Red LED 3030 - Dimensions 3.0x3.0x0.55mm - Voltage 2.0-2.6V - Power 520mW - English Technical Document

1. Product Overview

1.1 General Description

This red LED is manufactured using AlGaInP technology on a substrate, providing high efficiency and brightness. The package is an EMC type with dimensions of 3.0 mm x 3.0 mm x 0.55 mm, allowing for compact design and good thermal performance. The device is designed for automotive applications and complies with AEC-Q102 reliability standards.

1.2 Features

• EMC package for robust performance
• Extremely wide viewing angle of 120 degrees
• Suitable for all SMT assembly and solder processes
• Available on tape and reel for automated placement
• Moisture sensitivity level: Level 2
• RoHS compliant
• Qualified per AEC-Q102 for automotive grade

1.3 Applications

The LED is intended for automotive lighting, both interior and exterior. Examples include dashboard indicators, map lights, brake lights, turn signals, and ambient lighting.

2. Technical Parameter Deep Interpretation

2.1 Electrical and Optical Characteristics

At a test current of 150 mA and a solder temperature of 25°C, the forward voltage (VF) ranges from 2.0 V to 2.6 V, with a typical value not specified due to binning. The reverse current (IR) at 5 V is less than 10 µA. The luminous flux (Φ) ranges from 17.7 lm to 24.2 lm. The dominant wavelength (λD) is between 627.5 nm and 635 nm, characteristic of red light. The viewing angle (2θ1/2) is 120 degrees, providing wide beam spread. The thermal resistance from junction to solder (Rth JS real) is typically 40 °C/W, with a maximum of 55 °C/W; the electrical thermal resistance is typically 23 °C/W, maximum 31 °C/W.

2.2 Absolute Maximum Ratings

The absolute maximum ratings at 25°C solder temperature: power dissipation (PD) 520 mW, forward current (IF) 200 mA, peak forward current (IFP) 350 mA (10% duty cycle, 10 ms pulse width), reverse voltage (VR) 5 V, ESD (HBM) 2000 V, operating temperature range -40°C to +125°C, storage temperature -40°C to +125°C, junction temperature (TJ) 150°C. It is critical to never exceed these limits to prevent damage.

2.3 Thermal Characteristics

Thermal resistance is a key parameter for LED reliability. The real thermal resistance (Rth JS real) accounts for both conductive and convective paths. The electrical thermal resistance (Rth JS el) is derived from electrical measurements. Proper heat sinking is required to keep junction temperature below maximum. The photoelectric conversion efficiency at 25°C in pulse mode is 45%.

3. Binning System

3.1 Forward Voltage Bins

At 150 mA, forward voltage is binned as follows: C0: 2.0-2.2 V, D0: 2.2-2.4 V, E0: 2.4-2.6 V.

3.2 Luminous Flux Bins

Luminous flux bins: JB: 17.7-19.6 lm, KA: 19.6-21.8 lm, KB: 21.8-24.2 lm.

3.3 Dominant Wavelength Bins

Dominant wavelength bins: F2: 627.5-630 nm, G1: 630-632.5 nm, G2: 632.5-635 nm.

4. Performance Curve Analysis

4.1 Forward Voltage vs Forward Current

The I-V curve shows the typical exponential relationship. At low current (30 mA), voltage is around 1.9 V; at 200 mA, voltage reaches about 2.6 V. This curve is essential for designing driver circuits.

4.2 Forward Current vs Relative Luminous Flux

Relative luminous flux increases with forward current approximately linearly up to 150 mA, then begins to saturate. At 200 mA, relative flux is about 80% higher than at 100 mA. This indicates droop at high currents.

4.3 Junction Temperature vs Relative Luminous Flux

As junction temperature increases, relative luminous flux decreases. At 125°C, flux is about 60% of the value at 25°C. This thermal droop must be considered in thermal design.

4.4 Solder Temperature vs Forward Current

This curve shows the maximum allowable forward current versus solder temperature. At 25°C, current can be 200 mA; at 125°C, it must be derated to about 50 mA to avoid overheating.

4.5 Voltage Shift vs Junction Temperature

The forward voltage decreases with increasing temperature, approximately -2 mV/°C. At 150°C, VF drops by about 0.3 V relative to 25°C.

4.6 Radiation Diagram

The radiation pattern shows a wide, Lambertian-like distribution with maximum intensity at 0 degrees and half-intensity at ±60 degrees, confirming the 120-degree viewing angle.

4.7 Dominant Wavelength Shift vs Junction Temperature

The dominant wavelength shifts slightly with temperature, about +0.03 nm/°C, resulting in a small red shift at higher temperatures.

4.8 Spectrum Distribution

The spectrum peaks around 630 nm with a full width at half maximum (FWHM) of about 20 nm. The emission is narrow, contributing to high color purity.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The package outline: 3.00 mm x 3.00 mm x 0.55 mm. Tolerances are ±0.2 mm unless noted. Detailed drawings show the top view with cathode and anode markings, side view showing height, and bottom view with pad layout.

5.2 Soldering Pattern

Recommended soldering pattern dimensions: pad size 0.65 mm x 1.55 mm, spacing 2.30 mm, with overall pattern width 2.40 mm. Proper alignment ensures good solder joint reliability.

5.3 Polarity

Polarity is indicated by a marking on the package. The cathode is typically marked with a notch or dot. Ensure correct orientation during assembly.

5.4 Carrier Tape Dimensions

The carrier tape width is 8.00 mm, with pocket pitch of 4.00 mm. Components are oriented with polarity facing a specific direction. Tolerances are ±0.1 mm.

5.5 Reel Dimensions

Reel diameter 180 mm, hub diameter 60 mm, width 12 mm. Each reel contains 4000 pieces.

5.6 Label Specification

The label includes part number, spec number, lot number, bin code, luminous flux, chromaticity bin, forward voltage, wavelength, quantity, and date code.

5.7 Moisture Resistant Packing

The LEDs are packed in a moisture barrier bag with desiccant and a humidity indicator card. After opening, use within 24 hours or bake at 60°C for 24 hours.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering Profile

The recommended lead-free reflow profile: ramp-up rate max 3°C/s, preheat from 150°C to 200°C for 60-120 seconds, time above 217°C max 60 seconds, peak temperature 260°C for max 10 seconds, cooling rate max 6°C/s. Total time from 25°C to peak not to exceed 8 minutes. Do not reflow more than twice, and maintain less than 24 hours between reflows.

6.2 Repairing

Repair is not recommended after soldering. If necessary, use a double-head soldering iron. Test to ensure no damage to LED characteristics.

6.3 Cautions

• The silicone encapsulant is soft; avoid applying pressure on top surface during handling and pick-and-place.
• Do not mount on warped PCB or bend the PCB after soldering.
• Avoid mechanical stress or vibration during cooling.
• Do not rapidly cool the device after reflow.

7. Packaging and Ordering Information

7.1 Packaging Quantity

Standard packaging is 4000 pieces per reel. Bulk orders are packed in cardboard boxes containing multiple reels.

7.2 Ordering Code

The part number encodes product series, package, and bin options. Customers can specify desired bins for forward voltage, luminous flux, and wavelength to meet application requirements.

8. Application Suggestions

8.1 Typical Applications

The LED is ideal for automotive interior lighting such as dome lights, reading lights, and ambient lighting, as well as exterior lighting like tail lights, turn signals, and brake lights. Its wide viewing angle and high brightness suit signage and decorative lighting as well.

8.2 Design Considerations

• Thermal management: Use adequate PCB copper area and thermal vias to keep junction temperature below 150°C.
• Current regulation: Use constant current driver with series resistor or LED driver IC to avoid exceeding maximum current.
• ESD protection: Implement ESD protection devices if operating in high-ESD environments.
• Material compatibility: Avoid materials containing sulfur (>100 ppm), bromine (>900 ppm), chlorine (>900 ppm), or total halogens (>1500 ppm) near the LED, as they can cause corrosion or discoloration.
• Outgassing: Do not use adhesives that emit volatile organic compounds (VOCs) that can penetrate the silicone lens.

9. Technical Comparison (Optional)

Compared to standard plastic leaded LEDs, this EMC package offers better thermal conductivity, smaller size, and compatibility with reflow soldering. The wide 120-degree viewing angle is wider than many standard SMD LEDs (typically 110 degrees). The AEC-Q102 qualification provides assurance for harsh automotive environments where temperature and vibration are extreme.

10. Frequently Asked Questions

1. Q: What is the maximum current for this LED? A: Absolute maximum forward current is 200 mA DC, or 350 mA pulsed (10% duty, 10 ms).
2. Q: Can it be used in high-temperature environments? A: Operating temperature range is -40°C to +125°C, but derating of current is necessary at high temperatures (see derating curve).
3. Q: What is the storage condition? A: Store in original sealed bag at ≤30°C and ≤75% RH for up to 1 year; after opening, use within 24 hours or bake at 60°C.
4. Q: How many times can it be reflow soldered? A: Not more than two times, with interval <24 hours.
5. Q: Is it suitable for outdoor use? A: Yes, with proper encapsulation, but ensure it is not exposed to harsh chemicals or UV without protection.

11. Practical Cases

In an automotive brake light application, an array of 6-8 LEDs in series can produce over 100 lumens, meeting regulatory brightness requirements. With proper thermal management, the LEDs maintain stable light output over the vehicle's lifetime. Another case is interior ambient lighting where the wide viewing angle ensures uniform illumination across the cabin.

12. Principle Introduction

The AlGaInP red LED works by electron-hole recombination in the active layer of the semiconductor. The material system allows tuning of the bandgap to emit red light (around 630 nm). The EMC package protects the chip while providing optical lens for light extraction. The device exhibits high quantum efficiency due to the direct bandgap.

13. Development Trends

The trend in automotive lighting is towards smaller, more efficient, and reliable LEDs. EMC packages are becoming standard due to their robustness. There is also a move towards higher flux per chip to reduce the number of LEDs needed. Furthermore, integrated photonic modules and smart lighting with communication capabilities are emerging.