PLCC-2 Super Red LED 0201H Datasheet - Package 3.2x2.8x1.9mm - Voltage 2.0V - Power 40mW - English Technical Document

1. Product Overview

This document details the specifications for a high-brightness Super Red Light Emitting Diode (LED) in a PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package. The primary design focus is reliability and performance for demanding automotive environments, both interior and exterior. The device offers a typical luminous intensity of 800 millicandelas (mcd) at a standard drive current of 20mA, with a wide 120-degree viewing angle.

1.1 Core Advantages & Target Market

The LED's core advantages stem from its automotive-grade qualifications and robust construction. It is qualified to the AEC-Q102 standard, ensuring reliability for automotive electronic components. It also features sulfur robustness classified as A1, protecting against corrosion in environments with sulfur-containing gases. Compliance with RoHS, REACH, and Halogen-Free directives makes it suitable for global markets with strict environmental regulations. The primary target market is automotive lighting, specifically:

• Automotive Interior Lighting: Dashboard backlighting, switch illumination, ambient lighting, and infotainment system indicators.
• Automotive Exterior Lighting: Center High-Mount Stop Lights (CHMSL), side marker lights, and other signal lighting applications requiring high visibility and reliability.

2. In-Depth Technical Parameter Analysis

2.1 Photometric & Optical Characteristics

The key optical parameters define the light output and color of the LED. Under typical conditions (IF=20mA, Ts=25°C), the luminous intensity (Iv) has a nominal value of 800 mcd, with a minimum of 560 mcd and a maximum of 1400 mcd depending on the production bin. The dominant wavelength (λd), which defines the perceived color, ranges from 627 nm to 639 nm, placing it firmly in the Super Red spectrum. The wide viewing angle of 120 degrees (half-intensity angle) ensures good visibility over a broad area, which is crucial for signaling applications.

2.2 Electrical Characteristics

The forward voltage (VF) is a critical parameter for circuit design. At 20mA, the typical VF is 2.00V, with a range from 1.75V to 2.75V. Designers must account for this variance when designing current-limiting circuits to ensure consistent light output. The absolute maximum forward current (IF) is 50 mA in continuous operation, with a surge current (IFM) capability of 100 mA for pulses ≤10μs. The device is not designed for reverse bias operation.

2.3 Thermal Characteristics

Thermal management is essential for LED longevity and performance stability. The thermal resistance from the junction to the solder point (Rth JS) is given as two values: a 'real' measurement of 120 K/W (max 160 K/W) and an 'electrical' measurement of 100 K/W (max 120 K/W). This parameter indicates how effectively heat is transferred from the semiconductor junction to the PCB. A lower value is better. The maximum permissible junction temperature (Tj) is 125°C. The operating temperature range is from -40°C to +110°C, suitable for the harsh under-hood or exterior automotive environment.

3. Binning System Explanation

Due to manufacturing variations, LEDs are sorted into performance bins. This allows designers to select parts with consistent characteristics.

3.1 Luminous Intensity Binning

LEDs are grouped by their light output at the typical test current. Bins range from U2 (560-710 mcd) to AA (1120-1400 mcd). The part number suffix 'H' indicates this device belongs to a 'High' brightness bin, which would typically correspond to the V1, V2, or AA groups.

3.2 Dominant Wavelength Binning

The color (wavelength) is binned in 3-nanometer steps, from 2730 (627-630 nm) to 3639 (636-639 nm). This ensures color consistency within a production batch for applications where uniform appearance is critical.

3.3 Forward Voltage Binning

Forward voltage is binned in steps of 0.25V approximately, from code 1720 (1.75-2.00V) to 2527 (2.50-2.75V). Selecting LEDs from the same VF bin can simplify power supply design and ensure uniform current distribution in parallel arrays.

4. Performance Curve Analysis

4.1 IV Curve & Relative Intensity

The Forward Current vs. Forward Voltage graph shows a classic diode exponential relationship. The Relative Luminous Intensity vs. Forward Current curve is sub-linear; increasing current above 20mA yields diminishing returns in light output while generating more heat.

4.2 Temperature Dependence

The performance graphs clearly show temperature effects. The Relative Luminous Intensity vs. Junction Temperature curve indicates light output decreases as temperature increases, a typical behavior for LEDs. The Relative Forward Voltage vs. Junction Temperature has a negative coefficient, meaning VF drops as temperature rises, which can be used for temperature sensing. The Dominant Wavelength also shifts with temperature, typically towards longer wavelengths (red shift) as shown in the graph.

4.3 Spectral Distribution & Derating

The Relative Spectral Distribution graph shows a narrow peak in the red region (~630nm). The Forward Current Derating Curve is crucial for design: as the junction temperature rises, the maximum allowable continuous current decreases. For example, at the maximum operating junction temperature of 110°C, the forward current must be derated to approximately 34 mA.

5. Mechanical & Package Information

5.1 Physical Dimensions

The LED uses a standard PLCC-2 package. The mechanical drawing (implied by section 7) would show key dimensions including overall length, width, height, lead spacing, and the size of the cavity containing the LED chip. The package is designed for automated pick-and-place assembly.

5.2 Polarity Identification & Pad Design

The part number includes 'R' for reverse polarity. The recommended soldering pad layout (section 8) is provided to ensure a reliable solder joint and proper thermal connection to the PCB. Correct polarity orientation is vital, usually indicated by a marking on the package or an asymmetric feature.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

A recommended reflow soldering profile is provided (section 9). The LED can withstand a peak soldering temperature of 260°C for up to 30 seconds, which is compatible with standard lead-free (SnAgCu) solder processes. Adhering to this profile prevents thermal damage to the plastic package and the internal wire bonds.

6.2 Precautions for Use

General precautions include: avoiding operation beyond absolute maximum ratings, using appropriate ESD handling procedures (HBM rating is 2kV), and ensuring the device is stored within its specified temperature and humidity range (MSL 2).

7. Packaging & Ordering Information

7.1 Packaging Specifications

Packaging information (section 10) details how the components are supplied, typically on embossed tape and reel for high-volume assembly. The reel dimensions, tape width, and component orientation are specified to be compatible with standard automated equipment.

7.2 Part Numbering System

The part number 67-21R-SR0201H-AM is decoded as follows: 67-21 = Product Family; R = Reverse Polarity; SR = Super Red Color; 020 = 20mA Test Current; 1 = Lead Frame Type; H = High Brightness Level; AM = Automotive Application.

8. Application Design Suggestions

8.1 Typical Circuit Design

For stable operation, a constant-current driver is recommended over a simple series resistor, especially in automotive environments where the supply voltage (e.g., 12V) can vary significantly. The driver should be designed to limit the current to the desired value (e.g., 20mA) based on the maximum VF from the selected bin to ensure no LED is overdriven.

8.2 Thermal Management Considerations

To maintain performance and longevity, ensure adequate PCB copper area (thermal pad) is connected to the LED's thermal pad to dissipate heat. Use the thermal resistance (Rth JS) and the power dissipation (Pd = VF * IF) to calculate the expected temperature rise. Keep the junction temperature well below the 125°C maximum, ideally below 85°C for long life.

8.3 Optical Integration

The 120-degree viewing angle may require secondary optics (lenses, light guides) for applications needing a focused beam or specific light pattern. The Super Red color is ideal for brake and warning signals due to its high visual impact and regulatory compliance.

9. Technical Comparison & Differentiation

Compared to standard commercial-grade LEDs, this device's key differentiators are its AEC-Q102 qualification and sulfur robustness. These are not typically tested or guaranteed in consumer parts. The wide operating temperature range (-40°C to +110°C) also exceeds that of common LEDs. The PLCC-2 package offers a good balance of size, solderability, and thermal performance compared to smaller chip-scale packages or larger through-hole designs.

10. Frequently Asked Questions (FAQ)

Q: What is the difference between 'real' and 'electrical' thermal resistance?

A: 'Real' thermal resistance is measured using a physical temperature sensor. 'Electrical' thermal resistance is calculated by measuring the change in forward voltage with power, using the LED's intrinsic temperature-sensitive parameter. The electrical method is often used for specification.

Q: Can I drive this LED at 50mA continuously?

A: While the absolute maximum rating is 50mA, continuous operation at this current will generate significant heat (Pd ~ 100mW). You must use the derating curve and thermal calculations to ensure the junction temperature does not exceed 125°C. For reliable long-term operation, driving at or below the typical 20mA is recommended.

Q: What does MSL 2 mean?

A: Moisture Sensitivity Level 2. The component can be stored in a factory environment (≤30°C/60% RH) for up to one year before it requires baking prior to reflow soldering.

11. Design-in Case Study Example

Scenario: Designing a CHMSL (Center High-Mount Stop Light) requiring high brightness and reliability.

Selection: This Super Red LED in the 'H' (High) brightness bin is chosen for its intensity and automotive-grade reliability.

Circuit: An array of LEDs is designed with a constant-current buck driver IC, set to deliver 20mA per LED. The driver input handles the vehicle's 12V nominal (with load-dump transients suppressed).

Thermal: The PCB uses a 2-oz copper layer with a filled thermal via pattern under each LED's pad to spread heat to a larger board area, keeping the calculated Tj below 90°C in the hottest ambient condition.

Optical: A red-tinted polycarbonate lens with a specific prism pattern is placed over the array to meet the required photometric distribution for a stop light.

12. Operating Principle Introduction

An LED is a semiconductor p-n junction diode. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region recombine in the junction's active region. This recombination releases energy in the form of photons (light). The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor materials used (e.g., AlInGaP for red/orange/amber). The PLCC package encapsulates the tiny semiconductor chip, provides mechanical protection, incorporates a reflector cup to direct light, and includes a molded epoxy lens that also acts as a primary optical element.

13. Technology Trends & Context

The trend in automotive lighting is towards higher efficiency, greater integration, and smarter functions. While this is a discrete LED, the underlying technology is foundational. There is a continuous drive for higher luminous efficacy (more light output per watt of electrical input) to reduce energy consumption and thermal load. For red light, AlInGaP technology is mature and efficient. The push for miniaturization continues, but the PLCC-2 package remains popular due to its excellent balance of performance, cost, and manufacturability for many applications. The integration of LEDs with driver ICs and sensors into modular 'light engine' units is a growing trend for advanced lighting systems.