Red LED Specification - 3.50mm x 2.80mm x 1.85mm Package - 2.0V-2.6V Forward Voltage - 182mW Power - English Technical Datasheet

1. Product Overview

\n

This document provides the technical specifications for a high-brightness red Light Emitting Diode (LED). The device is constructed using AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material epitaxially grown on a substrate, which is a standard technology for producing efficient red, orange, and yellow LEDs. The primary application focus for this component is in the automotive sector, where reliability and performance under harsh conditions are paramount.

\n

1.1 Product Positioning and Core Advantages

\n

This LED is positioned as a robust solution for automotive interior and exterior lighting, as well as backlighting for switches and indicators. Its core advantages stem from its design and qualification:

\n

\n
• High Reliability for Automotive Use: The product qualification test plan is based on the AEC-Q102 standard, which defines stress test requirements for discrete optoelectronic semiconductors in automotive applications. This ensures the LED can withstand the temperature extremes, vibration, and long-term operational demands of a vehicle.
\n
• Wide Viewing Angle: The package design produces an extremely wide viewing angle, ensuring uniform illumination and visibility from various positions, which is crucial for signal and indicator lights.
\n
• SMT Compatibility: The component is fully compatible with standard Surface-Mount Technology (SMT) assembly and solder reflow processes, allowing for high-speed, automated PCB (Printed Circuit Board) assembly.
\n
• Environmental Compliance: The device is compliant with RoHS (Restriction of Hazardous Substances) directives and has a Moisture Sensitivity Level (MSL) of Level 2, indicating it requires baking if exposed to ambient air for more than one year prior to soldering.
\n

\n

1.2 Target Market and Applications

\n

The primary target market is the automotive industry. Specific applications include, but are not limited to:

\n

\n
• Automotive Exterior Lighting: Center High-Mount Stop Lights (CHMSL), side marker lights, and other signal functions where a red color is required.
\n
• Automotive Interior Lighting: Dashboard indicators, switch backlighting, and ambient lighting.
\n
• General Switch Backlighting: Applicable in various electronic devices and control panels beyond automotive.
\n

\n

2. In-Depth Technical Parameter Analysis

\n

2.1 Photometric and Optical Characteristics (Ts=25°C, IF=50mA)

\n

The key performance metrics define the light output and color of the LED under standard test conditions. All measurements are typically taken with a pulsed current to minimize heating effects.

\n

\n
• Dominant Wavelength (λD): Ranges from 612.5 nm to 625 nm. This places the LED's output firmly in the red portion of the visible spectrum. The specific wavelength affects the perceived hue of the red light.
\n
• Luminous Intensity (Iv): Ranges from 2300 mcd (millicandela) to 4300 mcd at 50mA. This is a measure of the LED's brightness as perceived by the human eye. The high intensity makes it suitable for applications requiring high visibility, even in daylight.
\n
• Viewing Angle (2θ1/2): The typical full viewing angle at half intensity is 120 degrees. This wide angle is a characteristic of the PLCC (Plastic Leaded Chip Carrier) package with a domed lens, which diffuses the light effectively.
\n

\n

2.2 Electrical and Thermal Characteristics

\n

Understanding the electrical boundaries and thermal behavior is critical for reliable circuit design and ensuring the LED's longevity.

\n

\n
• Forward Voltage (VF): Between 2.0V and 2.6V at a forward current (IF) of 50mA. This relatively low voltage drop is efficient and simplifies drive circuitry. Designers must account for this range when selecting current-limiting resistors or designing constant-current drivers.
\n
• Absolute Maximum Ratings: These are stress limits that must never be exceeded, even momentarily.\n
  \n
  • Continuous Forward Current (IF): 70 mA.
  \n
  • Peak Forward Current (IFP): 100 mA (at 1/10 duty cycle, 10ms pulse width).
  \n
  • Power Dissipation (PD): 182 mW. This is the maximum power the package can handle, calculated as VF * IF.
  \n
  • Reverse Voltage (VR): 5 V. Exceeding this can instantly damage the LED junction.
  \n
  • Operating/Storage Temperature (TOPR / TSTG): -40°C to +110°C.
  \n
  • Junction Temperature (TJ): Maximum 125°C. The core temperature of the semiconductor chip itself.
  \n
  \n
\n
• Thermal Resistance (Rth): This parameter indicates how effectively heat travels from the semiconductor junction to the solder point. A lower value is better.\n
  \n
  • Rth JS (real): Typical 150 °C/W, Max 170 °C/W. This is the thermal resistance under real operating conditions.
  \n
  • Rth JS (electrical): Typical 80 °C/W, Max 90 °C/W. This is a measured value under specific electrical test conditions (50mA, 25°C ambient).
  \n
  \n
\n

\n

Design Implication: The datasheet explicitly warns that the maximum operating current must be determined after measuring the package temperature during operation to ensure the junction temperature (TJ) does not exceed 125°C. Poor PCB thermal design (e.g., insufficient copper area for heat sinking) can lead to premature failure due to overheating, even if the electrical current is within limits.

\n

3. Binning System Explanation

\n

LEDs are sorted into performance groups, or \"bins,\" based on key parameters measured during production. This ensures consistency for the end user. This product uses a three-dimensional binning system.

\n

3.1 Forward Voltage Binning (VF)

\n

LEDs are sorted into six voltage bins (C1, C2, D1, D2, E1, E2), each representing a 0.1V range from 2.0V to 2.6V. This allows designers to select LEDs with tighter voltage tolerances for applications requiring uniform brightness when driven by a constant voltage source.

\n

3.2 Luminous Intensity Binning (Iv)

\n

The light output is sorted into three intensity bins (N2, O1, O2) at the 50mA test current:\n

\n
• N2: 2300 - 2800 mcd
\n
• O1: 2800 - 3500 mcd
\n
• O2: 3500 - 4300 mcd
\n

\nThis binning is crucial for applications where multiple LEDs are used together and need to have matched brightness, such as in light bars or arrays.

\n

3.3 Wavelength Binning (WD)

\n

The dominant wavelength is sorted into five bins (C2, D1, D2, E1, E2), each spanning 2.5 nm from 612.5 nm to 625 nm. This ensures color consistency across a batch of LEDs, which is especially important for aesthetic and signaling applications.

\n

4. Performance Curve Analysis

\n

While the datasheet references \"Typical Optical Characteristics Curves,\" the provided tables allow for logical analysis of expected performance trends.

\n

4.1 Current vs. Voltage (I-V) Characteristic

\n

Based on the forward voltage specification, the I-V curve for this AlGaInP LED will show a sharp turn-on at approximately 1.8V to 2.0V, rising steeply to the operating point defined at 50mA (between 2.0V and 2.6V). The curve is non-linear and temperature-dependent; voltage typically decreases as junction temperature increases for a given current.

\n

4.2 Temperature vs. Luminous Intensity

\n

Like all LEDs, the light output of this device decreases as the junction temperature increases. This is known as thermal quenching. The exact derating curve is not provided, but designers must account for this effect, especially in high-temperature environments like automotive engine compartments or enclosures with poor ventilation. Maintaining a low thermal resistance from the LED to the environment is key to preserving brightness.

\n

5. Mechanical and Package Information

\n

5.1 Package Dimensions and Drawings

\n

The device uses a PLCC-4 (Plastic Leaded Chip Carrier, 4-pin) package. Key dimensions from the drawings are:\n

\n
• Overall Package Size: 3.50 mm (Length) x 2.80 mm (Width) x 1.85 mm (Height). All tolerances are ±0.05 mm unless otherwise specified.
\n
• Lead Frame Pad Size: The bottom pads measure 2.60 mm x 1.60 mm.
\n
• Cavity / Lens Dimensions: The top aperture is 2.40 mm in diameter.
\n

\n

\n

5.2 Polarity Identification and Soldering Land Pattern

\n

The package includes a polarity mark, typically a chamfered corner or a dot on the top surface, to identify Pin 1. The recommended PCB land pattern (soldering footprint) is provided to ensure proper solder joint formation and mechanical stability during reflow. Following this pattern is essential for self-alignment during the soldering process and for reliable thermal and electrical connection.

\n

6. Soldering and Assembly Guidelines

\n

6.1 SMT Reflow Soldering Instructions

\n

The LED is suitable for all SMT processes. As an MSL Level 2 component, it must be used within 12 months of the bag seal date or baked before soldering if exposed beyond that. A standard lead-free (SnAgCu) reflow profile is recommended, with a peak temperature typically not exceeding 260°C for a very short time (e.g., 10-30 seconds above 240°C). The exact profile must be verified with the solder paste manufacturer's specifications.

\n

6.2 Handling and Storage Precautions

\n

Key precautions include:\n

\n
• ESD Protection: The device has an ESD withstand voltage of 2000V (HBM). Standard ESD precautions (wrist straps, conductive mats, grounded equipment) should always be used during handling.
\n
• Moisture Control: Adhere to MSL Level 2 handling procedures to prevent \"popcorning\" (package cracking) during reflow caused by trapped moisture vaporizing.
\n
• Avoid Mechanical Stress: Do not apply force to the dome lens, as it can crack or detach.
\n
• Cleaning: If cleaning is required after soldering, use compatible solvents that do not damage the plastic package or lens. Consult the manufacturer for recommended cleaning agents.
\n

\n

\n

7. Packaging and Ordering Information

\n

7.1 Reel and Tape Specifications

\n

The product is supplied on tape and reel for automated pick-and-place assembly. The carrier tape dimensions (pocket size, pitch) and reel dimensions (diameter, hub size) are specified to be compatible with standard SMT equipment feeders.

\n

7.2 Moisture Barrier Bag and Labeling

\n

The reels are packaged in moisture barrier bags with desiccant to maintain the MSL rating. The outer label specification includes critical information such as part number, quantity, date code, and bin codes for luminous intensity, voltage, and wavelength.

\n

8. Application Design Considerations

\n

8.1 Drive Circuit Design

\n

For optimal performance and longevity, drive the LED with a constant current source rather than a constant voltage with a series resistor, especially in automotive applications where the supply voltage (e.g., 12V) can vary significantly. A constant current driver ensures stable brightness and protects the LED from current spikes. If using a resistor, calculate its value based on the maximum supply voltage and the minimum forward voltage from the bin to avoid exceeding the absolute maximum current rating.

\n

8.2 Thermal Management on PCB

\n

To manage the thermal resistance and keep the junction temperature low:\n

\n
• Use the recommended soldering land pattern.
\n
• Connect the thermal pad (if electrically connected to a lead) to a large area of copper on the PCB. This copper acts as a heat sink.
\n
• Use multiple thermal vias to transfer heat from the top layer to internal or bottom copper layers.
\n
• In high-power or high-ambient-temperature applications, consider using a metal-core PCB (MCPCB) for superior heat dissipation.
\n

\n

\n

9. Technical Comparison and Differentiation

\n

Compared to a standard PLCC red LED not qualified for automotive use, this product's key differentiators are:\n

\n
• AEC-Q102 Qualification: This is the most significant advantage, involving a suite of rigorous tests (high-temperature operating life, temperature cycling, humidity resistance, etc.) that guarantee reliability in automotive environments.
\n
• Extended Temperature Range: Operational from -40°C to +110°C, suitable for under-hood and exterior lighting applications.
\n
• Tighter Parameter Control and Binning: Likely features more controlled manufacturing and sorting processes to meet automotive OEM requirements for consistency.
\n

\n

\n

10. Frequently Asked Questions (FAQ)

\n

Q: Can I drive this LED directly from a 5V or 12V supply?\n
A: No. You must use a current-limiting mechanism. For a 5V supply, a series resistor is common. For 12V (automotive), a resistor can be used but is inefficient and brightness will vary with voltage; a constant-current driver or buck converter is strongly recommended.

\n

Q: What does \"Moisture Sensitivity Level 2\" mean for my production?\n
A: It means the LEDs, once removed from their sealed moisture barrier bag, must be soldered within 1 year of factory packing under ambient conditions (<30°C/60%RH). If exceeded, they require baking (e.g., 125°C for 24 hours) before reflow to remove absorbed moisture.

\n

Q: How do I interpret the bin codes (e.g., O1, D2, E1) on the label?\n
A: Refer to Table 1-3 in the datasheet. \"O1\" indicates the luminous intensity bin (2800-3500 mcd), \"D2\" indicates the forward voltage bin (2.3-2.4V), and \"E1\" indicates the wavelength bin (620-622.5 nm).

\n

11. Practical Application Example

\n

Scenario: Designing a Center High-Mount Stop Light (CHMSL)\n
Design Steps:\n

\n
1. Brightness Requirement: Determine the required luminous intensity per LED. Select an appropriate Iv bin (e.g., O2 for maximum brightness).
\n
2. Color Consistency: For a uniform red appearance, specify a tight wavelength bin (e.g., D2 only: 617.5-620 nm).
\n
3. Circuit Design: Design a constant-current driver circuit that delivers 50mA to each series/parallel string of LEDs, accounting for the automotive 12V (nominal) supply that can range from 9V to 16V.
\n
4. PCB Layout: Use the recommended land pattern. Design the PCB with generous copper pours connected to the LED pads to act as a heat spreader. Place the LEDs with adequate spacing to prevent thermal crosstalk.
\n
5. Thermal Verification: Prototype the board and measure the LED case temperature under worst-case conditions (high ambient temperature, maximum supply voltage). Ensure the calculated junction temperature (TJ = Tcase + (Rth JS * Power)) remains below 125°C.
\n

\n

\n

12. Technology Principle

\n

This LED is based on AlGaInP semiconductor technology. The active region consists of layers of Aluminum Gallium Indium Phosphide alloys grown on a substrate (likely GaAs). When a forward voltage is applied, electrons and holes are injected into the active region where they recombine, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy and thus the wavelength of the emitted light, which in this case is in the red spectrum (612-625 nm). The PLCC package incorporates a reflective cup to direct light upward and a molded epoxy lens to shape the beam and provide a wide viewing angle.

\n

13. Industry Trends

\n

The automotive lighting market continues to evolve, with trends impacting components like this LED:\n

\n
• Increased LED Penetration: LEDs are replacing incandescent bulbs in more vehicle functions due to their efficiency, longevity, and design flexibility.
\n
• Demand for Higher Reliability: As LEDs are used in more safety-critical applications (e.g., headlights, adaptive driving beams), the demand for AEC-Q102 qualified components with proven long-term reliability data is growing.
\n
• Miniaturization: There is a constant push for smaller package sizes with equal or greater light output to enable sleeker, more integrated lighting designs.
\n
• Smart Lighting: The integration of LEDs with sensors and control electronics for adaptive and communicative lighting systems is a key trend, though this device is a basic emitter component within such a system.
\n

\n