PLCC-6 Yellow LED Datasheet - Package 3.2x2.8x1.9mm - Voltage 2.15V - Power 0.32W - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, surface-mount yellow LED in a PLCC-6 package. The device is engineered primarily for demanding automotive exterior lighting applications, such as turning signals, where reliability, brightness, and consistent performance under harsh environmental conditions are paramount. Its core advantages include a high typical luminous intensity of 5500 millicandelas (mcd) at a standard drive current of 150mA, a wide 120-degree viewing angle for excellent visibility, and robust construction that meets stringent automotive-grade standards.

The LED is qualified to AEC-Q101, ensuring its reliability for automotive use. It is also compliant with RoHS and REACH environmental directives and possesses sulfur robustness, making it suitable for environments where corrosive gases may be present. The target market is automotive lighting manufacturers and designers requiring a compact, bright, and reliable yellow light source.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The key operational parameters define the LED's performance under typical conditions (T_s=25°C). The forward current (I_F) has a recommended operating range of 20mA to 200mA, with a typical value of 150mA. At this typical current, the luminous intensity (I_V) ranges from a minimum of 3550 mcd to a maximum of 7100 mcd, with a typical value of 5500 mcd. The forward voltage (V_F) at 150mA is typically 2.15V, with a range from 1.75V to 2.75V. This relatively low forward voltage contributes to higher system efficiency. The dominant wavelength (λ_d) is specified between 582 nm and 594 nm, with a typical of 589 nm, placing it firmly in the yellow region of the visible spectrum. The viewing angle (2θ_½) is a wide 120 degrees, providing a broad emission pattern.

2.2 Absolute Maximum Ratings and Thermal Management

These ratings define the limits beyond which permanent damage may occur. The absolute maximum forward current is 200 mA. The device can handle a surge current (I_FM) of 1000 mA for pulses ≤10 μs with a very low duty cycle (D=0.005). The maximum junction temperature (T_J) is 125°C, while the operating and storage temperature range is from -40°C to +110°C. The power dissipation (P_d) is rated at 550 mW. Thermal management is critical; the thermal resistance from junction to solder point is specified. The real thermal resistance (R_{th JS real}) is ≤60 K/W, while the electrical method measurement (R_{th JS el}) is ≤50 K/W. Proper PCB thermal design is necessary to maintain the junction temperature within safe limits, especially at high drive currents or in high ambient temperature environments.

2.3 Reliability and Environmental Specifications

The LED is designed for high reliability. It has an ESD sensitivity rating of 8 kV (Human Body Model), which is a robust level for handling and assembly. It is qualified to the AEC-Q101 standard for discrete semiconductors, a key requirement for automotive components. The device is compliant with RoHS (Restriction of Hazardous Substances) and REACH regulations. It also features sulfur robustness, indicating resistance to sulfur-containing atmospheres that can cause silver corrosion in some LED packages.

3. Binning System Explanation

The LED is available in sorted bins to ensure color and brightness consistency within an application. Two primary binning parameters are defined.

3.1 Luminous Intensity Binning

The luminous output is categorized into multiple groups, each with a two-character code (e.g., L1, M2, DA, DB). The bins cover a very wide range from a minimum of 11.2 mcd (L1) to a maximum of 22400 mcd (GA). For the specific part number A09K-UY1501H-AM, the possible output bins are highlighted, falling within the range of 3550 mcd to 7100 mcd. This corresponds to bins from CA (2800-3550 mcd) up to DB (5600-7100 mcd). Designers must select the appropriate bin based on their brightness requirements.

3.2 Dominant Wavelength Binning

The color (dominant wavelength) is also binned using a four-digit code (e.g., 8285, 9194). The bins span from 459 nm (violet-blue) to 639 nm (red-orange). For this yellow LED, the relevant bins are those covering the yellow spectrum, specifically from approximately 582 nm to 597 nm. The part number's specified range of 582-594 nm aligns with bins such as 8285 (582-585 nm), 8588 (585-588 nm), 8891 (588-591 nm), and 9194 (591-594 nm). This ensures precise color matching across multiple LEDs in an assembly.

4. Performance Curve Analysis

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The graph shows the relationship between forward current and forward voltage. It is a non-linear, exponential curve typical of diodes. At the typical operating point of 150mA, the voltage is approximately 2.15V. Designers use this curve to select appropriate current-limiting resistors or constant-current driver settings to achieve the desired brightness while staying within the voltage and power limits.

4.2 Relative Luminous Intensity vs. Forward Current

This graph demonstrates that light output increases with current, but not perfectly linearly, especially at higher currents. It helps in understanding the efficacy (light output per unit of electrical power) at different drive levels.

4.3 Temperature Dependency Characteristics

Several graphs illustrate the impact of temperature. The Relative Luminous Intensity vs. Junction Temperature curve shows that light output decreases as temperature increases. This thermal derating must be accounted for in thermal design. The Relative Forward Voltage vs. Junction Temperature curve shows a negative temperature coefficient; V_F decreases as temperature rises. This is important for circuits using voltage-based regulation. The Dominant Wavelength vs. Forward Current and Relative Wavelength vs. Junction Temperature graphs show minor shifts in color (wavelength) with changing operating conditions, which is typical for LEDs.

4.4 Forward Current Derating Curve

This crucial graph defines the maximum allowable continuous forward current as a function of the solder pad temperature (T_S). As T_S increases, the maximum permissible I_F must be reduced to prevent exceeding the maximum junction temperature. For example, at a T_S of 110°C, the maximum I_F is approximately 91 mA. This curve is essential for ensuring long-term reliability in high-temperature environments like automotive lighting.

4.5 Permissible Pulse Handling Capability

This graph defines the maximum permissible non-repetitive or repetitive pulse current (I_F(A)) as a function of pulse width (t_p) for various duty cycles (D). It allows designers to understand the LED's capability to handle short, high-current pulses, which might be used in communication or special signaling applications.

4.6 Spectral Distribution

The relative spectral distribution graph shows the intensity of light emitted across different wavelengths. For this yellow LED, the peak is around 589 nm, with a typical narrow bandwidth, resulting in a saturated yellow color.

5. Mechanical and Package Information

5.1 Mechanical Dimensions

The LED is housed in a PLCC-6 (Plastic Leaded Chip Carrier) package. The typical dimensions are approximately 3.2mm in length, 2.8mm in width, and 1.9mm in height. Detailed dimensional drawings with tolerances are provided in the datasheet for accurate PCB footprint design.

5.2 Recommended Soldering Pad Layout

A recommended land pattern (footprint) for PCB design is provided. This includes the size and spacing of the copper pads for the six leads and the central thermal pad (if applicable). Following this recommendation ensures proper soldering, mechanical stability, and optimal thermal transfer from the LED to the PCB.

5.3 Polarity Identification

The package includes a polarity indicator, typically a notch or a dot near pin 1. The pinout diagram identifies the anode and cathode connections. Correct polarity must be observed during assembly to prevent damage.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A detailed reflow soldering temperature profile is specified. The peak solder temperature should not exceed 260°C, and the time above 240°C should be limited. A typical profile includes preheat, soak, reflow, and cooling stages. Adhering to this profile is critical to prevent thermal damage to the plastic package and the internal die and wire bonds.

6.2 Precautions for Use

General handling and usage precautions are outlined. These include avoiding mechanical stress on the leads, preventing electrostatic discharge (ESD) during handling (despite its 8kV rating), ensuring the operating conditions do not exceed absolute maximum ratings, and implementing proper thermal design on the PCB. The device is not designed for reverse voltage operation.

6.3 Storage Conditions

Components should be stored in a dry, controlled environment within the specified storage temperature range of -40°C to +110°C. For extended storage, moisture sensitivity level (MSL) 2 indicates that the package can be exposed to factory floor conditions for up to one year before requiring baking prior to reflow soldering.

7. Packaging and Ordering Information

7.1 Packaging Information

The LEDs are supplied on tape and reel for automated assembly. The packaging specifications include reel dimensions, tape width, pocket spacing, and orientation of components on the tape. This information is necessary for configuring pick-and-place machines.

7.2 Part Number and Ordering Information

The part number A09K-UY1501H-AM follows a specific coding system. While the full decoding may be proprietary, it typically conveys information about the package type (PLCC-6), color (Yellow - Y), luminous intensity bin, and wavelength bin. Ordering information would specify the quantity per reel and other commercial details.

8. Application Notes and Design Considerations

8.1 Primary Application: Automotive Exterior Lighting

The primary and most critical application is automotive exterior lighting, specifically turning signals. In this role, the LED must provide high brightness for daytime visibility, a wide viewing angle to be seen from various angles, extreme reliability over a wide temperature range (-40°C to +110°C), and resistance to vibration and environmental contaminants like moisture and sulfur.

8.2 Circuit Design Considerations

Designers should use a constant-current driver rather than a simple resistor for optimal performance and longevity, especially in automotive voltage environments (e.g., 12V system with load dump transients). The driver should be designed to compensate for the negative temperature coefficient of V_F and the decrease in luminous intensity with rising temperature. Thermal management on the PCB, using adequate copper area or thermal vias connected to the LED's thermal pad, is essential to keep the junction temperature low, maintain brightness, and ensure reliability.

8.3 Optical Design Considerations

The 120-degree viewing angle is a Lambertian or near-Lambertian distribution. Secondary optics (lenses, reflectors) may be needed to shape the beam pattern for specific applications like turn signals, which often have regulatory requirements for angular intensity distribution.

9. Technical Comparison and Differentiation

Compared to standard commercial yellow LEDs, this device offers key differentiators for automotive use: AEC-Q101 Qualification is the foremost, ensuring proven reliability under automotive stress tests. Higher Typical Luminance (5500 mcd) provides greater brightness in a compact package. Sulfur Robustness addresses a specific failure mode in automotive environments. The combination of wide viewing angle (120°) and high intensity is optimized for signaling applications where broad visibility is needed. The detailed binning structure allows for precise color and brightness matching in multi-LED arrays.

10. Frequently Asked Questions (FAQ)

Q: What is the recommended drive current for this LED?
A: The typical operating current is 150mA, providing 5500 mcd. It can be operated from 20mA to 200mA, but performance parameters are specified at 150mA.

Q: How do I interpret the luminous intensity binning code (e.g., DA)?
A: The bin code corresponds to a specific range of luminous intensity. For example, bin DA covers 4500 to 5600 mcd. You must consult the binning table to select the intensity range suitable for your design.

Q: Why is thermal management so important?
A: LED performance degrades with heat. Excessive junction temperature reduces light output, shifts color, and drastically shortens lifespan. The derating curve (section 4.4) must be followed to ensure reliable operation.

Q: Can this LED be used in non-automotive applications?
A: Yes, its high reliability makes it suitable for other demanding applications like industrial indicators, outdoor signage, and safety equipment where environmental robustness is required, though it may be cost-optimized for automotive volumes.

Q: What does MSL 2 mean for assembly?
A: Moisture Sensitivity Level 2 means the packaged device can be exposed to ambient factory conditions (≤30°C/60% RH) for up to one year before it requires baking to remove absorbed moisture that could cause cracking during reflow soldering.

11. Design and Usage Case Study

Scenario: Designing a High-Reliability Automotive Rear Turn Signal. A design engineer is creating a new LED-based rear turn signal cluster for a passenger vehicle. The cluster uses 12 yellow LEDs arranged in a specific pattern. Using this PLCC-6 LED, the engineer first selects the appropriate luminous intensity bin (e.g., DB for highest brightness) and dominant wavelength bin (e.g., 8891 for consistent yellow hue) from the supplier to ensure uniformity across all 12 LEDs. A constant-current driver IC, rated for automotive use, is selected to provide a stable 150mA to each LED string. The PCB is designed with a 2-ounce copper layer and an array of thermal vias directly under the LED's footprint to conduct heat away efficiently, keeping the solder pad temperature below 80°C during operation. This ensures the actual junction temperature remains well below the 125°C maximum, preserving lumen maintenance over the vehicle's lifetime. Optical simulations are run using the LED's 120-degree radiation pattern to design secondary optics that meet the regulatory photometric requirements for turn signal intensity and angular distribution.

12. Operating Principle

This LED is a semiconductor light source. It is based on a semiconductor chip (die) made of materials like Gallium Arsenide Phosphide (GaAsP) or similar, engineered to emit light in the yellow wavelength when electrical current passes through it. When a forward voltage exceeding the diode's threshold is applied, electrons and holes recombine in the active region of the semiconductor, releasing energy in the form of photons (light). This process is called electroluminescence. The specific material composition and structure of the semiconductor layers determine the dominant wavelength of the emitted light. The die is mounted inside a reflective PLCC-6 package, which also houses the connecting wire bonds, and is encapsulated by a yellow-tinted or clear silicone lens that protects the die and shapes the light output.

13. Technology Trends

The general trend in automotive LED lighting is towards higher efficacy (more lumens per watt), enabling brighter signals with lower power consumption and thermal load. Miniaturization continues, allowing for more compact and stylized lighting designs. Improved color consistency and tighter binning are critical as LED arrays become more common. There is also a move towards integrated smart LED modules that include the driver, diagnostics, and communication interfaces within the same package. Furthermore, materials science is advancing to provide even greater resistance to harsh environmental factors like extreme thermal cycling, high humidity, and corrosive gases, pushing the boundaries of reliability and lifespan in automotive applications.