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PLCC-2 Ice Blue LED Datasheet - Package 3.2x2.8x1.9mm - Voltage 3.1V - Power 0.031W - English Technical Documentation

Complete technical datasheet for a PLCC-2 packaged Ice Blue LED. Includes detailed specifications, performance graphs, binning information, mechanical dimensions, and application guidelines.
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PDF Document Cover - PLCC-2 Ice Blue LED Datasheet - Package 3.2x2.8x1.9mm - Voltage 3.1V - Power 0.031W - English Technical Documentation

1. Product Overview

This document details the technical specifications for a high-performance, surface-mount Ice Blue LED in a PLCC-2 (Plastic Leaded Chip Carrier) package. Designed primarily for automotive interior applications, this component offers a balance of brightness, reliability, and compact form factor. Its key features include a typical luminous intensity of 355 millicandelas (mcd) at a forward current of 10mA, a wide 120-degree viewing angle, and compliance with stringent automotive and environmental standards such as AEC-Q101, RoHS, and REACH.

1.1 Core Advantages and Target Market

The primary advantages of this LED are its reliability under automotive operating conditions (-40°C to +110°C), its resistance to electrostatic discharge (ESD rated at 8kV HBM), and its moisture sensitivity level (MSL 2), which is suitable for standard surface-mount assembly processes. The target market is firmly within the automotive electronics sector, with typical applications including interior ambient lighting, backlighting for switches and instrument clusters, and status indicators. The Ice Blue color, with typical CIE coordinates of (0.18, 0.23), provides a modern and distinctive visual signature.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The fundamental operating parameters define the LED's performance envelope. The forward current (IF) has a recommended operating range of 2mA to 20mA, with 10mA as the typical test condition. At this current, the typical forward voltage (VF) is 3.1V, with a maximum of 3.75V. The luminous intensity (IV) is specified with a minimum of 140 mcd, a typical of 355 mcd, and a maximum of 560 mcd at IF=10mA. It is critical to note the measurement tolerances: luminous flux (±8%) and forward voltage (±0.05V). The viewing angle, defined as the angle where intensity drops to half its peak value, is 120 degrees with a tolerance of ±5°.

2.2 Absolute Maximum Ratings and Thermal Management

Exceeding the Absolute Maximum Ratings can cause permanent damage. The maximum continuous forward current is 20mA, with a maximum power dissipation of 75mW. The device can withstand a short-duration surge current of 300mA for pulses ≤10μs. The junction temperature (TJ) must not exceed 125°C. Thermal management is crucial; the thermal resistance from the junction to the solder point (RthJS) is a key parameter. The datasheet specifies two values: an electrical equivalent RthJS(el) of 95 K/W and a real RthJS(real) of 120 K/W. Proper PCB layout and heat sinking are necessary to maintain the junction temperature within safe limits, especially when operating near the maximum current.

3. Performance Curve Analysis

3.1 IV Curve and Luminous Efficiency

The graph of Forward Current vs. Forward Voltage shows the characteristic exponential relationship. The voltage increases non-linearly with current, starting around 2.8V at very low currents and reaching approximately 3.3V at 20mA. The Relative Luminous Intensity vs. Forward Current graph indicates that light output is roughly linear with current up to the typical operating point, but efficiency may decrease at higher currents due to increased thermal effects.

3.2 Temperature Dependence

The performance of an LED is significantly affected by temperature. The Relative Luminous Intensity vs. Junction Temperature graph shows that light output decreases as temperature increases. At the maximum operating junction temperature of 125°C, the relative intensity is approximately 40% of its value at 25°C. Conversely, the Relative Forward Voltage vs. Junction Temperature graph shows a negative temperature coefficient; the forward voltage drops by about 0.2V as temperature rises from 25°C to 125°C. The Chromaticity Coordinates Shift graphs show minimal change with current but a more noticeable shift towards green (increase in CIE-y) with increasing temperature.

3.3 Spectral Distribution and Radiation Pattern

The Relative Spectral Distribution graph confirms the Ice Blue color, with a dominant wavelength typically around 470-490nm. The radiation pattern diagram is Lambertian-like, characteristic of a top-view LED with a diffused lens, providing the wide 120-degree viewing angle.

4. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins.

4.1 Luminous Intensity Binning

The luminous intensity is binned using an alphanumeric code (e.g., L1, M2, T1). The bins follow a logarithmic progression, where each step represents approximately a 25% increase in minimum intensity. For this product, the possible output bins are highlighted, with the typical part (355 mcd) falling into the T1 bin (280-355 mcd) or T2 bin (355-450 mcd). Designers must account for this range when designing for minimum brightness requirements.

4.2 Chromaticity Binning

The Ice Blue color is defined within a specific region on the CIE 1931 chromaticity diagram. The datasheet provides a detailed bin structure with codes like CM0, CM1, CL3, etc., each defining a small quadrilateral area of allowed (x, y) coordinates. The typical coordinates (0.18, 0.23) lie within this structure. The tolerance for chromaticity coordinates is ±0.005, ensuring tight color control.

5. Mechanical and Packaging Information

5.1 Physical Dimensions

The LED comes in a standard PLCC-2 surface-mount package. The mechanical drawing specifies the overall dimensions, lead spacing, and lens geometry. Critical dimensions include the package footprint and height, which are essential for PCB layout and clearance checks in the final assembly.

5.2 Recommended Solder Pad Design and Polarity

A recommended solder pad layout is provided to ensure reliable soldering and proper mechanical stability. The pad design accounts for the component's thermal expansion and solder fillet formation. The polarity is clearly marked on the device itself, typically with a cathode indicator (such as a notch or a green mark on the cathode side). The PCB footprint should include a corresponding polarity marking.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The component is rated for reflow soldering with a peak temperature of 260°C for a maximum of 30 seconds. A typical reflow profile should be followed, with controlled preheat, soak, reflow, and cooling phases to minimize thermal shock and ensure proper solder joint formation. The Moisture Sensitivity Level (MSL) is 2, meaning the components must be used within one year of factory sealing if stored at ≤30°C/60% RH, or they must be baked before use if the packaging has been opened or exceeded the floor life.

6.2 Precautions for Use

Key precautions include: avoiding the application of reverse voltage, as the device is not designed for it; using current-limiting resistors in series with the LED to prevent overcurrent; ensuring the maximum junction temperature is not exceeded by considering ambient temperature and thermal resistance; and following proper ESD handling procedures during assembly due to the 8kV HBM sensitivity.

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

In a typical application, the LED is driven by a constant current source or, more commonly, a voltage source with a series current-limiting resistor. The resistor value is calculated using Ohm's Law: R = (Vsupply - VF) / IF. Using the typical VF of 3.1V and a desired IF of 10mA with a 5V supply, the resistor would be (5V - 3.1V) / 0.01A = 190Ω. A standard 200Ω resistor would be suitable. For PWM dimming, ensure the frequency is high enough (typically >100Hz) to avoid visible flicker.

7.2 Design for Automotive Environment

For automotive interiors, consider the wide operating temperature range. The forward current derating curve is essential: as the solder pad temperature increases, the maximum allowable continuous current decreases. For example, at the maximum solder pad temperature of 110°C, the maximum current is 20mA. Designers should operate below this curve for enhanced reliability. Also, consider potential voltage transients in the vehicle's electrical system and implement appropriate protection circuitry if necessary.

8. Technical Comparison and FAQs

8.1 Differentiation from Similar Products

Compared to generic PLCC-2 LEDs, this product's key differentiators are its AEC-Q101 qualification for automotive use, its specific Ice Blue chromaticity binning, and its detailed characterization over temperature and current. The 8kV ESD rating and MSL 2 level also indicate a robustness suited for automated, high-reliability manufacturing environments.

8.2 Frequently Asked Questions

Q: Can I drive this LED at 20mA continuously?
A: Yes, but only if the solder pad temperature (TS) is kept at or below 25°C, as per the derating curve. In most practical applications with elevated ambient temperatures, you should derate the current. For reliable long-term operation, designing for IF = 10mA or lower is recommended.

Q: What is the difference between RthJS(el) and RthJS(real)?
A: RthJS(el) is derived from electrical measurements (the change in forward voltage with power), while RthJS(real) is measured directly using a thermal sensor. For accurate thermal modeling, especially at higher currents, the RthJS(real) value of 120 K/W should be used.

Q: How do I interpret the binning codes when ordering?
A: The part number includes codes for intensity and color bins. You must specify the required bins based on your application's brightness and color uniformity requirements. If not specified, the manufacturer will supply parts from standard bins.

9. Practical Design Case Study

Consider designing an automotive gear shift indicator backlight using this LED. The requirement is for uniform Ice Blue illumination across four symbols. The design steps would involve: 1) Determining the required luminous intensity per LED based on light guide efficiency and desired panel brightness, likely selecting LEDs from a specific intensity bin (e.g., T1 or T2). 2) Designing a constant-current driver circuit capable of operating from the vehicle's 12V system, compensating for load dump transients. 3) Creating a PCB layout with the recommended solder pads, ensuring adequate thermal relief and trace width for the drive current. 4) Implementing PWM dimming controlled by the vehicle's CAN bus to adjust brightness based on ambient light conditions. 5) Validating color uniformity by specifying a tight chromaticity bin (e.g., CM2/CL4) for all LEDs in the assembly.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.