Red PLCC LED RF-RSRB14TS-BB Datasheet - Size 2.2x1.4x1.3mm - Voltage 1.8-2.4V - Power 72mW - English Technical Document

1. Product Overview

This document provides the complete specification for a red light-emitting diode (LED) designed for surface-mount technology (SMT) applications. The device utilizes AIGaInP (Aluminum Gallium Indium Phosphide) semiconductor material grown on a substrate to produce high-efficiency red light emission. The primary package is a Plastic Leaded Chip Carrier (PLCC) with compact dimensions of 2.2mm in length, 1.4mm in width, and 1.3mm in height. This LED is engineered for mass production and targets applications requiring reliable, consistent performance in automated assembly environments.

1.1 Core Advantages and Target Market

The LED offers several key features that make it suitable for modern electronic manufacturing. It features an extremely wide viewing angle, ensuring uniform light distribution. The component is fully compatible with standard SMT assembly and solder reflow processes, facilitating high-volume production. It is supplied on tape and reel for automated pick-and-place equipment. The device has a Moisture Sensitivity Level (MSL) of Level 2, indicating standard handling precautions are required. It complies with RoHS and REACH environmental directives. Notably, the product qualification test plan follows the AEC-Q101 standard, making it suitable for consideration in automotive-grade applications, particularly for interior automotive lighting.

2. In-Depth Technical Parameter Analysis

The performance of the LED is characterized under specific test conditions, typically at an ambient temperature (Ts) of 25°C and a standard test current (IF) of 20mA.

2.1 Electrical and Optical Characteristics

The forward voltage (VF) ranges from a minimum of 1.8V to a maximum of 2.4V at 20mA, with a typical value depending on the specific bin. The reverse current (IR) is guaranteed to be less than 10µA when a reverse voltage (VR) of 5V is applied. The luminous intensity (IV) has a wide range from 530 millicandelas (mcd) minimum to 1000 mcd maximum. The dominant wavelength (WD), which defines the perceived color, falls within the red spectrum between 627.5nm and 635nm. The device offers a very wide viewing angle (2θ1/2) of 120 degrees, typical. The thermal resistance from junction to solder point (RTHJ-S) is specified as 300°C/W, typical.

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage may occur. The maximum continuous forward current (IF) is 30mA. A peak forward current (IFP) of 100mA is allowed under pulsed conditions (1/10 duty cycle, 10ms pulse width). The maximum reverse voltage (VR) is 5V. The total power dissipation (PD) must not exceed 72mW. The device can withstand an Electrostatic Discharge (ESD) of 2000V using the Human Body Model (HBM), with a yield over 90%. The operating temperature range (TOPR) is from -40°C to +100°C, identical to the storage temperature range (TSTG). The maximum allowable junction temperature (TJ) is 120°C.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters measured at IF=20mA.

3.1 Forward Voltage Binning

The forward voltage is divided into six bins (B1, B2, C1, C2, D1, D2), each covering a 0.1V range from 1.8-1.9V up to 2.3-2.4V. This allows designers to select LEDs with tighter voltage tolerances for current matching in series or parallel circuits.

3.2 Luminous Intensity Binning

The luminous intensity is categorized into three bins: K1 (530-650 mcd), K2 (650-800 mcd), and L1 (800-1000 mcd). This enables selection based on required brightness levels for the application.

3.3 Dominant Wavelength Binning

The dominant wavelength, which determines the shade of red, is sorted into three bins: F2 (627.5-630 nm), G1 (630-632.5 nm), and G2 (632.5-635 nm). This ensures precise color consistency within an assembly.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions.

4.1 Forward Voltage vs. Forward Current (IV Curve)

Figure 1-6 shows the relationship between forward voltage and forward current. The curve is non-linear, typical of a diode. The voltage increases with current, and the specific slope depends on the semiconductor characteristics. Designers use this curve to determine the voltage drop at operating currents different from the test condition.

4.2 Forward Current vs. Relative Luminous Intensity

Figure 1-7 depicts how light output (relative intensity) changes with forward current. Generally, light output increases with current, but the relationship may not be perfectly linear, especially at higher currents where efficiency can drop due to heating.

4.3 Temperature Dependence

Figures 1-8 and 1-9 show the effect of solder point temperature (Ts) on relative luminous flux and forward current, respectively. LED efficiency typically decreases as temperature rises. Figure 1-10 shows how forward voltage decreases with increasing temperature, a negative temperature coefficient common in semiconductors.

4.4 Radiation Pattern and Spectrum

Figure 1-11 is a radiation diagram (polar plot) showing the angular distribution of light intensity, confirming the wide 120-degree viewing angle. Figure 1-12 shows the shift in dominant wavelength with forward current, which is usually minimal for this material system. Figure 1-13 presents the spectral power distribution, showing the narrow peak characteristic of a monochromatic LED centered around the dominant wavelength.

5. Mechanical and Package Information

5.1 Package Dimensions and Tolerances

The LED package has a body size of 2.2mm (L) x 1.4mm (W) x 1.3mm (H). All dimension tolerances are ±0.20mm unless otherwise specified. The document includes top, side, and bottom views (Fig. 1-1, 1-2, 1-3) detailing the physical outline.

5.2 Polarity Identification and Pad Design

Figure 1-4 indicates the polarity. The cathode is typically marked, often by a notch, a dot, or a green marking on the package. Figure 1-5 provides recommended soldering pad (land pattern) dimensions for PCB design to ensure proper soldering and mechanical stability during reflow.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering Instructions

A dedicated section outlines instructions for SMT reflow soldering. While specific temperature profile details (preheat, soak, reflow peak, cooling) are not provided in the excerpt, it emphasizes that the product is suitable for all SMT processes. Users must refer to the solder paste manufacturer's recommendations and ensure the profile does not exceed the device's maximum temperature ratings, especially the junction temperature limit of 120°C.

6.2 Handling Precautions

General handling precautions are listed. Due to the MSL Level 2 rating, the device must be used within a specified time after the dry-pack bag is opened or be baked according to standard IPC/JEDEC guidelines before soldering. ESD protection measures are necessary during handling, as specified by the 2000V HBM rating. Care must be taken to avoid mechanical stress on the lens and leads.

7. Packaging and Reliability

7.1 Packaging Specification

The LEDs are supplied on embossed carrier tape wound onto reels. The datasheet includes dimensions for the carrier tape pocket, reel diameter, and hub size to be compatible with standard SMT feeders. A label form specification ensures traceability with information like part number, quantity, and date code.

7.2 Moisture Resistant Packing and Boxing

The devices are packed in moisture barrier bags with desiccant and humidity indicator cards to maintain the MSL Level 2 integrity during storage and transport. These bags are then packed in cardboard boxes for shipment.

7.3 Reliability Test Items and Conditions

The product undergoes a series of reliability tests based on AEC-Q101 guidelines. While the specific tests and conditions (e.g., High Temperature Operating Life, Temperature Cycling, Humidity testing) are not detailed in the excerpt, their inclusion indicates the product is subjected to rigorous qualification to ensure long-term performance in demanding environments like automotive interiors.

8. Application Suggestions and Design Considerations

8.1 Typical Application Scenarios

The primary stated application is Automotive Lighting Interior. This includes dashboard backlighting, indicator lights, switch illumination, ambient lighting, and center console displays. Its AEC-Q101 qualification makes it a candidate for such applications. It may also be used in general consumer electronics, signage, and indicators where a reliable red SMT LED is required.

8.2 Design Considerations

Current Limiting: Always use a series current-limiting resistor or constant current driver. The maximum continuous current is 30mA; operating at or below 20mA is standard for longevity.
Thermal Management: With a thermal resistance of 300°C/W, power dissipation must be managed. At 20mA and a typical VF of 2.1V, power is 42mW. Ensure the PCB design provides adequate thermal relief, especially if multiple LEDs are used or if operated at higher currents.
Optical Design: The 120-degree viewing angle is very wide. For focused light, secondary optics (lenses) may be needed. The radiant intensity pattern should be reviewed for uniformity requirements.
Binning Selection: For applications requiring uniform appearance, specify tight bins for dominant wavelength and luminous intensity. For cost-sensitive applications, wider bins may be acceptable.

9. Technical Comparison and Differentiation

Compared to standard red LEDs, this device offers specific advantages:
Material (AIGaInP): Provides high efficiency and good color stability over temperature and current compared to older technologies.
Package (PLCC 2.2x1.4): A robust and common package offering good mechanical stability and heat dissipation compared to smaller chip-scale packages.
Automotive Qualification (AEC-Q101): This is a key differentiator, implying stricter process controls and reliability testing than commercial-grade LEDs, making it suitable for harsh environments.
Wide Viewing Angle: The 120-degree angle is excellent for applications requiring broad illumination without secondary optics.

10. Frequently Asked Questions (FAQs)

Q: What is the recommended operating current?
A: The standard test condition is 20mA, which is a common and reliable operating point. The absolute maximum is 30mA continuous.

Q: How do I identify the anode and cathode?
A: Refer to Figure 1-4 (Polarity) in the datasheet. The cathode is typically marked on the package body.

Q: Is a heat sink required?
A: For operation at 20mA or below in normal ambient conditions, a dedicated heat sink is usually not required. However, good PCB thermal design (copper pads) is recommended, especially for multiple LEDs or high ambient temperatures.

Q: Can I use this for exterior automotive lighting?
A: The datasheet specifically lists "Automotive Lighting Interior." Exterior applications often have more stringent requirements for temperature range, humidity, and UV exposure. Consult the manufacturer for exterior-grade products.

Q: What is the typical lifetime?
A: While not explicitly stated, LEDs qualified to AEC-Q101 standards typically demonstrate very long lifetimes (tens of thousands of hours) when operated within their specified ratings.

11. Practical Use Case Example

Scenario: Designing a dashboard indicator cluster.
A designer needs multiple red warning/status indicators. They select this LED for its automotive qualification and wide viewing angle. To ensure uniform brightness and color, they specify bins L1 for luminous intensity (800-1000 mcd) and G1 for dominant wavelength (630-632.5 nm). They design the PCB with the recommended pad layout from Fig. 1-5. Each LED is driven by a 5V supply through a current-limiting resistor calculated for ~18mA (slightly below the 20mA test point for margin). Thermal vias are placed under the pad to dissipate heat to an inner ground plane. The MSL Level 2 requirement is communicated to the assembly house to ensure proper handling before reflow soldering.

12. Operating Principle

This is a semiconductor light source. The core is a chip made of AIGaInP layers grown on a substrate. When a forward voltage exceeding the diode's threshold is applied, electrons and holes are injected into the active region where they recombine. This recombination process releases energy in the form of photons (light). The specific composition of the AIGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light, in this case, red (~630 nm). The plastic PLCC package encapsulates the chip, provides mechanical protection, houses the leadframe for electrical connection, and incorporates a molded lens that shapes the light output to achieve the wide viewing angle.

13. Technology Trends

LED technology continues to advance. For red indicator LEDs, trends include:
Increased Efficiency: Ongoing material and epitaxial growth improvements yield higher luminous efficacy (more light per electrical watt).
Miniaturization: While the PLCC package is standard, there is a push towards even smaller chip-scale packages (CSP) for high-density boards.
Enhanced Reliability: Stricter qualification standards beyond AEC-Q101, such as extended temperature ranges and longer lifetime testing, are becoming common for automotive and industrial uses.
Integrated Solutions: LEDs with built-in current limiting resistors, protection diodes (Zener for reverse voltage), or even driver ICs are available, simplifying circuit design. This particular device represents a mature, reliable, and well-characterized component in the landscape of SMT indicator LEDs.