Table of Contents
- 1. Product Overview
- 2. In-Depth Technical Parameter Analysis
- 2.1 Photometric and Electrical Characteristics
- 2.2 Thermal and Reliability Parameters
- 2.3 Absolute Maximum Ratings
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 IV Curve and Relative Luminous Intensity
- 4.2 Temperature Dependence
- 4.3 Spectral Distribution and Derating
- 5. Mechanical and Package Information
- 6. Soldering and Assembly Guidelines
- 7. Packaging and Ordering Information
- 8. Application Recommendations
- 8.1 Typical Application Scenarios
- 8.2 Design Considerations
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (Based on Technical Parameters)
- 11. Practical Design Case Study
- 12. Operational Principle
- 13. Technology Trends
1. Product Overview
The 65-21-UR0200H-AM is a high-brightness, red-emitting LED housed in a compact PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package. This component is specifically engineered for demanding automotive interior lighting applications, offering a combination of high luminous output, wide viewing angle, and robust reliability. Its primary design focus is on dashboard illumination, instrument clusters, and general interior ambient lighting where consistent color and brightness are critical under varying environmental conditions.
The core advantages of this LED include its qualification to the stringent AEC-Q102 standard for discrete optoelectronic devices in automotive applications, ensuring performance and longevity under the harsh conditions typical of vehicle interiors. It features a typical luminous intensity of 1120 millicandelas (mcd) at a standard drive current of 20mA, paired with a wide 120-degree viewing angle for excellent visibility. Furthermore, the product complies with RoHS, REACH, and halogen-free environmental directives, making it suitable for global markets with strict material regulations.
The target market is exclusively the automotive sector, with applications explicitly listed for automotive interior lighting and cluster displays. This focus dictates its enhanced specifications for temperature range, electrostatic discharge (ESD) protection, and long-term reliability compared to standard commercial-grade LEDs.
2. In-Depth Technical Parameter Analysis
2.1 Photometric and Electrical Characteristics
The electrical and optical performance is defined under standard test conditions (Ts=25°C). The forward current (IF) has an absolute maximum rating of 50mA, a typical operating point of 20mA, and a minimum suggested operating current of 5mA. At 20mA, the luminous intensity (IV) ranges from a minimum of 710mcd to a typical 1120mcd, with a maximum specified up to 1800mcd, indicating potential performance variation across production bins. The forward voltage (VF) at this current is between 1.75V and 2.75V, with a typical value of 2.0V. The dominant wavelength (λd) is in the red spectrum, specified from 612nm to 627nm, with a typical value of 622nm. The viewing angle (2θ½) is a consistent 120 degrees, with a stated tolerance of ±5°.
2.2 Thermal and Reliability Parameters
Thermal management is crucial for LED performance and lifespan. The device has two specified thermal resistance values: a "Real" thermal resistance (Rth JS real) of 160 K/W max and an "Electrical" thermal resistance (Rth JS el) of 125 K/W max. The difference likely stems from the measurement methodology, with the electrical method being a common industry practice for estimation. The absolute maximum junction temperature (TJ) is 125°C. The operating and storage temperature range is specified from -40°C to +110°C, which is essential for automotive applications that must function in extreme climates. The device can withstand an ESD (Human Body Model) pulse of up to 2kV, providing a basic level of handling protection.
2.3 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage may occur. The maximum power dissipation (Pd) is 137 mW. The surge current capability (IFM) is 100mA for pulses ≤10μs with a very low duty cycle (D=0.005). The device is not designed for reverse bias operation. The maximum soldering temperature during reflow is 260°C for 30 seconds, which is a standard profile for lead-free soldering processes.
3. Binning System Explanation
To ensure consistency in mass production, LEDs are sorted into performance bins. The datasheet provides detailed binning tables for three key parameters.
3.1 Luminous Intensity Binning
The luminous intensity is binned using an alphanumeric code system (e.g., L1, L2, M1... up to GA). Each bin covers a specific range of minimum and maximum luminous intensity in millicandelas (mcd). For the 65-21-UR0200H-AM, the possible output bins are highlighted and include V1 (710-900 mcd), V2 (900-1120 mcd), AA (1120-1400 mcd), and AB (1400-1800 mcd). This allows designers to select parts based on the required brightness level for their application, with an associated measurement tolerance of ±8%.
3.2 Dominant Wavelength Binning
The dominant wavelength, which determines the perceived color of the red light, is also binned. The bins are identified by four-digit codes (e.g., 1215, 1518, 1821). Each code corresponds to a 3-nanometer wavelength range. For this specific part, the possible bins are 1215 (612-615 nm), 1518 (615-618 nm), 1821 (618-621 nm), 2124 (621-624 nm), 2427 (624-627 nm), and 2730 (627-630 nm). The tolerance for dominant wavelength measurement is ±1nm. This tight binning ensures color uniformity across multiple LEDs in a display or lighting array.
3.3 Forward Voltage Binning
The forward voltage is binned using codes like 1517, 1720, 2022, etc., representing voltage ranges in 0.25V increments (e.g., 1.50-1.75V, 1.75-2.00V, 2.00-2.25V). Knowing the VF bin is important for designing efficient current driver circuits and managing power dissipation.
4. Performance Curve Analysis
The datasheet includes several graphs that illustrate how key parameters change with operating conditions.
4.1 IV Curve and Relative Luminous Intensity
The Forward Current vs. Forward Voltage graph shows the typical exponential relationship, essential for selecting an appropriate current-limiting resistor or constant-current driver. The Relative Luminous Intensity vs. Forward Current graph demonstrates that light output increases super-linearly with current up to a point, but operating above the recommended 20mA may reduce efficiency and increase heat.
4.2 Temperature Dependence
Several graphs detail thermal effects. The Relative Luminous Intensity vs. Junction Temperature curve shows that light output decreases as temperature increases—a critical consideration for automotive applications where ambient temperatures can be high. The Relative Forward Voltage vs. Junction Temperature graph shows VF has a negative temperature coefficient, decreasing linearly with rising temperature. This property can sometimes be used for indirect temperature sensing. The Dominant Wavelength vs. Junction Temperature graph indicates a slight redshift (increase in wavelength) as temperature rises.
4.3 Spectral Distribution and Derating
The Relative Spectral Distribution graph confirms the monochromatic red output centered around 622nm. The Forward Current Derating Curve is vital for thermal design; it shows the maximum allowable continuous forward current must be reduced as the solder pad temperature increases. For example, at a pad temperature of 110°C, the maximum continuous current is only 35mA. The Permissible Pulse Handling Capability graph provides guidelines for driving the LED with pulsed currents at various duty cycles, allowing for higher instantaneous brightness in multiplexed applications.
5. Mechanical and Package Information
The LED uses a standard PLCC-2 surface-mount package. While the exact mechanical drawing from page 15 is not reproduced here, typical PLCC-2 dimensions are well-known in the industry. The package includes a molded plastic body with two leads. Polarity is indicated by the shape of the package or a marking on the top, with the cathode typically identified. The datasheet also includes a "Recommended Soldering Pad" layout on page 16, which is crucial for PCB design to ensure proper soldering, thermal relief, and mechanical stability.
6. Soldering and Assembly Guidelines
The component is designed for reflow soldering processes compatible with lead-free solders. The specified profile on page 16 (Reflow Soldering Profile) allows a peak temperature of 260°C for up to 30 seconds. This is a standard IPC/JEDEC profile. Designers must ensure their assembly process stays within these limits to prevent package damage or degradation of the internal die and wire bonds. The "Precaution for Use" section (page 19) likely contains important handling, storage, and cleaning instructions to maintain reliability, such as avoiding exposure to sulfur-containing environments which can corrode silver-plated leads (referenced by the "Sulfur Test Criteria" on page 20).
7. Packaging and Ordering Information
The "Packaging Information" (page 17) details how the LEDs are supplied, typically on embossed carrier tapes wound into reels, suitable for automated pick-and-place assembly equipment. The part number 65-21-UR0200H-AM follows a likely internal coding system that may encapsulate information about package type, color, performance bin, and other attributes. The "Ordering Information" section (page 14) would provide the specific ordering codes corresponding to different bins of luminous intensity, wavelength, and forward voltage, allowing precise selection for production.
8. Application Recommendations
8.1 Typical Application Scenarios
As stated, the primary applications are Automotive Interior Lighting and Instrument Clusters. This includes backlighting for buttons, switches, and icons on the center console, illumination for door handles and footwells, and, most critically, as indicator and warning lights within the instrument cluster. The wide 120-degree viewing angle makes it suitable for applications where the LED may not be viewed head-on.
8.2 Design Considerations
When designing with this LED, engineers must consider several factors: Current Drive: Use a constant-current driver or a current-limiting resistor set for 20mA (typical) to ensure consistent brightness and longevity. Thermal Management: The derating curve must be respected. Ensure adequate PCB copper area or thermal vias to conduct heat away from the solder pads, especially in high-ambient-temperature environments like a car dashboard in direct sunlight. Optical Design: The wide viewing angle may require light guides or diffusers to shape the beam for specific indicator purposes. ESD Protection: While rated for 2kV HBM, incorporating basic ESD protection on the PCB is good practice for automotive electronics.
9. Technical Comparison and Differentiation
Compared to standard commercial PLCC-2 red LEDs, the 65-21-UR0200H-AM differentiates itself through its automotive-grade qualifications. Key differentiators include: AEC-Q102 Qualification: This involves a suite of stress tests (high-temperature operating life, temperature cycling, moisture resistance, etc.) that commercial parts do not undergo. Extended Temperature Range: Operation from -40°C to +110°C exceeds the typical -40°C to +85°C or +100°C range of commercial parts. Corrosion Robustness: The specification of "Class B1" for corrosion robustness indicates testing against specific gaseous contaminants common in automotive environments. Tighter Binning and Specification: Parameters are typically specified with tighter tolerances and more comprehensive binning to ensure system-level consistency.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: Can I drive this LED at 50mA continuously?
A: No. The Absolute Maximum Rating of 50mA is a stress limit. For reliable long-term operation, you must follow the derating curve based on the solder pad temperature. At typical ambient conditions, 20mA is the recommended continuous current.
Q: What is the difference between the "Real" and "Electrical" thermal resistance?
A: The "Electrical" method uses the temperature-sensitive forward voltage as a proxy to calculate thermal resistance and is commonly used for specification. The "Real" method may involve a more direct thermal measurement. For design purposes, using the higher value (160 K/W) is more conservative for thermal calculations.
Q: How do I interpret the luminous intensity bin code (e.g., AA) in an order?
A: The bin code guarantees the LED's luminous intensity falls within the specified range for that bin (e.g., AA = 1120-1400 mcd). You must order the specific bin code required for your application's brightness consistency.
Q: Is a reverse protection diode necessary?
A> Yes. The datasheet explicitly states the device is "Not designed for reverse operation." A blocking diode in series or a shunt diode across the LED is essential if there is any possibility of reverse voltage being applied, which is common in automotive power systems.
11. Practical Design Case Study
Scenario: Designing a red "Engine Check" warning indicator for an automotive instrument cluster.
Selection: The 65-21-UR0200H-AM is chosen for its AEC-Q102 compliance, high brightness, and red color. A wavelength bin in the 612-621nm range might be selected for a standard red appearance.
Circuit Design: The cluster's power supply is 12V nominal (can range from 9V to 16V). A simple series resistor is chosen for cost-effectiveness. Using the typical VF of 2.0V at 20mA: R = (12V - 2.0V) / 0.020A = 500Ω. A standard 510Ω resistor is selected, resulting in a current of ~19.6mA, which is acceptable. The resistor power rating is calculated: P = I2R = (0.0196)2 * 510 ≈ 0.2W, so a 1/4W resistor is sufficient.
Thermal Check: The LED will be mounted on the cluster's PCB. Assuming a maximum in-car ambient of 85°C and a calculated PCB temperature rise of 15°C at the pad, the pad temperature is 100°C. Consulting the derating curve, the maximum allowed continuous current at 100°C is approximately 40mA. Our design current of ~20mA is well within this limit, providing a good safety margin.
Optical Design: A light pipe or a small diffuser cap is designed to guide the light from the SMD LED on the PCB to the front-facing indicator icon on the cluster fascia, utilizing the 120-degree viewing angle.
12. Operational Principle
This device is a light-emitting diode (LED), a semiconductor p-n junction diode. When a forward voltage exceeding the diode's built-in potential (approximately 1.75-2.75V for this red LED) is applied, electrons and holes are injected across the junction. These charge carriers recombine, and for this specific material composition (likely based on AlGaInP), a portion of the recombination energy is released as photons (light) with a wavelength corresponding to the bandgap energy of the semiconductor material, resulting in red light with a dominant wavelength around 622nm. The plastic PLCC-2 package encapsulates the semiconductor die, provides mechanical protection, and incorporates a molded lens that shapes the emitted light into the specified 120-degree viewing pattern.
13. Technology Trends
In the automotive LED sector, several trends are observable. There is a continuous drive towards higher luminous efficacy (more light output per electrical watt), allowing for brighter displays or lower power consumption and heat generation. Improved color consistency and tighter binning are critical as displays become more sophisticated. Enhanced reliability and robustness remain paramount, with ongoing developments in package materials to withstand higher temperatures and harsher environmental stresses, including resistance to newer types of contaminants. Furthermore, the integration of driver electronics and control directly with the LED package (e.g., smart LEDs with integrated ICs for PWM dimming or diagnostics) is a growing trend, though this particular part remains a discrete, driver-less component.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |