Table of Contents
- 1. Product Overview
- 2. In-Depth Technical Parameter Analysis
- 2.1 Photometric and Electrical Characteristics
- 2.2 Absolute Maximum Ratings and Thermal Management
- 2.3 Reliability and Compliance Specifications
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 IV Curve and Spectral Distribution
- 4.2 Temperature Dependence Analysis
- 4.3 Current Dependence and Pulsed Operation
- 5. Mechanical, Assembly, and Packaging
- 5.1 Physical Dimensions and Polarity
- 5.2 Soldering and Assembly Guidelines
- 5.3 Packaging Information
- 6. Application Notes and Design Considerations
- 6.1 Typical Application Scenarios
- 6.2 Critical Design Considerations
- 7. Technical Comparison and Differentiation
- 8. Frequently Asked Questions (Based on Technical Parameters)
- 9. Operational Principles and Context
- 10. Industry Trends and Design Case Example
- 10.1 Relevant Technology Trends
- 10.2 Hypothetical Design Case Study: Dashboard Switch Backlighting
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This document provides the complete technical specifications for a high-reliability, surface-mount red LED in a PLCC-2 package with a 1608 footprint (1.6mm x 0.8mm). The device is specifically engineered for demanding automotive interior lighting applications, offering a balance of performance, reliability, and compact size.
The core advantages of this LED include its qualification to the stringent AEC-Q102 standard for discrete optoelectronic devices in automotive applications, ensuring performance under harsh environmental conditions. It features a typical luminous intensity of 350 millicandelas (mcd) at a standard drive current of 10mA, with a wide 120-degree viewing angle for uniform illumination. The product is compliant with key environmental regulations including RoHS, REACH, and is halogen-free, making it suitable for modern electronic assemblies with strict material requirements.
The target market is primarily automotive electronics manufacturers requiring reliable, compact light sources for dashboard backlighting, switch illumination, ambient lighting, and other interior features where consistent color and long-term performance are critical.
2. In-Depth Technical Parameter Analysis
2.1 Photometric and Electrical Characteristics
The key operating parameters define the LED's performance under standard conditions (Ts = 25°C). The forward current (IF) has an absolute maximum rating of 20mA, with a typical operating point of 10mA. At this current, the typical forward voltage (VF) is 2.1V, with a range from 1.5V (Min) to 2.5V (Max). This parameter is crucial for driver circuit design and power dissipation calculations.
The primary photometric output is defined by Luminous Intensity (IV), with a typical value of 350 mcd at IF=10mA, ranging from 280 mcd (Min) to 450 mcd (Max). The dominant wavelength (λd) is typically 617nm, defining the shade of red, with a range from 612nm to 621nm. The wide 120-degree viewing angle (φ) ensures broad, even light distribution, which is essential for area illumination tasks in automotive interiors.
2.2 Absolute Maximum Ratings and Thermal Management
Adherence to Absolute Maximum Ratings is essential for device longevity. The maximum continuous forward current is 20mA, with a maximum power dissipation (Pd) of 50mW. For pulsed operation, a surge current (IFM) of 50mA is permissible under specific conditions (t ≤ 10μs, duty cycle D=0.005). The device is not designed for reverse bias operation.
Thermal management is critical. The maximum operating junction temperature (TJ) is 125°C, with an ambient operating temperature (Topr) range of -40°C to +110°C. Two thermal resistance values are provided: the real thermal resistance from junction to solder point (Rth JS real) is 150 K/W, while the electrical method-derived value (Rth JS el) is 120 K/W. These values are key for calculating the junction temperature rise under given operating conditions and ensuring it remains within safe limits. The forward current derating curve clearly shows that the maximum allowable current must be reduced as the solder pad temperature increases above 25°C.
2.3 Reliability and Compliance Specifications
This LED meets several industry standards for reliability and environmental safety. It is qualified to AEC-Q102, the automotive-grade standard for discrete optoelectronics. It achieves Corrosion Robustness Class B1, indicating a specific level of resistance to corrosive gases. The Electrostatic Discharge (ESD) sensitivity, tested per Human Body Model (HBM) with R=1.5kΩ and C=100pF, is rated at 2kV. The Moisture Sensitivity Level (MSL) is 3, dictating specific handling and baking requirements before reflow soldering. The device is also compliant with RoHS, EU REACH, and is Halogen-Free (Br <900ppm, Cl <900ppm, Br+Cl < 1500ppm).
3. Binning System Explanation
The manufacturer employs a comprehensive binning system to categorize LEDs based on key performance variations, allowing designers to select parts that meet precise application requirements.
3.1 Luminous Intensity Binning
Luminous intensity is sorted into groups labeled Q through B, with each group containing sub-bins X, Y, and Z representing ascending intensity ranges. For this specific part number (1608-UR0100M-AM), the possible output bins are highlighted and fall within the T group, corresponding to a luminous intensity range of 280 mcd to 450 mcd at IF=10mA. This aligns with the typical value of 350 mcd stated in the characteristics table.
3.2 Dominant Wavelength Binning
Dominant wavelength, which correlates with perceived color, is binned with high precision. Bins are defined by 3nm or 4nm ranges (e.g., 612-615nm, 615-618nm). The highlighted bin for this product is 612-621nm, which matches the characteristic table's range of 612nm (Min) to 621nm (Max) with a typical of 617nm. This tight control ensures consistent color appearance across production batches.
3.3 Forward Voltage Binning
Forward voltage is binned in 0.25V steps (e.g., 2.00-2.25V, 2.25-2.50V). The typical VF of 2.1V suggests the part likely falls into the 2.00-2.25V bin. Knowing the voltage bin helps in designing efficient current driver circuits and managing power distribution in multi-LED arrays.
4. Performance Curve Analysis
4.1 IV Curve and Spectral Distribution
The Forward Current vs. Forward Voltage graph shows the classic exponential relationship of a diode. The curve allows designers to determine the exact voltage drop for any given drive current within the operating range, which is vital for precise driver design. The Relative Spectral Distribution graph confirms the monochromatic red output, with a peak in the ~617nm region and minimal emission outside the red spectrum.
4.2 Temperature Dependence Analysis
Several graphs detail the LED's behavior across temperature. The Relative Luminous Intensity vs. Junction Temperature curve shows that light output decreases as temperature increases—a typical behavior for LEDs. Designers must account for this derating in applications with high ambient temperatures. Conversely, the Relative Forward Voltage vs. Junction Temperature curve shows VF decreases linearly with increasing temperature, which can be used for crude temperature sensing. The Dominant Wavelength vs. Junction Temperature plot indicates a slight redshift (increase in wavelength) as temperature rises, which is important for color-critical applications.
4.3 Current Dependence and Pulsed Operation
The Relative Luminous Intensity vs. Forward Current graph is nearly linear in the lower current range, showing good efficiency. The Dominant Wavelength vs. Forward Current graph shows minimal shift with current, indicating stable color. The Permissible Pulse Handling Capability chart is essential for designers using pulsed driving schemes (e.g., for dimming or multiplexing), defining the maximum allowable pulse current for various pulse widths and duty cycles.
5. Mechanical, Assembly, and Packaging
5.1 Physical Dimensions and Polarity
The mechanical drawing specifies the exact dimensions of the 1608 PLCC-2 package. Key measurements include the overall length (1.6mm ±0.1mm), width (0.8mm ±0.1mm), and height. The drawing clearly indicates the cathode and anode terminals, which is critical for correct PCB orientation. The recommended soldering pad layout is provided to ensure a reliable solder joint and proper thermal relief during reflow.
5.2 Soldering and Assembly Guidelines
A detailed reflow soldering profile is specified, with a peak temperature of 260°C for a maximum of 30 seconds. Following this profile is mandatory to prevent thermal damage to the LED package or the internal die attach. General precautions for use include standard ESD handling procedures, avoiding mechanical stress on the lens, and not exceeding the absolute maximum ratings.
5.3 Packaging Information
The LEDs are supplied on tape and reel for automated assembly. The packaging specification includes details on reel dimensions, tape width, pocket spacing, and orientation of the devices within the tape. This information is necessary for configuring pick-and-place machines in the production line.
6. Application Notes and Design Considerations
6.1 Typical Application Scenarios
The primary application is Automotive Interior Lighting. This encompasses a wide range of uses such as: instrument cluster backlighting, center stack display illumination, button and switch backlighting, footwell lighting, door handle/pocket lighting, and general ambient accent lighting. The AEC-Q102 qualification and wide operating temperature range make it suitable for these harsh environments.
6.2 Critical Design Considerations
- Current Driving: Always use a constant current driver or a current-limiting resistor in series with a voltage source. The nominal drive current is 10mA, but it can be operated from 2mA to 20mA as per the characteristics.
- Thermal Design: Use the thermal resistance values and derating curves to calculate the expected junction temperature in the application. Ensure adequate PCB copper area (using the recommended pad design) to act as a heat sink and keep TJ below 125°C.
- Optical Design: The 120° viewing angle provides wide dispersion. For focused light, secondary optics (lenses) may be required. Consider the potential for color shift (wavelength vs. temperature/current) in color-sensitive applications.
- ESD Protection: Implement standard ESD protection measures during handling and assembly, as the device is rated for 2kV HBM.
7. Technical Comparison and Differentiation
Compared to standard commercial-grade PLCC-2 LEDs, this device's key differentiators are its automotive-grade reliability certifications (AEC-Q102, Corrosion Class B1) and its extended operating temperature range (-40°C to +110°C). The typical luminous intensity of 350mcd is competitive for its package size. The comprehensive binning structure offers better consistency for high-volume production compared to unbinned or loosely binned parts. The inclusion of sulfur resistance criteria (implied by the sulfur test section) is another feature critical for automotive and industrial environments where atmospheric sulfur can corrode silver-plated components.
8. Frequently Asked Questions (Based on Technical Parameters)
Q: Can I drive this LED at 20mA continuously?
A: Yes, 20mA is the Absolute Maximum Rating for continuous forward current. However, you must ensure the junction temperature does not exceed 125°C. Refer to the forward current derating curve; at the maximum operating ambient of 110°C, the maximum allowed current is 20mA, but this assumes perfect heat sinking. In practice, driving at the typical 10mA is recommended for optimal lifetime and efficiency.
Q: What is the difference between real and electrical thermal resistance?
A: The real thermal resistance (150 K/W) is measured using a physical temperature sensing method. The electrical thermal resistance (120 K/W) is derived from the change in forward voltage with temperature, which is a convenient in-situ measurement technique. For conservative thermal design, use the higher (real) value.
Q: How do I interpret the binning codes for ordering?
A: The part number 1608-UR0100M-AM likely includes fixed bin selections for intensity (T group), wavelength (~617nm bin), and voltage. For custom bins, you would need to consult the manufacturer's full ordering guide, which would use additional suffix codes to specify the desired Luminous Intensity (e.g., TY), Dominant Wavelength (e.g., 1821), and Forward Voltage (e.g., 2022) bins.
Q: Is a current-limiting resistor necessary?
A> Yes, when using a voltage source (e.g., a 5V or 12V automotive rail), a series resistor is mandatory to set the operating current. The value is calculated using Ohm's Law: R = (Vsupply - VF) / IF. Use the maximum VF from the datasheet (2.5V) for a conservative design that ensures IF never exceeds the maximum under all conditions.
9. Operational Principles and Context
This device is a Light Emitting Diode (LED), a semiconductor p-n junction that emits light through electroluminescence. When a forward voltage exceeding the diode's built-in potential is applied, electrons and holes recombine in the active region, releasing energy in the form of photons. The specific material composition of the semiconductor layers determines the wavelength (color) of the emitted light; in this case, a red-emitting material. The PLCC-2 (Plastic Leaded Chip Carrier) package houses the tiny semiconductor die, provides electrical connections via two leads, and incorporates a molded plastic lens that shapes the light output to achieve the 120-degree viewing angle. The package also serves to protect the die from mechanical and environmental damage.
10. Industry Trends and Design Case Example
10.1 Relevant Technology Trends
The trend in automotive interior lighting is towards higher integration, smarter control, and personalized ambient experiences. This drives demand for reliable, compact LEDs like this 1608 PLCC-2 device. There is a growing use of multi-color and addressable LED arrays for dynamic lighting scenarios. While this is a single-color red LED, the underlying packaging and reliability technology is foundational. Furthermore, the push for higher efficiency (more lumens per watt) and tighter color consistency (smaller binning ranges) continues across the industry, alongside demands for even higher temperature ratings and robustness against new environmental stressors.
10.2 Hypothetical Design Case Study: Dashboard Switch Backlighting
Scenario: Designing backlighting for a set of 10 push-button switches on an automotive center console.
Requirements: Uniform red illumination, operable from -40°C to +85°C (local ambient near console), powered from the vehicle's 12V system.
Design Steps:
1. LED Selection: This 1608-UR0100M-AM LED is suitable due to its color, size, AEC-Q102 rating, and temperature range.
2. Optical Design: The 120° viewing angle is adequate to evenly light a switch cap with a light guide or diffuser.
3. Electrical Design: For a 12V supply and a target current of 10mA per LED. Using the maximum VF of 2.5V for safety: R = (12V - 2.5V) / 0.01A = 950Ω. A standard 1kΩ resistor would yield IF ≈ (12V-2.1V)/1000Ω = 9.9mA, which is acceptable. Ten identical circuits would be used.
4. Thermal Analysis: With 10mW per LED (10mA * 2.1V) and assuming moderate PCB copper, the temperature rise will be minimal, keeping TJ well within limits.
5. Result: A reliable, automotive-grade backlighting solution meeting all specifications.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |