Table of Contents
- 1. Product Overview
- 2. In-Depth Technical Parameter Analysis
- 2.1 Photometric and Color Characteristics
- 2.2 Electrical Parameters
- 2.3 Thermal and Reliability Ratings
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Chromaticity (Color) Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 Forward Current vs. Forward Voltage (IV Curve)
- 4.2 Relative Luminous Intensity vs. Forward Current
- 4.3 Relative Luminous Intensity vs. Junction Temperature
- 4.4 Chromaticity Shift vs. Junction Temperature and Current
- 4.5 Forward Current Derating Curve
- 4.6 Spectral Distribution
- 5. Mechanical and Package Information
- 5.1 Package Type and Dimensions
- 5.2 Recommended Soldering Pad Layout
- 5.3 Polarity Identification
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Precautions for Use
- 6.3 Storage Conditions
- 7. Packaging and Ordering Information
- 7.1 Packaging Specifications
- 7.2 Part Number and Ordering Code
- 8. Application Notes and Design Considerations
- 8.1 Typical Application Circuits
- 8.2 Thermal Management Design
- 8.3 Optical Design Considerations
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (FAQ)
- 11. Practical Design and Usage Case
- 12. Technical Principle Introduction
- 13. Industry Trends and Developments
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This document details the specifications for a high-performance, surface-mount Phosphor Converted Amber (PCA) LED in a PLCC-4 package. Designed primarily for demanding automotive interior lighting applications, this component combines high luminous output with robust environmental and reliability qualifications. Its key positioning lies in providing a reliable, amber-colored light source where consistent color, long-term stability, and compliance with automotive standards are critical.
The core advantages of this LED include its high typical luminous intensity of 3400 millicandelas (mcd) at a standard drive current of 60mA, a wide 120-degree viewing angle for uniform illumination, and built-in protection against electrostatic discharge (ESD) up to 8kV (Human Body Model). Furthermore, it is qualified to the AEC-Q102 standard for discrete optoelectronic semiconductors in automotive applications, ensuring it meets stringent quality and reliability requirements for use in vehicles.
The target market is exclusively automotive interior lighting. This includes applications such as dashboard backlighting, switch illumination, ambient lighting, and indicator lights within the vehicle cabin. The product's compliance with RoHS, REACH, and halogen-free directives also makes it suitable for global markets with strict environmental regulations.
2. In-Depth Technical Parameter Analysis
2.1 Photometric and Color Characteristics
The primary photometric parameter is the Luminous Intensity (Iv), which has a typical value of 3400 mcd when driven at 60mA. The specification allows for a minimum of 2800 mcd and a maximum of 5600 mcd, indicating potential binning variations. The measurement tolerance for luminous flux is \u00b18%. The LED emits a Phosphor Converted Amber (Yellow) light. The typical chromaticity coordinates on the CIE 1931 color space are x=0.57 and y=0.42, with a specified tolerance of \u00b10.005. This defines a specific shade of amber/yellow. The viewing angle, defined as the full angle where intensity drops to half of its peak value, is 120 degrees with a tolerance of \u00b15 degrees.
2.2 Electrical Parameters
The forward voltage (Vf) is a key electrical parameter. At the typical operating current of 60mA, the Vf is 3.1V, with a range from 2.75V (Min) to 3.75V (Max). This parameter is subject to binning. The absolute maximum forward current (IF) is 80mA, while the device can handle surge currents (t<=10\u00b5s) up to 250mA. The LED is not designed for reverse bias operation. Power dissipation (Pd) is rated at a maximum of 300mW.
2.3 Thermal and Reliability Ratings
Thermal management is crucial for LED performance and lifetime. The thermal resistance from the junction to the solder point is specified with two values: an electrical measurement (Rth JS el) of 100 K/W max and a real measurement (Rth JS real) of 150 K/W max. The maximum permissible junction temperature (Tj) is 125\u00b0C. The operating temperature range (Topr) is from -40\u00b0C to +110\u00b0C, which is standard for automotive components. The device can withstand a reflow soldering temperature of 260\u00b0C for 30 seconds. It also features sulfur robustness rated at A1 level, protecting against corrosion in environments with sulfur-containing gases.
3. Binning System Explanation
To ensure consistency in production, LEDs are sorted into bins based on key parameters. This datasheet outlines bins for Luminous Intensity, Chromaticity, and Forward Voltage.
3.1 Luminous Intensity Binning
The luminous intensity is binned using an alphanumeric code system (e.g., L1, L2, M1... up to GA). Each bin covers a specific range of minimum and maximum luminous intensity in millicandelas (mcd). For this specific product, the possible output bins are highlighted, indicating which intensity ranges are available for order. The typical value of 3400 mcd falls within the "CA" bin (2800 to 3550 mcd).
3.2 Chromaticity (Color) Binning
For the Phosphor Converted Amber color, a specific bin structure is defined. The bin codes are YA and YB. Each code is associated with a set of three CIE (x, y) coordinate pairs that form a triangle on the color chart. LEDs whose color coordinates fall within these triangles are assigned the corresponding bin code. The typical coordinates (0.57, 0.42) are central to this structure, and the measurement allowance is \u00b10.005.
3.3 Forward Voltage Binning
The datasheet includes a section for Forward Voltage Bins, listing bin codes with their corresponding minimum and maximum forward voltage ranges. This allows designers to select LEDs with tighter Vf tolerances if required for their circuit design, helping to manage current distribution in multi-LED arrays.
4. Performance Curve Analysis
The provided graphs offer deep insight into the LED's behavior under different operating conditions.
4.1 Forward Current vs. Forward Voltage (IV Curve)
This graph shows the exponential relationship between forward current (IF) and forward voltage (VF) at 25\u00b0C. It is essential for designing the current-limiting circuitry. The curve allows designers to estimate the voltage drop across the LED at any given current within its operating range.
4.2 Relative Luminous Intensity vs. Forward Current
This graph demonstrates how light output increases with drive current. It typically shows a sub-linear relationship, where efficiency may decrease at very high currents. It helps in selecting the optimal drive current for the desired brightness while considering efficacy and thermal load.
4.3 Relative Luminous Intensity vs. Junction Temperature
This critical graph shows the reduction in light output as the LED's junction temperature increases. The intensity is normalized to its value at 25\u00b0C. It highlights the importance of thermal management; as Tj rises, light output falls. This is a key factor in lumen maintenance and long-term reliability.
4.4 Chromaticity Shift vs. Junction Temperature and Current
These graphs plot the change in CIE x and y coordinates (\u0394CIE-x, \u0394CIE-y) as a function of junction temperature (at constant current) and forward current (at constant temperature). They quantify the color stability of the LED. Minimal shift is desirable for applications requiring consistent color over varying operating conditions.
4.5 Forward Current Derating Curve
This is a vital graph for reliable operation. It shows the maximum allowable continuous forward current as a function of the solder pad temperature (Ts). As Ts increases, the maximum permissible current must be reduced to prevent exceeding the 125\u00b0C junction temperature limit. For example, at Ts=110\u00b0C, the maximum current is only 31mA. It also specifies a minimum operating current of 8mA.
4.6 Spectral Distribution
The relative spectral distribution graph shows the intensity of light emitted across different wavelengths. For a phosphor-converted amber LED, this typically shows a broad peak in the yellow/amber region of the spectrum, resulting from the phosphor's emission, with potentially a small remnant peak from the blue or UV pump LED chip.
5. Mechanical and Package Information
5.1 Package Type and Dimensions
The LED uses a PLCC-4 (Plastic Leaded Chip Carrier, 4 leads) surface-mount package. The mechanical drawing provides exact dimensions for the package body, lead spacing, and overall height. This information is critical for PCB footprint design, ensuring proper fit and soldering.
5.2 Recommended Soldering Pad Layout
A diagram of the recommended PCB land pattern (solder pad) is provided. This includes the dimensions and spacing for the four electrical pads and the central thermal pad (if present). Following this layout ensures good solder joint formation, proper thermal conduction to the PCB, and mechanical stability.
5.3 Polarity Identification
The datasheet indicates how to identify the anode and cathode pins. This is usually done via a marking on the package (like a dot, notch, or cut corner) or by the pinout diagram. Correct polarity is essential for circuit operation.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
A detailed reflow soldering temperature profile is specified. This graph plots temperature against time, defining key zones: preheat, soak, reflow (with peak temperature of 260\u00b0C max for 30 seconds), and cooling. Adhering to this profile prevents thermal damage to the LED package and internal die.
6.2 Precautions for Use
General handling and usage precautions are listed. These include warnings about avoiding mechanical stress on the lens, protecting the device from excessive electrostatic discharge (ESD) during handling (even though it has 8kV HBM protection), and ensuring the operating conditions (current, temperature) remain within the absolute maximum ratings.
6.3 Storage Conditions
The storage temperature range (Tstg) is specified as -40\u00b0C to +110\u00b0C. The Moisture Sensitivity Level (MSL) is rated at Level 3. This means the packaged devices can be exposed to factory floor conditions (30\u00b0C/60%RH) for up to 168 hours before they must be baked prior to reflow soldering, to prevent "popcorning" or package cracking due to moisture vaporization.
7. Packaging and Ordering Information
7.1 Packaging Specifications
Details on how the LEDs are supplied are provided, typically in tape-and-reel format compatible with automated pick-and-place machines. The packaging information includes reel dimensions, tape width, pocket spacing, and orientation of the components on the tape.
7.2 Part Number and Ordering Code
The part number system is explained. The base part number is 67-41-PA0601H-AM. Variations in this number likely correspond to different bins for luminous intensity (Iv), forward voltage (Vf), and chromaticity (Color). The ordering information section clarifies how to specify the desired bins when placing an order.
8. Application Notes and Design Considerations
8.1 Typical Application Circuits
For a constant current drive, which is recommended for LEDs, a simple circuit involves a current-limiting resistor in series with the LED. The resistor value is calculated as R = (Vsupply - Vf_LED) / I_desired. Given Vf typ = 3.1V at 60mA, for a 12V automotive supply, R = (12V - 3.1V) / 0.060A \u2248 148 ohms. A resistor rated for at least (12V-3.1V)*0.06A = 0.53W should be used. For precision and stability, a dedicated LED driver IC is often preferred.
8.2 Thermal Management Design
Effective heat sinking is paramount. Use the thermal derating curve as the primary guide. Design the PCB to maximize heat dissipation from the solder pad: use a generous copper pour connected to the thermal pad with multiple thermal vias to inner or bottom layers. The maximum solder pad temperature (Ts) should be kept as low as possible, well below 110\u00b0C, to allow operation at or near the full 60mA current.
8.3 Optical Design Considerations
The 120-degree viewing angle is suitable for wide, diffuse illumination. For more focused light, secondary optics (lenses) would be required. The amber color is often chosen for low-glare interior lighting and warning indicators. Designers should account for potential color shift over temperature and current when matching multiple LEDs or other light sources.
9. Technical Comparison and Differentiation
Compared to standard non-automotive PLCC-4 LEDs, this product's key differentiators are its AEC-Q102 qualification and sulfur robustness (A1). The AEC-Q102 standard involves rigorous stress tests (high-temperature operating life, temperature cycling, humidity resistance, etc.) that generic LEDs do not undergo. Sulfur robustness is critical in automotive and industrial environments where outgassing from certain materials can corrode silver-plated LED components, leading to failure. The combination of high luminous intensity (3400mcd) and a wide viewing angle (120\u00b0) in an automotive-qualified package offers a balanced solution for interior lighting tasks.
10. Frequently Asked Questions (FAQ)
Q: What is the difference between "Typical" and "Maximum" ratings?
A: "Typical" is the expected value under normal conditions. "Maximum" (or "Min/Max") are the absolute limits that must not be exceeded to prevent permanent damage or ensure the device meets its specification. Always design conservatively, considering worst-case conditions.
Q: How do I interpret the derating curve?
A: Find your estimated or measured solder pad temperature (Ts) on the x-axis. Draw a line up to the derating curve. From that intersection, draw a line left to the y-axis to find the maximum safe continuous forward current for that Ts. Never operate above this current.
Q: Why is binning important?
A: Binning ensures color and brightness consistency within a single production batch and across batches. For applications with multiple LEDs (e.g., a light bar), ordering from the same intensity and color bin is crucial to avoid visible differences between individual LEDs.
Q: Can I drive this LED with a constant voltage source?
A: It is strongly discouraged. An LED's current is an exponential function of voltage. A small change in Vf (due to temperature or bin variation) can cause a large change in current, potentially exceeding maximum ratings. Always use a constant current driver or a voltage source with a series current-limiting resistor.
11. Practical Design and Usage Case
Case: Designing an Automotive Dashboard Illumination Cluster. A designer needs to illuminate 10 indicator icons on a dashboard. Each icon requires uniform, amber backlighting. They choose this LED for its automotive grade and color.
1. Electrical Design: The vehicle bus is 12V nominal. Targeting 50mA per LED for longevity and lower heat, Vf is ~3.0V (from IV curve). Series resistor R = (12V - 3.0V) / 0.050A = 180 ohms. Power in resistor = 9V * 0.05A = 0.45W, so a 0.5W or 1W resistor is selected.
2. Thermal Design: The LEDs are placed on a small PCB. A 2oz copper layer is used with a large fill under the LED's thermal pad, connected via 9 thermal vias to a bottom-side copper plane. Thermal simulation estimates Ts to be 65\u00b0C in the worst-case ambient temperature.
3. Optical Design: The 120\u00b0 viewing angle provides sufficient spread behind the icon diffuser. A light guide may be used to distribute light evenly across the icon area.
4. Binning: The designer specifies tight chromaticity bins (e.g., YA only) and a specific luminous intensity bin (e.g., CA) to ensure all 10 icons have identical color and brightness.
12. Technical Principle Introduction
This is a Phosphor Converted Amber (PCA) LED. The fundamental principle involves a semiconductor chip (typically emitting in the blue or ultraviolet spectrum) coated with a layer of phosphor material. When the chip is energized, it emits short-wavelength light. This light excites the phosphor, which then re-emits light at longer wavelengths. In an amber LED, the phosphor composition is designed to absorb a portion of the primary emission and convert it to a broad spectrum centered in the yellow/amber region. The mix of unconverted blue light and the phosphor's yellow emission results in the perceived amber color. The PLCC-4 package houses the chip-on-substrate assembly, wire bonds, and phosphor layer inside a reflective cavity topped with a molded epoxy lens that shapes the light output.
13. Industry Trends and Developments
The trend in automotive interior lighting LEDs is towards higher efficiency (more lumens per watt), enabling brighter displays with lower power consumption and thermal load. There is also a move towards smaller package sizes with maintained or improved optical performance, allowing for more compact and sleek designs. Digitally addressable LEDs (like those using a protocol such as I2C or a proprietary scheme) are becoming more common, allowing dynamic color and brightness control for personalized ambient lighting. Furthermore, the demand for even higher reliability and longer lifetimes continues to push material and packaging technology advancements. The emphasis on sulfur robustness and AEC-Q102+ level qualifications is now standard for serious automotive suppliers.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |