with an identical constant current source set to 8-10mA to ensure matched drive conditions and extend life. 3) Design the PCB layout to provide symmetrical and sufficient copper pour around each LED's solder pads to equalize heat dissipation. 4) Use a light guide or diffuser film designed for the 120° viewing angle to blend the light from the four discrete sources into a single, uniform illuminated area. 5) Validate the design across the full automotive temperature range (-40°C to +85°C ambient) to check for acceptable levels of brightness variation and color shift.
12. Operating Principle Introduction
This is a semiconductor light-emitting diode (LED). When a forward voltage exceeding its bandgap energy is applied across the anode and cathode, electrons and holes recombine within the active region of the semiconductor chip (typically based on InGaN for blue/white colors). This recombination process releases energy in the form of photons (light). The specific composition of the semiconductor layers and phosphors (if used) determines the wavelength, and thus the color, of the emitted light. The PLCC-2 package houses the tiny semiconductor die, provides mechanical protection, incorporates a reflector cup to direct light, and includes a molded plastic lens that shapes the beam and determines the viewing angle.
13. Technology Trends and Context
The LED industry continues to evolve towards higher efficiency (more lumens per watt), improved color rendering, and greater reliability. For automotive interiors, trends include the adoption of smaller package sizes (e.g., chip-scale packages), higher integration (LEDs with built-in drivers or controllers), and the use of advanced materials for better performance at high temperatures. There is also a growing emphasis on precise digital control of color and intensity for dynamic ambient lighting systems. This PLCC-2 LED represents a mature, well-understood, and highly reliable technology that forms the backbone of many current automotive lighting designs, balancing performance, cost, and proven field reliability.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |