Red LED 2.7x2.0x0.6mm - Forward Voltage 2.0-2.6V - Power 2.184W - Wavelength 617nm - Automotive Grade

1. Product Overview

1.1 General Description

The red source color devices are made with AlGaInP (Aluminum Gallium Indium Phosphide) on substrate light emitting diode. The product package dimensions are 2.7 mm x 2.0 mm x 0.6 mm (length x width x height). The LED is encapsulated in an EMC (Epoxy Molding Compound) package which provides excellent reliability and thermal performance.

1.2 Features

• EMC Package for robust mechanical and thermal properties.
• Extremely wide viewing angle of 120 degrees.
• Suitable for all SMT assembly and solder processes.
• Available on tape and reel for automated pick-and-place.
• Moisture Sensitivity Level: Level 2 (MSL 2).
• Compliance with RoHS and REACH regulations.
• Qualifications based on AEC-Q102 stress test qualification for automotive grade discrete semiconductors.

1.3 Applications

Automotive lighting interior and exterior applications including interior ambient lighting, exterior signal lamps, tail lights, turn indicators, and other lighting functions requiring high reliability.

2. Technical Parameters Deep Analysis

2.1 Electro-Optical Characteristics (Ts=25°C)

At a forward current of 700 mA, the LED exhibits the following typical electrical and optical characteristics:

• Forward Voltage (VF): 2.0 V (min) to 2.6 V (max). This voltage range is controlled through binning.
• Reverse Current (IR): Maximum 10 μA at reverse voltage of 5 V.
• Luminous Flux (Φ): 105 lm (min) to 140 lm (max) at 700 mA. High luminous efficacy is achieved through efficient chip design.
• Dominant Wavelength (Wd): 612.5 nm (min), 617 nm (typical), 620 nm (max). This places the emission in the red region of the visible spectrum.
• Viewing Angle (2θ1/2): 120 degrees (typical). The wide beam angle ensures uniform light distribution.
• Thermal Resistance (RTHJ-S): Maximum 15 °C/W. Low thermal resistance aids in heat dissipation to the solder joint.

2.2 Absolute Maximum Ratings

The device must not be operated beyond these limits to avoid permanent damage:

• Power Dissipation (PD): 2184 mW
• Forward Current (IF): 840 mA
• Peak Forward Current (IFP): 1000 mA (1/10 duty cycle, 10 ms pulse width)
• Reverse Voltage (VR): 5 V
• Electrostatic Discharge (ESD, HBM): 2000 V (90% yield; proper handling required)
• Operating Temperature (TOPR): -40 °C to +125 °C
• Storage Temperature (TSTG): -40 °C to +125 °C
• Junction Temperature (TJ): 150 °C (max)

2.3 Bin Range of Forward Voltage and Luminous Flux

To ensure consistency, each LED is sorted into bins based on forward voltage, luminous flux, and wavelength at IF=700 mA:

Forward Voltage Bins:

• C0: 2.0 V – 2.2 V
• D0: 2.2 V – 2.4 V
• E0: 2.4 V – 2.6 V

Luminous Flux Bins:

• SA: 105 lm – 117 lm
• SB: 117 lm – 130 lm
• TA: 130 lm – 140 lm

Dominant Wavelength Bins:

• 612.5 – 615 nm
• 615 – 617.5 nm
• 617.5 – 620 nm

Customers should specify desired bins for their application. Binning code on label (e.g., VF: D0, Flux: SB, Wavelength: 615-617.5) ensures traceability.

3. Performance Curve Analysis

3.1 Forward Voltage vs Forward Current (I-V Curve)

The characteristic curve shows exponential increase of forward current with forward voltage. At 700 mA, VF lies between 2.0 and 2.6 V. The curve shape is typical for AlGaInP diodes.

3.2 Forward Current vs Relative Intensity

Relative luminous intensity increases linearly at low currents and gradually saturates at higher currents due to heating. At 700 mA, relative intensity is near 100%, providing optimal efficiency.

3.3 Solder Temperature vs Relative Intensity

As the solder point temperature (Ts) increases from 20°C to 120°C, the relative intensity drops to about 80%, indicating significant thermal droop. Proper heat sinking is required to maintain brightness.

3.4 Solder Temperature vs Forward Current (Derating)

The maximum allowed forward current must be derated as temperature rises to keep junction temperature below 150°C. At Ts=100°C, approximately 600 mA is allowed.

3.5 Forward Voltage vs Solder Temperature

Forward voltage decreases linearly with increasing temperature (negative temperature coefficient). This helps balance currents in parallel strings but must be accounted for in design.

3.6 Radiation Diagram

The LED emits light over a wide angle of 120° (full width half maximum). The radiation pattern is Lambertian-like, suitable for uniform area illumination.

3.7 Forward Current vs Dominant Wavelength

Increasing forward current from 0 to 250 mA causes a slight redshift of about 2 nm. This effect is minimal but can be considered in color-critical applications.

3.8 Spectrum Distribution

The emission spectrum peaks around 617 nm with a narrow full width half maximum (FWHM) of approximately 20 nm, typical for red AlGaInP LEDs. No secondary peaks in the UV or IR range.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED package has a top view dimensions of 2.70 mm x 2.00 mm and a height of 0.60 mm. Bottom view shows two anode (A) and cathode (C) pads with dimensions 1.30 mm x 0.45 mm spaced 1.20 mm apart. Polarity is marked on the package. Recommended soldering pattern includes thermal pads for heat dissipation.

4.2 Carrier Tape Dimensions

The carrier tape has pocket dimensions: A0=2.10±0.1 mm, B0=3.05±0.1 mm, K0=0.75±0.1 mm. Tape width W=8.0±0.2 mm. Sprocket holes: D0=1.55±0.05 mm, E=1.75±0.1 mm, P0=4.0±0.1 mm, P1=4.0±0.1 mm, P2=2.0±0.1 mm, F=3.5±0.1 mm, D1=1.0±0.1 mm.

4.3 Reel Dimensions

Reel dimensions: hub diameter 12±0.1 mm, outer diameter 180±1 mm, width 60±1 mm, spindle hole 13.0±0.5 mm.

4.4 Label Specifications

Each reel and moisture barrier bag is labeled with part number, spec number, lot number, bin codes (for flux, chromaticity, voltage, wavelength), quantity, and date code.

5. Soldering and Assembly Guide

5.1 SMT Reflow Soldering Profile

The recommended reflow soldering profile ensures reliable solder joints without damaging the LED. Key parameters: Preheat from 150°C to 200°C for 60-120 seconds; ramp-up to 217°C; time above 217°C: max 60 seconds; peak temperature 260°C for max 10 seconds; cooling rate max 6°C/s. Do not perform more than two reflow cycles. If more than 24 hours separate two reflows, the LED may absorb moisture and be damaged.

5.2 Repairing

Repairing after soldering is discouraged. If unavoidable, use a double-head soldering iron and verify impact on LED characteristics.

5.3 Cautions

• The silicone encapsulant is soft; avoid pressure on top surface.
• Do not mount on warped PCB or bend after soldering.
• Avoid mechanical stress and vibration during cooling.
• Do not rapidly cool the device after soldering.

6. Packaging and Ordering Information

6.1 Packaging Specification

Standard packaging: 4000 pieces per reel. Each reel is sealed in a moisture barrier bag with desiccant and humidity indicator card.

6.2 Moisture Resistant Packing

The reel is placed in a moisture barrier bag with label. The bag is vacuum-sealed to prevent moisture ingress.

6.3 Cardboard Box

Multiple reels are packed in a cardboard box for shipping. The box is labeled with product information.

6.4 Reliability Test Items and Conditions

Criteria: VF change ≤ 10% of USL, IR ≤ 200% of USL, flux ≥ 70% of LSL.

6.5 Criteria for Judging Damage

After reliability tests, the LED is considered failed if forward voltage exceeds 1.1 times the upper specification limit (USL), reverse current exceeds 2.0 times USL, or luminous flux drops below 0.7 times the lower specification limit (LSL).

7. Application Recommendations

When designing with this red LED, consider the following:

• Thermal Management: Use adequate copper area on PCB and ensure good thermal contact to keep solder joint temperature within limits. Junction temperature must not exceed 150°C.
• Current Limiting: A current limiting resistor or constant current driver is essential to prevent current runaway due to negative VF temperature coefficient.
• ESD Protection: Use ESD protection devices (e.g., TVS diodes) and follow ESD-safe handling procedures.
• Environmental Restrictions: The environment and mating materials must have sulfur content below 100 ppm, bromine and chlorine each below 900 ppm, and total below 1500 ppm. Avoid VOCs that can discolor the silicone.
• Storage: Store unopened bags at ≤30°C, ≤75% RH for up to 1 year. After opening, use within 24 hours at ≤30°C, ≤60% RH. Bake at 60±5°C for >24 hours if exceeding these limits.

8. Technical Comparison

Compared to conventional red LEDs using PPA or PCT packages, this EMC-packaged device offers superior thermal stability, wider beam angle, and lower thermal resistance. The AEC-Q102 qualification ensures automotive-grade reliability. The tight binning in voltage, flux, and wavelength provides better uniformity for mass production.

9. Frequently Asked Questions

1. Q: What is the typical forward voltage at 700 mA? A: It falls between 2.0 V and 2.6 V depending on the bin. Most common bins are around 2.2-2.4 V.
2. Q: Can I drive this LED with pulsed current? A: Yes, peak current up to 1000 mA allowed with 1/10 duty cycle and 10 ms pulse width.
3. Q: Is this LED suitable for outdoor automotive lights? A: Yes, it is qualified to AEC-Q102 and can withstand -40°C to +125°C.
4. Q: How should I handle moisture sensitivity? A: Follow MSL2 procedures. Bake if necessary.
5. Q: Can I use ultrasonic cleaning? A: Not recommended; use isopropyl alcohol if cleaning is required.

10. Practical Application Cases

Case 1: Automotive Tail Light. Multiple red LEDs are placed in an array to achieve required tail light brightness. Series-parallel configuration with current balancing resistors. Proper heat sinking through metal-core PCB.

Case 2: Interior Ambient Lighting. Red LEDs used for mood lighting. PWM dimming controlled by microcontroller. Wide viewing angle ensures uniform illumination.

11. Working Principle

The LED is based on an AlGaInP heterostructure grown on a GaAs substrate. When a forward voltage is applied, electrons from the n-side and holes from the p-side recombine in the active region, emitting photons with energy corresponding to the bandgap. The composition of the AlGaInP layer is tuned to achieve red emission around 617 nm. The substrate absorbs shorter wavelengths, and the EMC package protects the chip and provides light extraction.

12. Development Trends

The automotive lighting industry is moving towards higher efficiency, miniaturization, and integration of smart functions. LEDs with smaller packages (like this 2.7x2.0 mm) enable thinner light modules. Advances in chip technology continue to improve luminous efficacy. Additionally, increased adoption of full LED tail lights and matrix headlights drives demand for reliable, AEC-Q102 qualified components. This product aligns with these trends by offering tight binning, high reliability, and a compact footprint.