PLCC-6 Super Red LED A09K-SR1501H-AM Datasheet - Package 3.2x2.8x1.9mm - Voltage 2.15V - Power 0.32W - English Technical Document

1. Product Overview

The A09K-SR1501H-AM is a high-brightness, Super Red light-emitting diode (LED) encapsulated in a surface-mount PLCC-6 package. Its primary design focus is reliability and performance in demanding automotive environments. The device offers a typical luminous intensity of 4500 millicandelas (mcd) at a drive current of 150mA, making it suitable for various signaling and illumination functions where high visibility is critical. A key feature is its compliance with the AEC-Q101 qualification standard, which validates its robustness for automotive use. Furthermore, it adheres to RoHS and REACH environmental directives and possesses sulfur robustness, enhancing its longevity in harsh operating conditions.

1.1 Core Advantages and Target Market

The core advantages of this LED stem from its combination of high optical output, wide 120-degree viewing angle, and automotive-grade reliability. The high luminous intensity ensures excellent visibility even in bright daylight conditions, which is essential for safety-critical applications like brake lights. The wide viewing angle provides uniform light distribution, improving the perceptibility of the signal from various angles. The primary target market is the automotive industry, specifically for exterior lighting modules. Its qualifications make it a preferred choice for designers requiring components that meet stringent automotive quality and longevity standards.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet.

2.1 Photometric and Electrical Characteristics

The central photometric parameter is the Luminous Intensity (I_V), specified with a typical value of 4500 mcd at I_F=150mA, with a minimum of 3550 mcd and a maximum of 7100 mcd. This wide range is managed through a binning system (detailed later). The measurement tolerance for luminous flux is ±8%, and it is measured with the thermal pad at 25°C. The Forward Voltage (V_F) is typically 2.15V at 150mA, ranging from 1.75V to 3.0V. The datasheet notes that this V_F range represents 99% of production output, with a measurement tolerance of ±0.05V. The Dominant Wavelength (λ_d) defines the perceived color; for this Super Red LED, it is typically 629 nm, within a range of 627 nm to 639 nm, with a measurement tolerance of ±1 nm. The Viewing Angle (2φ) is 120 degrees, with a tolerance of ±5 degrees.

2.2 Absolute Maximum Ratings and Thermal Management

Absolute maximum ratings define the limits beyond which permanent damage may occur. The Maximum Continuous Forward Current (I_F) is 200 mA. The Power Dissipation (P_d) is rated at 600 mW. A key thermal parameter is the Thermal Resistance. Two values are given: an electrical measurement (R_{th JS el}) of 50 K/W max and a real measurement (R_{th JS real}) of 60 K/W max, both from the junction to the solder point. The higher \"real\" value is more conservative for design. The Junction Temperature (T_J) must not exceed 125°C. The operating and storage temperature range is from -40°C to +110°C. The device can withstand a Surge Current (I_FM) of 1000 mA for pulses ≤10 μs at a low duty cycle (D=0.005). Electrostatic discharge (ESD) protection is rated at 8 kV (Human Body Model).

3. Binning System Explanation

To manage natural variations in semiconductor manufacturing, LEDs are sorted into performance bins. This ensures consistency for the end-user.

3.1 Luminous Intensity Binning

The luminous intensity is binned using an alphanumeric code (e.g., CB, DA, DB). The datasheet provides an extensive table. For the A09K-SR1501H-AM, the \"highlighted black box\" indicates the possible output bins. Based on the typical intensity of 4500 mcd and the range (3550-7100 mcd), the relevant bins are CA (2800-3550 mcd), CB (3550-4500 mcd), DA (4500-5600 mcd), and DB (5600-7100 mcd). The specific bin for a given production lot must be confirmed in the ordering information.

3.2 Dominant Wavelength Binning

The dominant wavelength is also binned using a numeric code. The target range for this Super Red LED is 627-630 nm (typical 629 nm). Referring to the binning table, the code \"2730\" corresponds to the range 627-630 nm. Adjacent bins like \"3033\" (630-633 nm) and \"2427\" (624-627 nm) may also be part of the production spread. The tolerance is ±1 nm.

4. Performance Curve Analysis

The graphs in the datasheet illustrate how key parameters change under different operating conditions, which is crucial for robust circuit design.

4.1 IV Curve and Relative Intensity

The Forward Current vs. Forward Voltage graph shows a non-linear relationship typical of diodes. The voltage increases with current, starting around 1.4V at low current and reaching approximately 2.15V at 150mA. The Relative Luminous Intensity vs. Forward Current graph is nearly linear up to the typical 150mA, indicating good efficiency within the recommended operating range.

4.2 Temperature Dependence

Temperature significantly affects LED performance. The Relative Luminous Intensity vs. Junction Temperature graph shows that output decreases as temperature increases. At the maximum operating solder pad temperature of 110°C (see derating curve), the relative intensity is roughly 60% of its value at 25°C. This must be accounted for in thermal design. The Relative Forward Voltage vs. Junction Temperature graph has a negative slope, meaning V_F decreases as temperature rises (approximately -1.5 mV/°C). The Relative Wavelength vs. Junction Temperature graph shows a positive shift; wavelength increases slightly with temperature (approx. +0.05 nm/°C).

3.3 Spectral Distribution and Derating

The Relative Spectral Distribution curve confirms the monochromatic nature of the LED, with a sharp peak in the red spectrum (~629 nm). The Forward Current Derating Curve is critical for reliability. It dictates the maximum allowable continuous forward current based on the solder pad temperature (T_S). At the maximum ambient/solder point temperature of 110°C, the maximum allowed continuous current drops to approximately 84 mA. The curve also specifies a minimum operating current of 20 mA. The Permissible Pulse Handling Capability graph allows the designer to calculate safe single-pulse or pulsed operation currents for various pulse widths (t_p) and duty cycles (D).

5. Mechanical and Package Information

5.1 Physical Dimensions and Polarity

The LED uses a standard PLCC-6 (Plastic Leaded Chip Carrier) surface-mount package. The mechanical drawing shows the top view and side view with critical dimensions. The package length is 3.2 mm, width is 2.8 mm, and height is 1.9 mm. The drawing clearly indicates the polarity marking (typically a cut corner or a dot on the top of the package) which corresponds to the cathode. Correct orientation during assembly is essential.

5.2 Recommended Soldering Pad Layout

A recommended land pattern (footprint) for PCB design is provided. This pattern ensures proper solder joint formation during reflow and provides the necessary thermal and electrical connection. Adhering to this layout is important for manufacturing yield and long-term reliability.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The datasheet specifies a reflow soldering profile compatible with lead-free (Pb-free) processes. The peak solder temperature should not exceed 260°C, and the time above 240°C should be limited. A specific time-temperature graph is provided, showing preheat, soak, reflow, and cooling zones. Following this profile prevents thermal damage to the LED package and internal die.

6.2 Precautions for Use

General precautions include avoiding mechanical stress on the lens, preventing contamination, and ensuring the device is not operated beyond its absolute maximum ratings. Specific attention should be paid to electrostatic discharge (ESD) protection during handling and assembly, as specified by the 8kV HBM rating.

7. Packaging and Ordering Information

The LEDs are supplied on tape and reel for automated assembly. The packaging information details the reel dimensions, tape width, pocket spacing, and orientation of the components on the tape. The ordering information would typically include the base part number (A09K-SR1501H-AM) along with codes for specific luminous intensity and wavelength bins, though the exact format is not detailed in the provided excerpt.

8. Application Recommendations

8.1 Typical Application Scenarios

The primary applications listed are all within automotive exterior lighting: Center High-Mount Stop Lamp (CHMSL), Tail Lamps, and Stop (Brake) Lamps. Its high brightness and red color are ideal for these safety-signaling functions. It may also be suitable for other red indicator applications requiring high reliability.

8.2 Design Considerations

Key design considerations include:
Drive Circuit: A constant-current driver is recommended to maintain stable light output, as LED brightness is a function of current, not voltage. The circuit must limit the current to a maximum of 200 mA continuous, with derating for temperature.
Thermal Management: The PCB layout must provide an adequate thermal path from the LED's solder pads to a heatsink or the board's copper planes to keep the junction temperature within limits, especially at high ambient temperatures or high drive currents.
Optical Design: The 120° viewing angle may require secondary optics (lenses, reflectors) to shape the beam for specific applications like CHMSL.

9. Technical Comparison and Differentiation

Compared to standard non-automotive red LEDs, the A09K-SR1501H-AM's key differentiators are its AEC-Q101 qualification and sulfur robustness. These are not typically tested in commercial-grade LEDs. The high typical luminous intensity (4500 mcd) is also a performance advantage for applications requiring long-distance visibility. The PLCC-6 package offers a good balance of size, thermal performance, and ease of assembly compared to smaller or larger packages.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED directly from a 12V automotive battery?
A: No. You must use a current-limiting circuit or a constant-current driver. Connecting it directly to 12V would cause excessive current flow, instantly destroying the LED.
Q: Why is the light output lower at high temperatures?
A: This is a fundamental characteristic of semiconductor materials. Increased temperature increases non-radiative recombination within the LED chip, reducing its internal quantum efficiency (light output per unit of electrical input).
Q: What does \"MSL: 2a\" mean?
A: Moisture Sensitivity Level 2a indicates the package can be stored in a dry environment (≤30°C/60% RH) for up to 4 weeks before it requires baking prior to reflow soldering. This is important for manufacturing process control.
Q: How do I select the right bin for my application?
A: For color-critical applications (e.g., matching multiple LEDs in a tail lamp), specify a tight wavelength bin (e.g., 2730). For brightness-critical applications where minimum intensity is the concern, specify the minimum luminous intensity bin that meets your design target.

11. Practical Design and Usage Case Study

Scenario: Designing a CHMSL Module. A designer needs to create a CHMSL with uniform brightness meeting regulatory photometric requirements. They select the A09K-SR1501H-AM for its reliability. They decide to drive each LED at 100 mA (below the 150mA typical point) to ensure longevity and account for high-temperature derating. Using the derating curve, at a calculated maximum solder point temperature of 85°C, the 100mA drive is safe. They design a constant-current driver array. To ensure color and brightness consistency, they work with the supplier to procure LEDs from a single production lot within specific intensity (e.g., DA bin) and wavelength (2730 bin) ranges. The PCB layout uses the recommended pad design with thermal vias connecting to an internal ground plane for heat dissipation.

12. Operating Principle Introduction

Light-emitting diodes are semiconductor devices that convert electrical energy directly into light through a process called electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers recombine, they release energy. In this LED, the semiconductor material (typically based on AlInGaP for red/orange/amber colors) is engineered so that this released energy is in the form of photons (light) with a wavelength corresponding to red light (~629 nm). The plastic package encapsulates and protects the tiny semiconductor chip, includes lead frames for electrical connection, and incorporates a molded lens that shapes the light output and determines the viewing angle.

13. Technology Trends

The trend in automotive LED lighting is towards higher efficiency (more lumens per watt), higher power density, and increased integration. This allows for smaller, more stylized lamp designs with lower energy consumption. There is also a move towards smart, adaptive lighting systems where individual LEDs or clusters can be digitally controlled for dynamic functions. The underlying semiconductor technology continues to improve, offering better performance over temperature and longer operational lifetimes. Packaging technology is also evolving to provide better thermal management in compact form factors, which is critical for maintaining performance and reliability in space-constrained automotive applications.