PLCC4 Green LED Specification - Dimensions 3.50x2.80x3.25mm - Voltage 2.8-3.5V - Power 0.245W - Technical Documentation

1. Product Overview

This document provides the complete technical specifications for a green light-emitting diode (LED) in a PLCC4 (Plastic Leaded Chip Carrier) surface-mount package. The device is engineered using InGaN (Indium Gallium Nitride) semiconductor technology on a substrate, which is the industry standard for producing high-brightness green LEDs. Its primary design targets are reliability and compatibility with automated assembly processes, making it suitable for high-volume manufacturing environments.

1.1 Core Advantages and Target Market

The core advantages of this LED are derived from its specific construction and performance parameters. The PLCC4 package offers a robust and reliable housing that protects the semiconductor die while providing excellent thermal and electrical performance. The extremely wide viewing angle, typically 60 degrees, ensures uniform light distribution, which is critical for indicator and illumination applications. Compliance with AEC-Q101 stress test guidelines indicates a design focus on automotive-grade reliability, suggesting suitability for environments with stringent durability requirements. The primary target markets are automotive interior lighting, such as dashboard backlighting, switch illumination, and ambient lighting, as well as general-purpose indicators in consumer electronics and industrial controls where green status indication is required.

2. Technical Parameter Analysis

A deep and objective interpretation of the electrical, optical, and thermal parameters is essential for proper circuit design and application.

2.1 Photometric and Electrical Characteristics

The key operating parameters are specified at a junction temperature (Ts) of 25°C. The forward voltage (V_F) ranges from a minimum of 2.8V to a maximum of 3.5V, with a typical value of 3.2V when driven at a forward current (I_F) of 50mA. This voltage range is important for designing the current-limiting circuitry. The luminous intensity (I_V) is exceptionally high, ranging from 10,000 to 18,000 millicandelas (mcd) at the same test current. This high brightness enables the LED to be visible even in well-lit conditions. The dominant wavelength (W_d) specifies the perceived color of the light, ranging from 515 nm to 525 nm, which falls within the pure green region of the visible spectrum. The viewing angle (2θ_1/2) is 60 degrees, defined as the full angle at which the luminous intensity is half of the value at 0 degrees (on-axis).

2.2 Absolute Maximum Ratings and Derating

These are the stress limits beyond which permanent damage to the device may occur. The maximum continuous forward current (I_F) is 70 mA. However, the recommended operating condition is 50 mA, providing a safety margin. The peak forward current (I_FP) is 100 mA, but this is specified for pulsed operation only (with a 1/10 duty cycle and 10ms pulse width as noted). The maximum power dissipation (P_D) is 245 mW. This is a critical parameter for thermal management; the actual power dissipated is calculated as V_F * I_F. For example, at a typical V_F of 3.2V and I_F of 50mA, the power is 160 mW, which is within the limit. The reverse voltage (V_R) is limited to 5V, indicating the LED has limited reverse bias protection and should be protected in circuits where voltage reversal is possible. The operating and storage temperature range is from -40°C to +100°C, confirming its suitability for harsh automotive environments. The maximum junction temperature (T_J) is 120°C.

2.3 Thermal Characteristics and Management

The thermal resistance from junction to solder point (R_θJ-S) is specified as a maximum of 130 K/W. This parameter quantifies how effectively heat generated at the semiconductor junction is transferred to the PCB via the solder pads. A lower value indicates better heat dissipation. To prevent overheating, the junction temperature must be kept below 120°C. Designers must calculate the expected junction temperature rise using the formula: ΔT_J = P_D * R_θJ-S. Adequate PCB copper area (thermal pad design) and possibly airflow are necessary to maintain a safe operating temperature, especially when driving the LED at or near its maximum current.

3. Binning System Explanation

The product is classified into bins based on key parameters to ensure consistency in application. This allows designers to select LEDs with tight performance tolerances for their specific needs.

3.1 Forward Voltage (V_F) Binning

Forward voltage is binned in 0.1V steps across the range from 2.8V to 3.5V. Bins are labeled G1 (2.8-2.9V), G2 (2.9-3.0V), H1 (3.0-3.1V), H2 (3.1-3.2V), I1 (3.2-3.3V), I2 (3.3-3.4V), and J1 (3.4-3.5V). Using LEDs from the same V_F bin in parallel configurations helps ensure current sharing is more balanced.

3.2 Luminous Intensity (I_V) Binning

Luminous intensity is divided into three bins: R1 (10,000-12,000 mcd), R2 (12,000-15,000 mcd), and S1 (15,000-18,000 mcd). This allows for brightness matching in multi-LED arrays, preventing noticeable differences in light output.

3.3 Dominant Wavelength (W_d) Binning

The dominant wavelength, which defines the color hue, is binned into four ranges: D1 (515-517.5 nm), D2 (517.5-520 nm), E1 (520-522.5 nm), and E2 (522.5-525 nm). This tight binning ensures a consistent green color appearance, which is crucial for aesthetic applications.

4. Performance Curve Analysis

While the PDF provides a typical forward voltage vs. forward current (IV) curve, other characteristics can be inferred from the provided data.

4.1 IV (Current-Voltage) Characteristic Curve

The provided curve (Fig. 1-7) graphically shows the relationship between forward current and forward voltage. It will exhibit the typical exponential behavior of a diode. The curve is essential for understanding the dynamic resistance of the LED and for designing efficient driver circuits. The specified V_F at 50mA gives a specific operating point on this curve.

4.2 Temperature Dependence of Parameters

Although not explicitly graphed, it is a fundamental characteristic of LEDs that forward voltage decreases with increasing junction temperature (typically -2 mV/°C for InGaN). Conversely, luminous output generally decreases as temperature rises. The wide operating temperature range (-40°C to +100°C) implies the device is designed to minimize performance degradation across this span, but designers should account for reduced light output at high ambient temperatures.

4.3 Spectral Distribution

The dominant wavelength specification (515-525 nm) indicates a relatively narrow spectral peak in the green region. The spectral width (not specified) influences color purity. For a green InGaN LED, the spectrum is typically narrower than phosphor-converted white LEDs, resulting in a saturated green color.

5. Mechanical and Package Information

Accurate physical dimensions are critical for PCB footprint design and assembly.

5.1 Package Dimensions and Tolerances

The overall package dimensions are 3.50 mm in length, 2.80 mm in width, and 3.25 mm in height. All dimension tolerances are ±0.2 mm unless otherwise noted. The drawings show the top view, side view, and bottom view, detailing the lens shape, leadframe positioning, and overall geometry.

5.2 Recommended Solder Pad Design and Polarity Identification

A soldering pattern (Fig. 1-5) is provided as a guideline for PCB land pattern design. Adhering to this recommendation ensures proper solder joint formation and mechanical stability during reflow. The bottom view (Fig. 1-3) and polarity diagram (Fig. 1-4) clearly show the anode and cathode connections. The package typically has a molded notch or a marked cathode corner for visual polarity identification during placement.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering Instructions

The device is suitable for all standard SMT assembly and solder processes. The moisture sensitivity level (MSL) is rated as Level 2. This means the packaged devices are sealed in a moisture-resistant bag with a desiccant and have a floor life of 1 year at ≤ 30°C / 60% relative humidity (RH) after the bag is opened. For reflow soldering, it is critical to follow the recommended reflow profile compatible with the package's thermal mass and the PCB assembly. Peak temperature and time above liquidus must be controlled to avoid damaging the LED lens or the internal wire bonds. Pre-baking may be required if the exposure time exceeds the MSL Level 2 limits.

6.2 Handling and Storage Precautions

Static discharge protection is necessary. The Human Body Model (HBM) electrostatic discharge (ESD) withstand voltage is 2000V. While this offers basic protection, standard ESD handling procedures (e.g., grounded workstations, wrist straps) should always be used. Storage should be within the specified temperature range (-40°C to +100°C) in a dry environment. Avoid applying mechanical stress to the lens.

7. Packaging and Ordering Information

7.1 Packaging Specification for Automated Handling

The product is supplied on tape and reel for compatibility with high-speed pick-and-place machines. The carrier tape dimensions, reel dimensions, and label form specifications are detailed to ensure compatibility with standard feeder systems. The use of embossed carrier tape protects the LED lenses during transport and handling.

7.2 Moisture Resistant Packing and Carton Box

For long-term storage and shipping, the reels are packaged in moisture barrier bags with desiccant to maintain the MSL Level 2 rating. These bags are then packed in cardboard boxes designed to provide physical protection. The box labeling includes information such as part number, quantity, lot code, and date code for traceability.

8. Application Recommendations and Design Considerations

8.1 Typical Application Scenarios

The primary stated applications are automotive interior lighting (e.g., instrument cluster backlighting, HVAC control illumination, door switch lights) and general switches. The high brightness and reliability also make it suitable for industrial control panel indicators, consumer appliance status lights, and outdoor signage where green indication is needed.

8.2 Critical Design Considerations

• Current Control: Always use a constant current driver or a current-limiting resistor in series with the LED. The forward current must not exceed 70 mA DC.
• Thermal Management: Connect the thermal pad (if present) to a sufficient copper area on the PCB to conduct heat away. Monitor the junction temperature in high-ambient or high-current applications.
• Optical Design: The 60-degree viewing angle provides wide illumination. For focused beams, secondary optics (lenses) may be required.
• ESD and Reverse Voltage Protection: Incorporate protection diodes or circuits if the LED is in an environment prone to voltage transients or reverse connection.

9. Technical Comparison and Differentiation

Compared to generic through-hole green LEDs, this device offers significant advantages: surface-mount design for automated assembly, a much higher luminous intensity (10-18k mcd vs. typically sub-1k mcd for basic LEDs), and automotive-grade reliability (AEC-Q101 based qualification). Within the PLCC4 SMD LED family, its differentiation lies in its specific combination of high brightness in the green spectrum, tight binning for color and brightness consistency, and a robust package designed for demanding thermal environments. The explicit compliance with RoHS and REACH environmental directives is also a key market differentiator.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What resistor value should I use to drive this LED from a 5V supply?

A: Using Ohm's Law and the typical V_F of 3.2V at 50mA: R = (V_supply - V_F) / I_F = (5V - 3.2V) / 0.05A = 36Ω. Use a standard 36Ω or 39Ω resistor rated for at least (5V-3.2V)*0.05A = 0.09W (a 0.125W or 0.25W resistor is recommended).

Q: Can I pulse this LED to achieve higher apparent brightness?

A: Yes, the peak forward current rating is 100 mA at a 1/10 duty cycle. Pulsing at a higher current with a low duty cycle can increase peak luminous intensity, but the average current must not exceed the maximum continuous rating, and the junction temperature must be managed.

Q: How does temperature affect the light output?

A: Like all LEDs, luminous output typically decreases as junction temperature increases. For precise applications, derating curves (not provided in this datasheet but a general characteristic) should be consulted or testing should be conducted at the expected operating temperature.

11. Practical Use Cases

Case Study: Automotive Center Console Illumination: A designer needs to illuminate several buttons and a rotary knob in a car's center console. They select this LED for its high brightness (ensuring visibility in daytime), green color (matching the vehicle's theme), and AEC-Q101 implied reliability. Multiple LEDs are placed on a flexible PCB. By specifying LEDs from the same V_F and I_V bin (e.g., H2 and R2), consistent brightness and color across all buttons are achieved. The SMT package allows for automated assembly, reducing cost. The thermal pad is connected to a copper pour on the PCB to dissipate heat, as the enclosed console environment can get warm.

12. Principle of Operation Introduction

This LED operates on the principle of electroluminescence in a semiconductor p-n junction. The active region is composed of InGaN (Indium Gallium Nitride). When a forward voltage exceeding the diode's turn-on voltage is applied, electrons and holes are injected into the active region from the n-type and p-type layers, respectively. These charge carriers recombine, releasing energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light. For this device, the alloy is tuned to emit photons in the green wavelength range (515-525 nm). The epoxy lens of the PLCC4 package encapsulates the chip, providing mechanical protection, shaping the light output beam, and enhancing light extraction efficiency.

13. Development Trends in LED Technology

The trend in LED technology for indicator and signaling applications continues toward higher efficiency (more light output per watt of electrical input), improved reliability under harsh conditions, and miniaturization of packages while maintaining or increasing optical power. For automotive interiors, there is a growing demand for customizable lighting (color and intensity) and integration with smart control systems. The qualification to standards like AEC-Q101 is becoming a baseline requirement for components used in vehicles. Furthermore, environmental regulations are pushing for further reduction or elimination of hazardous substances beyond RoHS, influencing material choices in LED packaging. The development of new semiconductor materials and phosphors also aims to fill gaps in the color spectrum and improve color rendering where needed.