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LTC-4627JG LED Display Datasheet - 0.4-inch Digit Height - Green (571nm) - 2.6V Forward Voltage - 70mW Power - English Technical Document

Complete technical datasheet for the LTC-4627JG, a 0.4-inch quadruple-digit seven-segment AlInGaP green LED display. Includes specifications, ratings, pinout, dimensions, and application cautions.
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PDF Document Cover - LTC-4627JG LED Display Datasheet - 0.4-inch Digit Height - Green (571nm) - 2.6V Forward Voltage - 70mW Power - English Technical Document

1. Product Overview

The LTC-4627JG is a quadruple-digit, seven-segment alphanumeric display module designed for applications requiring clear, bright numeric and limited character readouts. Its primary function is to visually represent numbers and some letters through individually addressable segments. The core technology utilizes AlInGaP (Aluminum Indium Gallium Phosphide) LED chips grown on a non-transparent GaAs substrate. This material system is chosen for its high efficiency and excellent performance in the green-yellow wavelength region. The display features a gray face with white segment markings, providing high contrast for optimal readability under various lighting conditions. The 0.4-inch (10.0 mm) digit height makes it suitable for medium-distance viewing in instrumentation, industrial controls, and consumer electronics where space is at a premium but clarity is essential.

1.1 Key Features and Advantages

1.2 Device Identification and Configuration

The part number LTC-4627JG specifies a multiplexed, common-anode display with AlInGaP green LEDs. The \"JG\" suffix typically indicates the green color and specific package or feature set. The display includes four full digits (0-9) and a right-hand decimal point for each digit. It employs a multiplexed common anode configuration, which reduces the number of required driver pins by time-sharing the common connections for each digit.

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended for normal use.

2.2 Electrical & Optical Characteristics

These are typical operating parameters measured at an ambient temperature (Ta) of 25°C, providing the expected performance under normal conditions.

3. Mechanical & Package Information

3.1 Package Dimensions

The display conforms to a standard dual in-line package (DIP) footprint. All critical dimensions are provided in millimeters with a general tolerance of ±0.25 mm unless otherwise specified on the dimensional drawing. This includes the overall length, width, and height, the spacing between digits, the segment dimensions, and the pin spacing and diameter. The exact mechanical drawing is essential for PCB (Printed Circuit Board) layout to ensure proper fit and alignment with the front panel cutout.

3.2 Pin Configuration and Internal Circuit

The device has a 16-pin configuration, though not all positions are populated (pins 10 and 12 are \"NO PIN\"). The internal circuit diagram shows a multiplexed common anode structure. Each of the four digits has its own common anode pin (pins 1, 2, 6, 8). The segment cathodes (A-G, DP) are shared across all digits. Additionally, there are connections for three separate indicator LEDs (L1, L2, L3) which share a common anode (pin 4) and have cathodes tied to segment cathodes A/B/C respectively. Pin 9 is noted as \"NO CONNECTION.\" This pinout is crucial for designing the multiplexing driver circuit, which sequentially energizes each digit's common anode while presenting the segment data for that digit on the shared cathode lines.

4. Application Guidelines and Cautions

4.1 Design and Usage Considerations

Intended Use: This display is designed for ordinary electronic equipment in office, communication, and household applications. For safety-critical systems (aviation, medical, transportation), consultation prior to use is mandatory.

Ratings Compliance: Adherence to Absolute Maximum Ratings is essential to prevent damage. The manufacturer assumes no liability for failures resulting from non-compliance.

Current and Thermal Management: Exceeding recommended drive currents or operating temperatures will accelerate light output degradation (lumen depreciation) and can lead to premature failure. Constant current driving is strongly recommended over constant voltage driving to ensure stable brightness and longevity, as it compensates for the LED's negative temperature coefficient and VF variation.

Circuit Protection: The driving circuit must incorporate protection against reverse voltages and voltage transients during power cycling. Reverse bias can induce metal migration within the semiconductor, increasing leakage or causing shorts.

Forward Voltage Consideration: The power supply and current-limiting circuitry must be designed to deliver the intended drive current across the entire range of possible VF values (from Min to Max).

Environmental Factors: Rapid ambient temperature changes, especially in humid environments, should be avoided as they can cause condensation on the display, potentially leading to electrical or optical issues.

Mechanical Handling: Avoid applying abnormal force to the display body during assembly. If a decorative film is applied, ensure it does not make tight contact with the front panel/cover, as external force may shift it.

Binning for Consistency: When assembling multiple displays in one unit, using devices from the same luminous intensity bin is recommended to prevent noticeable brightness or hue differences between units.

Reliability Testing: If the end product requires the display to undergo specific drop or vibration tests, the conditions should be shared with the manufacturer for evaluation beforehand.

4.2 Storage and Handling Conditions

Standard Storage (DIP Package): Products in original packaging should be stored at 5°C to 30°C with relative humidity below 60% RH. Non-compliance can lead to pin oxidation, requiring replating before use. Long-term storage of large inventories is discouraged. If the moisture barrier bag has been open for more than 6 months, baking at 60°C for 48 hours is recommended, followed by assembly within one week.

SMD Display Storage (Note): While this is a DIP part, the datasheet includes a note for SMD variants: once the factory-sealed bag is opened, the device should be used within 168 hours (7 days) when stored at <60% RH and 5-30°C, corresponding to a Moisture Sensitivity Level (MSL) of 3. This highlights the importance of moisture control for modern LED packages.

5. Performance Curves and Graphical Data

The datasheet references typical performance curves which are essential for detailed design analysis. These graphs visually represent the relationship between key parameters, allowing engineers to interpolate values not explicitly listed in the tables. While the specific curves are not detailed in the provided text, they typically include:

Relative Luminous Intensity vs. Forward Current (I-V Curve): Shows how light output increases with drive current, usually in a sub-linear fashion at higher currents due to thermal effects.

Forward Voltage vs. Forward Current: Illustrates the diode's exponential I-V characteristic.

Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the decrease in light output as junction temperature rises, a critical factor for thermal design.

Spectral Distribution: A plot of relative intensity versus wavelength, showing the peak at ~571nm and the spectral width. These curves enable designers to optimize drive conditions, predict performance under non-standard temperatures, and understand the color characteristics of the LED.

6. Typical Application Scenarios and Design Notes

The LTC-4627JG is ideally suited for applications requiring a compact, reliable, and bright numeric display. Common uses include:

Test and Measurement Equipment: Digital multimeters, frequency counters, power supplies, where 4 digits provide sufficient resolution.

Industrial Control Panels: Process indicators, timer displays, counter readouts on machinery.

Consumer Appliances: Microwave ovens, audio equipment, climate control systems.

Automotive Aftermarket Displays: Gauges and readouts where environmental robustness is needed.

Design Implementation: Implementing this display requires a microcontroller or dedicated driver IC capable of multiplexing. The driver must source sufficient current for the common anode pins (digit current = segment current * number of lit segments in that digit) and sink current for the segment cathode pins. Current-limiting resistors are mandatory for each segment cathode when using a constant voltage supply. A well-designed multiplexing routine with appropriate persistence and refresh rate (typically >60 Hz) is necessary to avoid flicker. The wide viewing angle makes it suitable for panels viewed from various positions.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.