LED Red 3.5x3.5x1.9mm PLCC6 - 2.3V 150mA 0.35W - Refond RF-A4T35-R30E-R4 Specification

1. Product Overview

The RF-A4T35-R30E-R4 is a high-performance red LED based on AlGaInP substrate technology, designed for demanding automotive lighting applications. It comes in a compact PLCC6 package with dimensions of 3.5mm x 3.5mm x 1.9mm, suitable for surface mount assembly (SMT). Key features include an extremely wide viewing angle of 120°, compliance with RoHS and REACH, and qualification under AEC-Q102 guidelines for automotive-grade discrete semiconductors. The LED offers excellent thermal resistance (RthJ-S up to 50°C/W) and is moisture sensitivity level 2. Typical applications include interior and exterior automotive lighting such as dashboard indicators, interior ambient lighting, tail lights, and turn signals.

2. Technical Parameters

2.1 Electrical / Optical Characteristics (Ts=25°C, IF=150mA unless otherwise noted)

2.2 Absolute Maximum Ratings (Ts=25°C)

3. Bin System for Forward Voltage, Luminous Flux, and Dominant Wavelength

The LED is sorted into bins at a test condition of IF=150mA. The following tables show the ranges for each parameter.

3.1 Forward Voltage Bins (VF)

3.2 Luminous Flux Bins (Φ)

3.3 Dominant Wavelength Bins (Wd)

4. Performance Curves Analysis

The typical optical characteristics are illustrated in several curves based on a solder temperature of 25°C unless otherwise noted.

• Forward Voltage vs. Forward Current (Fig. 1-7): The forward voltage increases with current. At 150mA the typical VF is 2.3V. The curve shows a nearly linear relationship from 1.9V to 2.6V for currents up to 300mA.
• Forward Current vs. Relative Intensity (Fig. 1-8): Relative intensity rises with forward current, reaching ~100% at 150mA and ~115% at 200mA. It saturates slightly at high currents due to thermal effects.
• Solder Temperature vs. Relative Intensity (Fig. 1-9): Relative intensity decreases as solder temperature increases. At 100°C, intensity drops to about 85% of the 25°C value.
• Solder Temperature vs. Maximum Forward Current (Fig. 1-10): To keep junction temperature below 125°C, the maximum allowable forward current must be derated as temperature rises. At 25°C the max is 180mA, but at 100°C it reduces to approximately 90mA.
• Forward Voltage vs. Solder Temperature (Fig. 1-11): VF decreases linearly with temperature at a rate of approximately -2 mV/°C.
• Radiation Diagram (Fig. 1-12): The LED has a Lambertian-like radiation pattern with a wide half-angle of 120°, ensuring uniform light distribution.
• Forward Current vs. Dominant Wavelength (Fig. 1-13): The dominant wavelength shifts slightly (~1nm) over the current range from 0 to 300mA, staying within the 627-635nm red region.
• Spectrum Distribution (Fig. 1-14): The emission peak is centered around 630nm with a narrow FWHM, characteristic of AlGaInP red LEDs.

5. Package Dimension and Mechanical Information

The LED is housed in a PLCC6 package with dimensions of 3.50mm × 3.50mm × 1.90mm (L×W×H). All tolerances are ±0.05mm unless otherwise noted. The package includes a polarity mark for orientation. The carrier tape (Fig. 2-1) and reel (Fig. 2-2) specifications ensure compatibility with standard SMT pick-and-place equipment. The base material is silicone encapsulant, providing excellent optical clarity and thermal stability.

6. SMT Reflow Soldering Instructions

Adhere to the following reflow profile (JESD22-B106 compliant) with a peak temperature of 260°C for maximum 10 seconds. Preheat from 150°C to 200°C over 60-120 seconds. Ramp-up rate ≤3°C/s, cooling rate ≤6°C/s. Do not exceed two reflow cycles. Hand soldering should be done below 300°C for less than 3 seconds per pad. Avoid mechanical stress during cooling. See Fig. 3-1 and Table 3-1 for detailed parameters.

7. Packaging and Ordering Information

Standard packaging: 4,000 pieces per reel in carrier tape with 12mm width. Moisture barrier bag (MBB) with desiccant and humidity indicator card. Outer cardboard box as per Fig. 2-5. Labels include part number, spec number, lot number, bin code, luminous flux, chromaticity bin, forward voltage, wavelength, quantity, and date. The product is moisture sensitivity level 2, requiring baking if storage conditions are exceeded.

8. Reliability Test Items and Criteria

The LED has passed reliability tests based on AEC-Q102 guidelines. Key tests include:

• Reflow (JESD22-B106): 260°C peak, 2 times – 0/1 failure.
• Moisture Sensitivity (JESD22-A113): MSL2, 168h at 85°C/60%RH – 0/1 failure.
• Thermal Shock (JEITA ED-4701): -40°C to 125°C, 15min dwell, 1000 cycles – 0/1 failure.
• Life Test (JESD22-A108): 105°C, IF=150mA, 1000h – 0/1 failure.
• High Temperature High Humidity Life Test (JESD22-A101): 85°C/85%RH, IF=150mA, 1000h – 0/1 failure.

Criteria for judgment: Forward voltage change ≤ U.S.L × 1.1, reverse current ≤ U.S.L × 2.0, luminous flux ≥ L.S.L × 0.7.

9. Handling Precautions and Storage

Due to the soft silicone encapsulant, avoid mechanical pressure on the top surface. Handle by the side surfaces using tweezers. Storage conditions: before opening aluminum bag, store at ≤30°C/≤75%RH for ≤1 year; after opening, use within 24 hours at ≤30°C/≤60%RH. If exceeded, bake at 60±5°C for ≥24h. The LED is ESD sensitive (HBM 2kV), so appropriate ESD protection is required. Avoid materials containing sulfur, bromine, chlorine exceeding 100PPM (sulfur) or 900PPM each (Br/Cl). Use isopropyl alcohol for cleaning; ultrasonic cleaning is not recommended.

10. Application Suggestions

This LED is optimized for automotive lighting both interior (dashboard indicators, ambient lighting) and exterior (tail lights, brake lights, turn signals). A proper thermal management design is essential to keep junction temperature below 125°C. Use current-limiting resistors to prevent overcurrent due to VF variation. The wide viewing angle (120°) allows uniform light distribution in backlighting applications. The LED can be driven with PWM signals; ensure forward voltage only during ON state to avoid reverse bias.

11. Technology Comparison with Competing Devices

Compared to traditional red LEDs (e.g., AlGaAs), the AlGaInP technology offers higher luminous efficiency at the same drive current, better temperature stability, and longer lifetime. The PLCC6 package provides a low profile suitable for thin designs, while maintaining excellent heat dissipation through the thermal pad. The AEC-Q102 qualification distinguishes this device for automotive applications where reliability under harsh conditions is critical. Many competing red LEDs in similar packages lack such stringent automotive qualification.

12. Frequently Asked Questions

Q: What is the typical forward voltage at 150mA? A: 2.3V (range 2.0-2.6V).

Q: Can I drive this LED at 300mA? A: Peak current up to 300mA is allowed only with 1/10 duty cycle and 10ms pulse width; continuous current must not exceed 180mA.

Q: What is the recommended soldering profile? A: Follow JEDEC standard with peak 260°C for max 10s, preheat 150-200°C for 60-120s.

Q: Is this LED suitable for outdoor use? A: Yes, the operating temperature range of -40°C to +110°C and AEC-Q102 qualification make it suitable for exterior automotive lighting.

Q: How to clean the LED after soldering? A: Use isopropyl alcohol; avoid ultrasonic cleaning as it may damage the silicone lens.

13. Practical Application Cases

In an interior ambient lighting design, a strip of 20 LEDs driven at 150mA each (total 3A) can illuminate a vehicle cabin uniformly due to the 120° viewing angle. For a tail light application, a matrix of 6 LEDs in series (with appropriate resistor balancing) provides sufficient brightness (>90 lm) for compliance with FMVSS 108 regulations. The device's wide operating temperature range ensures reliable operation in both cold starts (-40°C) and hot engine bays (+110°C).

14. Operating Principle of AlGaInP LEDs

The red LED utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) multi-quantum well active layer grown on a GaAs substrate. Under forward bias, electrons and holes recombine radiatively in the active region, emitting photons with wavelengths around 630nm. The AlGaInP material system provides high internal quantum efficiency and good temperature performance. The PLCC6 package includes a reflective cavity to enhance light extraction and a silicone lens for wide beam angle.

15. Development Trends in Automotive LED Lighting

Automotive lighting continues to evolve toward higher efficiency, smaller packages, and greater functionality. Emerging trends include matrix LED headlights with individual pixel control, adaptive driving beams, and integrated ambient lighting with tunable colors. Red LEDs like this device will remain essential for rear signal functions. Future developments may include higher flux per chip (e.g., >20lm at same current) and improved thermal management to reduce derating. The move toward automotive qualification (AEC-Q102) is becoming standard, providing designers with confidence in long-term reliability.