PLCC-6 Cool White LED Datasheet - Package 3.2x2.8x1.9mm - Voltage 3.2V - Power 0.48W - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, surface-mount Cool White LED in a PLCC-6 (Plastic Leaded Chip Carrier) package. The device is engineered for demanding applications, particularly in the automotive sector, where reliability and performance under harsh conditions are paramount. Its core advantages include high luminous intensity, a wide viewing angle, and robust construction meeting automotive-grade standards.

The primary target market is automotive lighting, encompassing both exterior applications such as daytime running lights, position lights, and interior lighting like dashboard illumination, ambient lighting, and switch backlighting. The product's qualification to AEC-Q101 and compliance with RoHS and REACH directives underscore its suitability for global automotive supply chains.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The key operational parameters are defined under typical conditions of a forward current (I_F) of 150 mA and an ambient temperature of 25°C.

• Forward Current (I_F): The recommended operating current is 150 mA, with a maximum absolute rating of 200 mA. A minimum current of 20 mA is required for operation.
• Luminous Intensity (I_V): The typical value is 10,000 millicandelas (mcd) at 150 mA, with a minimum of 7,100 mcd and a maximum up to 18,000 mcd depending on the bin. Measurement tolerance is ±8%.
• Forward Voltage (V_F): Typically 3.2 volts, ranging from a minimum of 2.50 V to a maximum of 3.75 V at 150 mA. The voltage measurement tolerance is ±0.05V.
• Viewing Angle: A wide 120-degree angle (2θ_½) ensures broad and uniform light distribution.
• Chromaticity Coordinates (CIE x, y): The typical coordinates are (0.3, 0.3). The tolerance for these coordinates is ±0.005.

2.2 Thermal and Absolute Maximum Ratings

Understanding the limits is crucial for reliable design.

• Power Dissipation (P_d): Maximum 750 mW.
• Junction Temperature (T_j): Absolute maximum of 125°C.
• Operating & Storage Temperature: Range from -40°C to +110°C.
• Thermal Resistance: Junction-to-solder point thermal resistance is specified as 40 K/W (real) and 30 K/W (electrical).
• ESD Sensitivity (HBM): Rated at 8 kV, indicating good handling robustness.
• Surge Current (I_FM): Can withstand 750 mA pulses for ≤10 µs at a low duty cycle.

3. Binning System Explanation

The LED output is categorized into bins to ensure consistency. Designers must select appropriate bins for their application requirements.

3.1 Luminous Intensity Binning

Luminous intensity is binned using an alphanumeric code (e.g., L1, EA, FB). The provided table lists bins from L1 (11.2-14 mcd) up to GA (18000-22400 mcd). For this specific product, the possible output bins are highlighted, with a typical intensity of 10,000 mcd falling within the EA (7100-9000 mcd) or EB (9000-11200 mcd) bins. The exact bin must be confirmed from the ordering information.

3.2 Chromaticity (Color) Binning

The white color is binned according to CIE 1931 (x, y) coordinates. The datasheet defines specific bins (e.g., 64A, 64B, 64C, 64D, 60A, 60B) with tight coordinate boundaries and correlated color temperature (CCT) ranges, typically around 6240K to 6680K, which corresponds to a cool white appearance. The typical coordinates (0.3, 0.3) would fall within one of these defined bins.

4. Performance Curve Analysis

Graphical data provides insight into the LED's behavior under varying conditions.

4.1 Spectral Distribution and Radiation Pattern

The relative spectral distribution graph shows a peak in the blue wavelength region, typical for a phosphor-converted white LED. The radiation pattern graph confirms the Lambertian-like distribution with a 120-degree viewing angle where intensity falls to half of its peak value.

4.2 Forward Current vs. Forward Voltage (I-V Curve)

The graph illustrates the exponential relationship. At 150 mA, the voltage is approximately 3.2V. This curve is essential for designing the current-limiting driver circuit.

4.3 Relative Luminous Intensity vs. Forward Current

Light output increases with current but not linearly. The graph shows the relative intensity saturating at higher currents, emphasizing the importance of operating within the recommended range for efficiency and longevity.

4.4 Temperature Dependence

Relative Luminous Intensity vs. Junction Temperature: Light output decreases as junction temperature rises. At the maximum junction temperature of 125°C, the relative intensity is significantly lower than at 25°C. Adequate thermal management is critical to maintain brightness.

Relative Forward Voltage vs. Junction Temperature: The forward voltage has a negative temperature coefficient, decreasing linearly with increasing temperature. This can be used for indirect temperature monitoring in some applications.

Chromaticity Shift vs. Temperature and Current: Graphs show how the CIE x and y coordinates change with both junction temperature and forward current. Shifts are generally small but must be considered in color-critical applications.

4.5 Forward Current Derating and Pulse Handling

The derating curve dictates the maximum allowable forward current as the solder pad temperature (T_S) increases. For example, at a T_S of 100°C, the maximum I_F is 110 mA. The pulse handling capability chart shows the permissible peak forward current (I_FA) for various pulse widths (t_p) and duty cycles (D).

5. Mechanical and Package Information

5.1 Mechanical Dimensions

The LED uses a standard PLCC-6 surface-mount package. The exact dimensions (length, width, height) and lead spacing are defined in the mechanical drawing (Section 7 of the original PDF). The package outline is crucial for PCB footprint design.

5.2 Recommended Soldering Pad Layout

A land pattern design is provided to ensure proper soldering, thermal transfer, and mechanical stability. Following this recommendation prevents tombstoning and improves solder joint reliability.

5.3 Polarity Identification

The PLCC-6 package has a marked corner or other feature to indicate the cathode. Correct orientation is vital for circuit operation.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A specific reflow profile is recommended, with a peak temperature of 260°C for a maximum of 30 seconds. This JEDEC-compliant profile prevents thermal damage to the plastic package and the die.

6.2 Precautions for Use

• ESD Protection: Although rated for 8 kV HBM, standard ESD precautions should be observed during handling.
• Current Control: Always drive the LED with a constant current source, not a constant voltage, to prevent thermal runaway.
• Thermal Management: Design the PCB with adequate thermal relief, using the recommended pad design and possibly thermal vias to dissipate heat.
• Sulfur Resistance: The device is noted to have sulfur robustness, an important feature for automotive environments where sulfur-containing gases can corrode silver-plated components.
• MSL (Moisture Sensitivity Level): Rated MSL 2. This means the component must be used within 1 year of the seal date and baked if exposed to ambient conditions beyond its floor life before reflow.

7. Application Notes and Design Considerations

7.1 Typical Application Scenarios

• Automotive Exterior Lighting: Daytime Running Lights (DRLs), side marker lights, center high-mount stop lights (CHMSL). The high brightness and wide angle are beneficial.
• Automotive Interior Lighting: Instrument cluster backlighting, infotainment system buttons, ambient lighting strips, dome lights.

7.2 Design Considerations

• Driver Circuit: A switching or linear constant-current driver is required. Calculate the required current limit resistor or driver settings based on the typical V_F and the supply voltage.
• Optics: The wide 120-degree angle may require secondary optics (lenses, light guides) to collimate or shape the beam for specific applications.
• Thermal Design: Use the thermal resistance (R_thJS) and derating curve to calculate the expected junction temperature. Ensure T_j remains below 125°C under all operating conditions. A heatsink on the PCB may be necessary for high-current or high-ambient-temperature operation.
• Bin Selection: For applications requiring consistent brightness or color across multiple LEDs, specify tight bins for luminous intensity and chromaticity coordinates.

8. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the typical power consumption of this LED?
A: At the typical operating point of 150 mA and 3.2V, the power is P = I_F * V_F = 0.150 A * 3.2 V = 0.48 Watts.

Q: How do I interpret the luminous intensity bin 'EA'?
A: The 'EA' bin corresponds to a luminous intensity range of 7,100 to 9,000 mcd when measured at 150 mA. Any LED labeled with this bin will have an intensity within that range.

Q: Can this LED be used in a 12V automotive circuit directly?
A: No. The LED requires a constant current driver. Connecting it directly to a 12V source would cause excessive current flow, instantly destroying the device. A current-limiting circuit or dedicated LED driver IC must be used.

Q: What does 'Sulfur robustness' mean?
A> It indicates that the LED's packaging materials and finishes are resistant to corrosion caused by sulfur-containing gases (common in industrial and some automotive environments), enhancing long-term reliability.

9. Practical Design Example

Scenario: Designing a daytime running light (DRL) module using this LED.
Steps:

1. Determine Requirements: Target luminous intensity per LED, beam pattern, operating voltage (e.g., vehicle's 12V system).
2. Select Driver: Choose an automotive-grade buck constant-current LED driver IC that can accept an input of 9-16V and deliver a stable 150 mA output.
3. Thermal Calculation: Estimate the PCB temperature. If the ambient under the hood can reach 85°C, use the derating curve. At T_S = 95°C, the max I_F is ~200 mA. Operating at 150 mA provides a safety margin. Calculate if the PCB copper area is sufficient to keep T_S below this level.
4. Optical Design: Pair the LED with a TIR (Total Internal Reflection) lens to collimate the 120-degree output into a regulated beam suitable for a DRL.
5. Bin Specification: For uniform appearance, specify a single, tight chromaticity bin (e.g., 64B) and a luminous intensity bin (e.g., EB) for all LEDs in the module.