Red LED 3030 3.0x3.0x0.55mm SMD 2.6V 2.184W AlGaInP Automotive Specification Sheet - English Technical Document

1. Product Overview

This document details the specifications for a high-performance red surface-mount device (SMD) light-emitting diode (LED). The device is a 3.0mm x 3.0mm x 0.55mm package designed for demanding applications, particularly within the automotive sector. Its core technology is based on an Aluminum Gallium Indium Phosphide (AlGaInP) semiconductor material, which is known for producing high-efficiency and stable red, orange, and yellow light.

1.1 Core Advantages and Product Positioning

This LED is positioned as a robust solution for automotive-grade illumination. Its primary advantages include a compact footprint, high luminous output, and adherence to stringent automotive reliability standards. The use of an Epoxy Molding Compound (EMC) package enhances thermal performance and long-term reliability compared to traditional plastics. With a wide 120-degree viewing angle, it is suitable for both functional and decorative lighting where uniform light distribution is required.

1.2 Target Market and Application Scenarios

The primary target market is the automotive industry. Specific applications include, but are not limited to:

• Exterior Lighting: Rear combination lamps (tail lights, stop lights), center high-mount stop lights (CHMSL), side marker lights.
• Interior Lighting: Dashboard backlighting, ambient mood lighting, switch illumination, reading lights, and various indicator lights within the cabin.

The product's qualification plan is based on AEC-Q102, the industry-standard stress test qualification for automotive-grade discrete optoelectronic semiconductors, underscoring its suitability for the harsh environmental conditions of automotive use.

2. In-Depth Technical Parameter Analysis

The following sections provide a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified for this LED.

2.1 Photometric and Optical Characteristics

All optical parameters are measured at a standard test condition of a 25°C case temperature (Ts) and a forward current (IF) of 700mA, which is considered the typical operating point.

• Luminous Flux (Φ): The total visible light output ranges from a minimum of 105 lumens (lm) to a maximum of 144 lm. This high output is characteristic of high-power AlGaInP LEDs in this package size.
• Dominant Wavelength (λD): The primary color of the emitted light falls within the range of 612.5 nm to 620 nm. This corresponds to a red color, specifically in the longer wavelength (more orange-red) part of the red spectrum.
• Viewing Angle (2θ1/2): The half-intensity angle is typically 120 degrees. This very wide beam pattern is achieved through the LED's chip design and dome-less package structure, providing a broad, even illumination suitable for many automotive lighting functions.

2.2 Electrical Characteristics

• Forward Voltage (VF): At 700mA, the forward voltage has a range of 2.0V (min) to 2.6V (max). This relatively low voltage is efficient and helps minimize power dissipation. The measurement tolerance for this parameter is ±0.1V.
• Reverse Current (IR): With a 5V reverse bias applied, the leakage current is limited to a maximum of 10 µA, indicating good diode characteristics.

2.3 Thermal Characteristics and Maximum Ratings

Proper thermal management is critical for LED performance and longevity. Key thermal parameters include:

• Thermal Resistance (R_thJ-S): Two values are provided.
  • Real (measured): Typically 8.3 °C/W (max 13.3 °C/W). This is the thermal resistance from the semiconductor junction to the solder point under real operating conditions.
  • Electrical (calculated): Typically 5 °C/W (max 8 °C/W). This is often derived from the change in forward voltage with temperature and provides an alternative measurement method.
  These values indicate how effectively heat can be transferred from the LED chip to the printed circuit board (PCB). Lower values are better.
• Maximum Junction Temperature (T_J): The absolute maximum allowable temperature at the semiconductor junction is 150°C. Continuous operation at or near this temperature will drastically reduce lifetime.
• Power Dissipation (P_D): The maximum allowable power dissipation is 2184 mW. The actual operating power is calculated as Forward Current (I_F) × Forward Voltage (V_F). For example, at 700mA and 2.6V, power is 1820 mW, which is within the limit.
• Forward Current Ratings: The maximum continuous forward current (I_F) is 840 mA. The peak forward current (I_FP) for pulsed operation (10ms pulse width, 1/10 duty cycle) is 1000 mA.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted (binned) based on key parameters. This product utilizes a two-dimensional binning system for forward voltage and luminous flux at 700mA.

3.1 Voltage and Luminous Flux Binning

The binning matrix (Table 1-3 in the source) organizes devices as follows:

• Forward Voltage Bins (Columns): C0 (2.0-2.2V), D0 (2.2-2.4V), E0 (2.4-2.6V).
• Luminous Flux Bins (Rows): SA, SB (specific lumen ranges are implied but not explicitly listed in the provided excerpt, typically representing different output levels, e.g., SA for higher flux).

Designers must specify the required V_F/Flux bin combination when ordering to guarantee the electrical and brightness uniformity needed for their application, especially in multi-LED arrays.

4. Performance Curve Analysis

While the specific graphical data is referenced but not detailed in the provided text, typical optical characteristic curves for such an LED would include:

• Relative Luminous Intensity vs. Forward Current (I_F): Shows how light output increases with current, typically in a sub-linear relationship at higher currents due to thermal effects.
• Forward Voltage vs. Forward Current (I-V Curve): Demonstrates the diode's turn-on characteristic and operating voltage at different currents.
• Luminous Flux vs. Junction Temperature: Illustrates the decrease in light output as the LED's junction temperature rises, highlighting the importance of thermal management.
• Spectral Power Distribution: A graph showing the intensity of light emitted at each wavelength, confirming the dominant wavelength and spectral width (typically narrow for a monochromatic LED like this).

These curves are essential for designing the driver circuitry and thermal system to achieve optimal and stable performance over the product's lifetime.

5. Mechanical and Package Information

5.1 Dimensions and Drawings

The LED has a square footprint of 3.0mm x 3.0mm with a height of 0.55mm. Key dimensions include a lens size of approximately 2.60mm x 2.60mm. All dimensional tolerances are ±0.2mm unless otherwise specified.

5.2 Pad Design and Polarity Identification

The recommended solder pad pattern is provided to ensure reliable soldering and proper heat sinking. The LED has an anode and a cathode. Polarity is clearly marked on the device itself (typically with a notch, bevel, or marker on the cathode side). Correct polarity is crucial during assembly, as applying reverse voltage can damage the LED.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering Instructions

The device is suitable for all standard Surface Mount Technology (SMT) assembly processes. Specific reflow profiles should be developed according to the solder paste manufacturer's recommendations. Key considerations include:

• Peak Temperature: Must not exceed the maximum temperature rating of the LED package (inferred from storage temperature, typically 125°C for the body, but reflow peak is usually higher for a short time). Standard lead-free (SAC) profiles are generally applicable.
• Time Above Liquidus (TAL): Should be controlled to minimize thermal stress on the component.

6.2 Handling and Storage Precautions

• Moisture Sensitivity Level (MSL): This component is rated MSL Level 2. This means it can be exposed to factory ambient conditions (≤ 30°C / 60% RH) for up to one year. If the original dry-pack bag is opened or exceeded this time, the devices must be baked before reflow soldering according to IPC/JEDEC standards to prevent popcorn cracking during reflow.
• Electrostatic Discharge (ESD): The device has an ESD withstand voltage of 2000V (Human Body Model). Standard ESD precautions should still be followed during handling and assembly.
• Storage Conditions: -40°C to +125°C in a dry environment.

7. Packaging and Ordering Information

7.1 Packaging Specifications

The LEDs are supplied on tape and reel for automated assembly.

• Carrier Tape: Standard EIA-481 compliant tape with pockets sized for the 3030 package.
• Reel Dimensions: Standard reel sizes (e.g., 7-inch or 13-inch diameter) are used, with quantities per reel specified.
• Labeling: Each reel includes a label with part number, quantity, lot number, and bin code information.

7.2 Moisture Barrier Packaging

For MSL Level 2 components, the reels are packaged in moisture barrier bags with desiccant and humidity indicator cards to protect them during shipping and storage.

8. Application Design Recommendations

8.1 Key Design Considerations

• Current Drive: Use a constant-current driver, not a constant-voltage source, for stable and consistent light output. The design should operate at or below 700mA continuous for optimal lifetime, considering the application's thermal environment.
• Thermal Management: This is the most critical aspect for high-power LEDs. The PCB must have adequate thermal design:
  • Use a thermally conductive PCB (e.g., metal-core PCB (MCPCB) or FR4 with thermal vias).
  • Ensure the recommended solder pad pattern is used to maximize heat transfer.
  • Design for sufficient airflow or heatsinking to keep the LED junction temperature well below the 150°C maximum, ideally below 85-105°C for long life.
• Optical Design: The wide 120-degree viewing angle may or may not require secondary optics (lenses) depending on the application. For signaling functions, optics may be needed to meet specific photometric requirements (intensity distribution patterns).

9. Frequently Asked Questions Based on Technical Parameters

1. Q: Can I drive this LED at 840mA continuously?
   A: The 840mA rating is an absolute maximum. Continuous operation at this current is only possible with exceptional thermal management that keeps the junction temperature within limits. For reliability and lifetime, operating at or below the 700mA typical test current is strongly recommended.
2. Q: Why are there two different thermal resistance values?
   A: The two values result from different measurement methodologies (real vs. electrical). The higher \"real\" value (8.3 °C/W typ) is more conservative and should be used for worst-case thermal design calculations to ensure a safe margin.
3. Q: How do I select the correct V_F bin for my design?
   A: If your design uses multiple LEDs in series, choose the same V_F bin (e.g., all D0) to ensure they share current equally when driven by a constant current source. For parallel strings, consider matching V_F bins or using separate current regulators for each string.
4. Q: What is the impact of junction temperature on performance?
   A: As junction temperature rises, luminous flux decreases (typically around -0.5% to -1% per °C for AlGaInP red LEDs), forward voltage slightly decreases, and the long-term degradation rate accelerates exponentially. Effective cooling directly impacts brightness stability and product lifespan.

10. Technical Overview and Context

10.1 Operating Principle

This LED is based on AlGaInP semiconductor technology. When a forward voltage is applied, electrons and holes recombine in the active region of the semiconductor chip, releasing energy in the form of photons (light). The specific composition of the Aluminum, Gallium, Indium, and Phosphide layers determines the bandgap energy and thus the wavelength (color) of the emitted light, which in this case is in the 612-620 nm red range.

10.2 Trends in Automotive LED Technology

The use of LEDs in automotive lighting continues to grow due to advantages in energy efficiency, design flexibility, durability, and long life. Trends include higher luminous efficacy (more lumens per watt), improved high-temperature performance, and tighter color and brightness binning for homogeneous appearance in multi-LED systems. Packaging innovations, like the EMC package used here, focus on better thermal management and resistance to environmental stress (temperature cycling, humidity), which are critical for meeting stringent automotive reliability standards like AEC-Q102.