PLCC-6 Amber LED A09K-PA1501H-AM Datasheet - Phosphor Converted Amber - 3.15V Typ. - 150mA - 7100mcd - English Technical Document

1. Product Overview

The A09K-PA1501H-AM is a high-performance, surface-mount LED component designed for demanding automotive lighting applications. It utilizes a Phosphor Converted Amber (PCA) technology to produce a distinct amber color output. The device is housed in a compact PLCC-6 (Plastic Leaded Chip Carrier) package, which is a standard footprint for SMD LEDs, offering good thermal management and ease of assembly in automated production lines. Its primary design focus is on reliability and performance under the harsh environmental conditions typical of automotive use.

The core advantages of this LED include its high typical luminous intensity of 7100 millicandelas (mcd) at a standard drive current of 150mA, which ensures excellent visibility. It features a wide 120-degree viewing angle, providing a broad and uniform light distribution. Furthermore, it is qualified to the stringent AEC-Q101 standard for discrete semiconductor components, ensuring it meets the automotive industry's requirements for quality and reliability over temperature, humidity, and operational life.

The target market is exclusively automotive exterior lighting, with a specific application in turning signal lights. Compliance with RoHS and REACH directives confirms its environmental friendliness, while its specified sulfur robustness is a critical feature for longevity in environments where corrosive gases may be present.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Color Characteristics

The key photometric parameter is the Luminous Intensity (I_V), specified with a minimum of 5600 mcd, a typical value of 7100 mcd, and a maximum of 11200 mcd when driven at 150mA. The typical value is the expected performance under standard conditions. The wide range between min and max highlights the natural variation in semiconductor manufacturing, which is managed through the binning system described later. The measurement tolerance for luminous flux is \u00b18%.

The color is defined by its Chromaticity Coordinates on the CIE 1931 diagram: CIE x = 0.57 and CIE y = 0.42. This places the output firmly in the amber region. The tolerance for these coordinates is very tight at \u00b10.005, ensuring consistent color appearance from device to device, which is crucial for automotive lighting where color matching across multiple LEDs is often required.

2.2 Electrical Characteristics

The Forward Voltage (V_F) is a critical parameter for circuit design. At 150mA, the typical V_F is 3.15V, with a range from 2.50V (Min) to 3.75V (Max). Designers must ensure the driver circuit can accommodate this range, especially the maximum value, to provide sufficient voltage headroom. The forward current (I_F) has an absolute maximum rating of 200mA, but the recommended continuous operating current is 150mA.

The device is not designed for reverse bias operation. Its Electrostatic Discharge (ESD) sensitivity is rated at 8kV (Human Body Model), which is a robust level, reducing the risk of damage during handling and assembly.

2.3 Thermal and Absolute Maximum Ratings

Thermal management is vital for LED performance and lifetime. The Thermal Resistance from the junction to the solder point is specified in two ways: the real thermal resistance (R_{thJS real}) is \u2264 60 K/W, and the electrical method (R_{thJS el}) is \u2264 45 K/W. This parameter indicates how effectively heat is conducted away from the LED chip; a lower value is better. The maximum permissible junction temperature (T_J) is 125\u00b0C.

The Absolute Maximum Ratings define the limits beyond which permanent damage may occur. Key ratings include: Power Dissipation (P_d) of 750 mW, Operating Temperature (T_opr) from -40\u00b0C to +110\u00b0C, and a Surge Current (I_FM) capability of 750mA for pulses \u2264 10\u03bcs. The soldering temperature rating allows for reflow soldering at 260\u00b0C for up to 30 seconds, which is compatible with standard lead-free soldering profiles.

3. Binning System Explanation

To manage the inherent manufacturing variations, LEDs are sorted into performance bins. This datasheet outlines three key binning categories.

3.1 Luminous Intensity Binning

The luminous intensity is binned using an alphanumeric code system (e.g., L1, L2, M1... up to GA). Each bin covers a specific range of minimum and maximum luminous intensity in millicandelas (mcd). For the A09K-PA1501H-AM, the highlighted possible output bins are DB (5600-7100 mcd), EA (7100-9000 mcd), and EB (9000-11200 mcd). This allows customers to select parts that meet their specific brightness requirements.

3.2 Color (Chromaticity) Binning

The amber color is binned according to its CIE x and y coordinates. The datasheet provides a bin structure diagram and a table with specific coordinate boundaries for bins labeled YA and YB. For example, Bin YA has a target coordinate of (0.5680, 0.4315) with defined boundaries. This ensures tight color control within the amber spectrum.

3.3 Forward Voltage Binning

The forward voltage is also binned, although the specific bin codes and ranges are not fully detailed in the provided excerpt. Typically, voltage bins (e.g., V1, V2, V3) group LEDs with similar V_F characteristics, which helps in designing more consistent driver circuits, especially when multiple LEDs are connected in series.

4. Performance Curve Analysis

The datasheet includes several graphs that illustrate how the LED's performance changes with operating conditions.

4.1 Spectral Distribution and Radiation Pattern

The Relative Spectral Distribution graph shows the light output as a function of wavelength. For a phosphor-converted amber LED, this curve typically has a broad peak in the yellow-amber region, generated by the phosphor excited by a blue or near-UV LED chip. The Typical Diagram Characteristics of Radiation depicts the spatial intensity distribution, confirming the 120-degree viewing angle where the intensity drops to half of its peak value.

4.2 Current Dependencies

The Forward Current vs. Forward Voltage curve shows the non-linear relationship between I_F and V_F. As current increases, voltage increases, but the rate of increase slows down. The Relative Luminous Intensity vs. Forward Current graph shows that light output increases with current but may not be perfectly linear, especially at higher currents due to heating effects. The Chromaticity Coordinates Shift vs. Forward Current graph indicates how the color point (CIE x, y) changes slightly with drive current, which is important for color stability in dimming or pulsed operation.

4.3 Temperature Dependencies

The Relative Forward Voltage vs. Junction Temperature curve shows that V_F decreases linearly as temperature increases (a negative temperature coefficient), which is characteristic of semiconductor junctions. This property can sometimes be used for temperature sensing. The Relative Luminous Intensity vs. Junction Temperature graph is critical; it shows that light output decreases as the junction temperature rises. Effective heat sinking is therefore essential to maintain brightness. The Chromaticity Coordinates Shift vs. Junction Temperature graph shows the minor change in color with temperature.

4.4 Derating and Pulse Operation

The Forward Current Derating Curve dictates the maximum allowable continuous forward current as a function of the solder pad temperature. As the pad temperature increases, the maximum safe current decreases. For example, at 110\u00b0C pad temperature, the maximum current is only 67mA. The Permissible Pulse Handling Capability graph defines the peak pulse current (I_F(A)) that can be applied for a given pulse width (t_p) and duty cycle (D), which is useful for PWM dimming applications.

5. Mechanical, Packaging & Assembly Information

5.1 Mechanical Dimensions

The LED comes in a standard PLCC-6 package. The mechanical drawing (implied by the 'Mechanical Dimension' section title) would provide precise length, width, height, lead spacing, and tolerances. This information is essential for PCB footprint design and ensuring proper fit within the assembly.

5.2 Recommended Soldering Pad and Polarity

The 'Recommended Soldering Pad' section provides the optimal PCB land pattern (pad geometry) to ensure reliable soldering, good thermal conduction, and proper alignment. The PLCC-6 package has a built-in polarity key (usually a chamfered corner or a dot) to indicate the cathode, preventing incorrect installation.

5.3 Reflow Soldering Profile

A recommended reflow soldering profile is provided, specifying the time-temperature relationship the PCB assembly should undergo. This typically includes preheat, soak, reflow (peak temperature of 260\u00b0C max for 30s as per rating), and cooling stages. Adhering to this profile is crucial to avoid thermal damage to the LED or poor solder joints.

5.4 Packaging Information

This details how the LEDs are supplied (e.g., on tape and reel), including reel dimensions, pocket spacing, and orientation. This information is necessary for configuring automated pick-and-place machines.

6. Application Guidelines & Design Considerations

6.1 Typical Application: Automotive Turning Signal

This LED is explicitly designed for automotive exterior lighting, particularly turning signals. In this application, the high luminous intensity and wide viewing angle ensure the signal is visible from a broad range of angles to other drivers. The amber color is a regulatory requirement for turn signals in most regions. The AEC-Q101 qualification and sulfur robustness directly address the reliability needs for under-hood or exterior-mounted lighting modules that experience temperature extremes, vibration, humidity, and exposure to road chemicals.

6.2 Circuit Design Considerations

• Current Drive: Use a constant-current driver, not a constant-voltage source, to ensure stable light output and prevent thermal runaway. The driver should be set for the desired operating current (e.g., 150mA) and must accommodate the maximum V_F of 3.75V plus some headroom.
• Thermal Management: The PCB must act as a heat sink. Use a board with sufficient copper area (thermal pad) connected to the LED's thermal path, as defined in the recommended soldering pad layout. For high-power or high-ambient-temperature applications, additional thermal vias or an external heatsink may be necessary to keep the junction temperature below 125\u00b0C and maintain light output.
• ESD Protection: While rated at 8kV HBM, standard ESD precautions during handling and assembly should still be followed.
• Optics: For the turning signal application, a lens or reflector will be used to shape the beam according to regulatory photometric patterns (e.g., SAE/ECE standards). The wide 120-degree viewing angle of the LED is beneficial for achieving these patterns.

6.3 Precautions for Use

The 'Precaution for Use' section (not fully detailed in excerpt) typically includes warnings about: avoiding mechanical stress on the lens, not touching the lens with bare hands to prevent contamination, storing in appropriate conditions (controlled temperature and humidity), and ensuring cleanliness of the soldering pads to avoid soldering defects.

7. Ordering Information

The part number A09K-PA1501H-AM follows a specific coding system. While the exact breakdown isn't provided, it typically encodes package type (PLCC-6), color (PA for Phosphor Converted Amber), performance bin(s) for intensity, color, and voltage (implied by 1501H), and possibly special features or revisions. The 'Ordering Information' section would clarify this and list any available variants.

8. Technical Comparison and Differentiation

Compared to a standard non-automotive amber LED, the key differentiators of the A09K-PA1501H-AM are:

• AEC-Q101 Qualification: This involves a suite of stress tests (high-temperature operating life, temperature cycling, humidity resistance, etc.) that generic LEDs do not undergo, guaranteeing reliability for automotive use.
• Sulfur Robustness: Specialized materials and construction to resist corrosion from sulfur-containing gases found in some automotive environments (e.g., from rubber or certain gaskets).
• Tight Parameter Control and Binning: Tighter tolerances and comprehensive binning ensure consistent performance necessary for automotive lighting systems, where multiple LEDs must match in brightness and color.
• Extended Temperature Range: Rated for operation from -40\u00b0C to +110\u00b0C, far exceeding the commercial temperature range (typically 0\u00b0C to +70\u00b0C).

9. FAQ Based on Technical Parameters

Q: Can I drive this LED at 200mA continuously?
A: No. The Absolute Maximum Rating for forward current is 200mA, but this is a stress limit, not a recommended operating condition. The recommended continuous operating current is 150mA (Typ.) as per the Characteristics table. Continuous operation at 200mA would exceed the power dissipation rating and likely cause rapid degradation or failure.

Q: The luminous intensity bin is DB (5600-7100 mcd). What intensity will I actually get?
A: You will receive LEDs whose tested luminous intensity falls within the DB bin range. The specific value for each LED will be between 5600 and 7100 mcd when measured under the standard test condition (I_F=150mA, T_s=25\u00b0C). For design, you should use the minimum value (5600 mcd) to guarantee system performance.

Q: How do I determine the required heatsinking?
A: Use the thermal resistance (R_thJS \u2264 60 K/W) and the power dissipation. At 150mA and a typical V_F of 3.15V, power P = 0.4725W. The temperature rise from junction to solder pad is \u0394T = P * R_thJS = 0.4725W * 60 K/W = ~28.4K. If your maximum ambient temperature is 85\u00b0C and you want T_J < 110\u00b0C, then the solder pad temperature must be kept below (110 - 28.4) = 81.6\u00b0C. The PCB thermal design must ensure the pad stays below this temperature.

Q: Can I use PWM for dimming?
A: Yes, pulse-width modulation is a common and effective method for dimming LEDs. Refer to the 'Permissible Pulse Handling Capability' graph to ensure your chosen peak current, pulse width, and duty cycle are within the safe operating area. Typically, for PWM, the peak current is kept at or below the DC rating, and the average current over time determines the perceived brightness.

10. Operating Principle and Technology

The A09K-PA1501H-AM is a Phosphor Converted Amber (PCA) LED. Its operating principle involves two stages of light conversion. The core is a semiconductor chip (typically based on InGaN) that emits light in the blue or near-ultraviolet spectrum when forward biased (electroluminescence). This primary light is not amber. A carefully formulated phosphor coating is applied directly over this chip. When the high-energy blue/UV photons from the chip strike the phosphor particles, they are absorbed. The phosphor then re-emits light at a longer, lower-energy wavelength through a process called photoluminescence. The specific phosphor composition is engineered to produce a broad spectrum of light centered in the amber region. The combination of any unconverted blue light and the phosphor's amber emission results in the final perceived amber color, defined by the CIE (0.57, 0.42) coordinates. This technology allows for the creation of saturated colors like amber that are difficult to produce directly from a semiconductor material.