2020 Cube Light Red LED Datasheet - 2.0x2.0x0.8mm - 2.3V - 0.115W - English Technical Document

1. Product Overview

The 2020 Cube Light is a high-reliability, surface-mount device (SMD) LED designed primarily for demanding automotive lighting applications. This component is part of a product family engineered to meet stringent automotive industry standards, including AEC-Q102 qualification. The device features a compact 2020 footprint (2.0mm x 2.0mm) and is characterized by its red light emission, making it suitable for various signal, indicator, and interior lighting functions within vehicles. Its core advantages include robust construction for harsh environments, compliance with environmental regulations (RoHS, REACH, Halogen-Free), and consistent performance across a wide operating temperature range.

2. Technical Parameter Analysis

2.1 Photometric & Electrical Characteristics

The LED's key performance metrics are defined under typical operating conditions of a 50mA forward current (IF) and a 25°C thermal pad temperature. The typical luminous flux (IV) is 8 lumens, with a minimum of 5 lm and a maximum of 13 lm, subject to an 8% measurement tolerance. The dominant wavelength (λd) is typically 616 nm, placing it in the red spectrum, with a range from 612 nm to 627 nm (±1nm tolerance). The device offers a wide 120° viewing angle (φ), with a tolerance of ±5°, ensuring good visibility from off-axis positions. Electrically, the typical forward voltage (VF) is 2.3V at 50mA, ranging from 1.75V to 2.75V (±0.05V tolerance).

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage may occur. The absolute maximum forward current (IF) is 75 mA. The device can handle a surge current (IFM) of 400 mA for pulses ≤10 μs with a very low duty cycle (D=0.005). The maximum power dissipation (Pd) is 206.25 mW. The junction temperature (TJ) must not exceed 150°C. The operating and storage temperature range is specified from -40°C to +125°C, confirming its suitability for automotive environments. The LED is not designed for reverse voltage operation. It has an ESD sensitivity (HBM) rating of 2 kV.

2.3 Thermal Characteristics

Thermal management is critical for LED performance and longevity. The datasheet specifies two thermal resistance values from the junction to the solder point: a \"real\" thermal resistance (Rth JS real) of 36 K/W (max 42 K/W) and an \"electrical\" thermal resistance (Rth JS el) of 25 K/W (max 29 K/W). The difference likely stems from the measurement method. The forward current derating curve clearly shows that the maximum allowable forward current must be reduced as the solder pad temperature increases above 25°C to prevent exceeding the maximum junction temperature.

3. Binning System Explanation

The LED is sorted into bins based on three key parameters to ensure consistency in production runs and for design matching.

3.1 Luminous Flux Binning

Flux bins are designated with codes E2 through E5. For example, bin E3 covers luminous flux from 6 lm to 8 lm, while bin E4 covers 8 lm to 10 lm. This allows designers to select LEDs with a specific brightness range for their application.

3.2 Forward Voltage Binning

Voltage bins, coded as 1720, 2022, 2225, and 2527, categorize LEDs based on their forward voltage drop. Bin 2022, for instance, includes LEDs with a VF between 2.0V and 2.25V. This is crucial for designing efficient driver circuits and ensuring uniform current distribution in multi-LED arrays.

3.3 Dominant Wavelength Binning

Wavelength bins, coded from 1215 to 2427, group LEDs by their specific shade of red. Bin 1518, for example, includes LEDs with a dominant wavelength between 615 nm and 618 nm. This ensures color consistency in applications where precise hue matching is important.

4. Performance Curve Analysis

The datasheet provides several graphs detailing performance under varying conditions.

4.1 IV Curve and Relative Luminous Flux

The Forward Current vs. Forward Voltage graph shows a non-linear relationship, typical for LEDs. The voltage increases with current. The Relative Luminous Flux vs. Forward Current graph indicates that light output increases sub-linearly with current, emphasizing the importance of operating at or near the recommended test current (50mA) for optimal efficiency.

4.2 Temperature Dependence

The Relative Forward Voltage vs. Junction Temperature graph shows that VF decreases linearly as temperature increases (negative temperature coefficient), which can be used for junction temperature estimation. The Relative Luminous Flux vs. Junction Temperature graph demonstrates that light output decreases as temperature rises, a critical factor for thermal design. The Dominant Wavelength Shift vs. Junction Temperature graph shows a positive shift (towards longer wavelengths) with increasing temperature.

4.3 Spectral Distribution and Pulse Handling

The Wavelength Characteristics graph shows a single, narrow peak in the red region (~616 nm), confirming a monochromatic source. The Permissible Pulse Handling Capability graph defines the maximum allowable surge current for various pulse widths and duty cycles, which is vital for designing circuits that may experience transient conditions.

5. Mechanical & Package Information

5.1 Physical Dimensions

The mechanical drawing specifies the LED package dimensions. The body size is 2.0mm x 2.0mm with a typical height of 0.8mm. Tolerances are generally ±0.1mm unless otherwise noted. The drawing includes details on the lens shape and the location of the thermal pad and electrical terminals.

5.2 Recommended Solder Pad Layout

A separate drawing provides the optimal footprint for PCB design. It details the pad dimensions for the anode, cathode, and the central thermal pad. Adhering to this layout is essential for reliable soldering, good thermal conduction to the PCB, and preventing tombstoning during reflow.

5.3 Polarity Identification

While not explicitly detailed in the provided text, SMD LEDs typically use a marking (such as a dot, notch, or different pad size/shape) on the package or in the footprint drawing to indicate the cathode. The designer must consult the full mechanical drawing for this critical information.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

The device is rated for a reflow soldering temperature of 260°C for 30 seconds. This refers to the peak temperature at the solder joints. A proper reflow profile with preheat, soak, reflow, and cooling stages must be followed to avoid thermal shock and ensure reliable solder joints without damaging the LED chip or package.

6.2 Precautions for Use

General precautions include avoiding mechanical stress on the lens, preventing contamination, and using appropriate handling procedures for ESD-sensitive devices. The storage conditions align with the operating temperature range (-40°C to +125°C) in a low-humidity environment. The Moisture Sensitivity Level (MSL) is rated at Level 2, meaning the package can be exposed to factory floor conditions for up to one year before requiring baking prior to reflow.

7. Packaging & Ordering Information

7.1 Packaging Information

The LEDs are supplied on tape and reel for automated assembly. The packaging details (tape width, pocket dimensions, reel size, quantity per reel) would be specified in the full packaging information section, ensuring compatibility with standard pick-and-place equipment.

7.2 Part Numbering System

The part number 2020-UR050DL-AM is decoded as follows: 2020: Product family/Case size. UR: Color (Red). 050: Test Current (50 mA). D: Lead Frame Type (Au + White glue). L: Brightness Level (Low). AM: Automotive application. This system allows precise identification of the component's specific attributes.

8. Application Suggestions

8.1 Typical Application Scenarios

The primary application is automotive lighting. This includes interior applications like dashboard indicators, switch backlighting, and ambient lighting. It may also be suitable for exterior signal functions such as center high-mount stop lights (CHMSL) or other non-headlamp applications where a red signal is required, provided the optical design meets regulatory photometric requirements.

8.2 Design Considerations

Driver Circuit: A constant-current driver is mandatory to ensure stable light output and prevent thermal runaway. The driver must be designed to operate within the Absolute Maximum Ratings, considering derating at high temperatures.
Thermal Management: The PCB must be designed to effectively conduct heat away from the LED's thermal pad. This may involve using thermal vias, a copper pour, or connecting to a larger metal core or heatsink.
Optical Design: Secondary optics (lenses, light guides) may be needed to shape the 120° beam for the specific application.
ESD Protection: While rated at 2kV HBM, incorporating basic ESD protection on the PCB is a good practice for robustness.

9. Technical Comparison & Differentiation

Compared to standard commercial-grade LEDs, the 2020 Cube Light AM variant is distinguished by its automotive qualification (AEC-Q102), which involves rigorous testing for temperature cycling, humidity, high-temperature operation, and other stresses. It also features sulfur resistance (Class A1), which is critical in automotive environments where sulfur-containing gases can corrode silver-based components. The wide operating temperature range (-40°C to +125°C) and detailed binning structure further set it apart as a component designed for high-reliability, long-life applications where performance consistency is paramount.

10. Frequently Asked Questions (FAQs)

Q: What is the difference between the \"real\" and \"electrical\" thermal resistance?
A: The \"real\" thermal resistance (Rth JS real) is likely measured using a direct temperature sensing method on the junction. The \"electrical\" thermal resistance (Rth JS el) is typically calculated using the change in forward voltage with temperature (the K-factor method). The electrical method is often lower as it may not capture all thermal paths. For conservative thermal design, the higher \"real\" value should be used.

Q: Can I drive this LED with a constant voltage source?
A: It is strongly discouraged. LEDs are current-driven devices. A small change in forward voltage (due to temperature or bin variation) can cause a large change in current with a constant voltage source, potentially leading to overcurrent, overheating, and failure. Always use a constant-current driver or a current-limiting resistor with a tightly regulated voltage supply.

Q: Why is there a \"Do not use current below 5mA\" note on the derating curve?
A> At very low currents, the LED's light output becomes extremely non-linear and unstable. The specified photometric and colorimetric parameters (luminous flux, dominant wavelength) are only guaranteed at or near the test current of 50mA. Operation below 5mA may yield unpredictable and inconsistent performance.

Q: How do I interpret the bin codes when ordering?
A: The specific combination of Flux Bin (e.g., E4), Voltage Bin (e.g., 2022), and Wavelength Bin (e.g., 1518) that you receive on a reel is determined by the manufacturer's production distribution. For critical color- or brightness-matching applications, you may need to specify \"tight bin\" or \"matched bin\" requirements, which may affect availability and cost.

11. Design-in Case Study

Scenario: Designing a multi-LED array for an automotive interior door handle ambient light.
Requirements: Uniform red glow, stable brightness over -40°C to 85°C cabin temperature, 10-year lifespan.
Design Process:
1. LED Selection: The 2020-UR050DL-AM is chosen for its AEC-Q102 compliance, sulfur resistance, and wide temperature range.
2. Binning: To ensure color and brightness uniformity, LEDs from the same or adjacent Flux and Wavelength bins are requested (e.g., all from Flux Bin E3/E4 and Wavelength Bin 1518).
3. Circuit Design: A single constant-current driver IC powers all LEDs in series. The series configuration guarantees identical current through each LED, promoting uniform brightness. The driver's current is set to 50mA (typical) or slightly lower (e.g., 45mA) to enhance longevity and provide thermal margin.
4. Thermal Design: The PCB is a 2-layer board with a large top-layer copper pour connected to the thermal pad of each LED via multiple thermal vias to the bottom layer, which acts as a heatsink.
5. Validation: The assembly is tested for light output uniformity at 25°C, 85°C, and -30°C. Temperature cycling tests are performed to validate solder joint and component reliability.

12. Operating Principle

This LED is a semiconductor device based on a p-n junction. When a forward voltage exceeding the junction's built-in potential (approximately 1.75-2.75V for this red LED) is applied, electrons from the n-type region and holes from the p-type region are injected across the junction. When these charge carriers recombine in the active region of the semiconductor material (typically based on Aluminum Gallium Indium Phosphide - AlGaInP for red LEDs), energy is released in the form of photons (light). The specific composition of the semiconductor layers determines the wavelength (color) of the emitted light. The epoxy lens encapsulates the chip, provides mechanical protection, and shapes the light output beam.

13. Technology Trends

The trend in automotive SMD LEDs like the 2020 Cube Light is towards higher efficiency (more lumens per watt), allowing for lower power consumption and reduced thermal load. Improved color consistency and tighter binning are ongoing priorities for aesthetic applications. There is also a drive for higher reliability and longer lifetime under increasingly harsh operating conditions, including higher junction temperature ratings. Furthermore, integration with smart control (pulse-width modulation for dimming, addressable LEDs) is becoming more common. The underlying semiconductor materials and packaging technologies continue to evolve to support these demands, with advancements in chip design, phosphor technology (for white and other colors), and advanced molding compounds for better thermal and environmental performance.