Table of Contents
- 1. Product Overview
- 2. Technical Parameter Analysis
- 2.1 Electrical / Optical Characteristics (at Ts=25°C)
- 2.2 Absolute Maximum Ratings
- 3. Bin System Explanation
- 3.1 Forward Voltage & Luminous Flux Bins (IF=5mA)
- 4. Performance Curve Analysis
- 4.1 Forward Voltage vs Forward Current
- 4.2 Forward Current vs Relative Intensity
- 4.3 Temperature Effects
- 4.4 Spectral Distribution
- 4.5 Radiation Pattern
- 5. Mechanical & Packaging Information
- 5.1 Package Dimensions
- 5.2 Soldering Patterns
- 5.3 Polarity Identification
- 6. Soldering & Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Manual Soldering
- 6.3 Repairing
- 7. Packaging & Ordering Information
- 7.1 Packaging Specification
- 7.2 Label Information
- 7.3 Storage Conditions
- 8. Application Recommendations
- 8.1 Circuit Design
- 8.2 Thermal Management
- 8.3 Environmental Compatibility
- 8.4 Electrostatic Discharge Protection
- 9. Reliability Test Summary
- 10. Frequently Asked Questions
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The RF-GW1608DS-DD-B0 is a high-performance white LED designed for general-purpose indication and illumination applications. It utilizes a blue chip combined with yellow phosphor to produce cool white light. Housed in a miniature 1608 surface-mount package (1.6mm x 0.8mm x 0.55mm), this LED offers excellent brightness and wide viewing angle while maintaining low power consumption. Key features include extremely wide viewing angle (140°), compatibility with standard SMT assembly processes, RoHS compliance, and Moisture Sensitivity Level 3. The LED is ideal for optical indicators, switch and symbol backlighting, household appliance displays, and other general lighting applications. With a forward current rating of 20mA (max 60mA pulsed) and power dissipation of 68mW, it provides reliable performance over an operating temperature range of -40°C to +85°C.
2. Technical Parameter Analysis
2.1 Electrical / Optical Characteristics (at Ts=25°C)
The LED is characterized at a test current of IF=5mA. Forward voltage (VF) is sorted into multiple bins ranging from 2.6V to 3.4V. Bins F1-F2 cover 2.6-2.8V, G1-G2 cover 2.8-3.0V, H1-H2 cover 3.0-3.2V, and I1-I2 cover 3.2-3.4V. Typical VF is around 2.7-3.1V depending on bin. Luminous intensity (IV) at 5mA is binned as I00 (230-350 mcd), J00 (350-530 mcd), K00 (530-800 mcd), and L10 (800-1000 mcd). The viewing angle (2θ1/2) is typically 140°. Reverse current (IR) is less than 10 μA at VR=5V. Thermal resistance from junction to solder point (RthJ-S) is typically 450 K/W.
2.2 Absolute Maximum Ratings
At ambient temperature 25°C, the LED must not exceed: Power Dissipation 68mW, Forward Current 20mA, Peak Forward Current (1/10 duty, 0.1ms pulse) 60mA, Electrostatic Discharge (HBM) 1000V. Operating temperature range -40 to +85°C, Storage temperature -40 to +85°C, Junction temperature 95°C. Care must be taken to ensure junction temperature does not exceed the maximum rating.
3. Bin System Explanation
3.1 Forward Voltage & Luminous Flux Bins (IF=5mA)
The C.I.E. 1931 chromaticity diagram is used for color binning. The LED is available in multiple chromaticity bins: GW10 through GW18, each defined by four corner coordinates (x,y). The typical color coordinates lie in the white region. Luminous intensity bins are designated as I00 (<350mcd), J00 (350-530mcd), K00 (530-800mcd), L10 (800-1000mcd). Tolerance for forward voltage measurement is ±0.1V, color coordinates ±0.005, and luminous intensity ±10%.
4. Performance Curve Analysis
4.1 Forward Voltage vs Forward Current
Fig. 1-7 shows a typical diode curve: forward voltage increases slowly with current; at 5mA VF is approximately 2.7-2.9V, at 20mA it rises to about 3.0-3.2V.
4.2 Forward Current vs Relative Intensity
Fig. 1-8 shows relative intensity increases almost linearly with forward current up to 20mA, then begins to saturate. At 5mA relative intensity is ~0.35, at 20mA ~0.9.
4.3 Temperature Effects
Fig. 1-9 (Pin Temperature vs Relative Intensity) shows relative intensity decreases with increasing ambient temperature; approximately 10% drop at 85°C compared to 25°C. Fig. 1-10 (Pin Temperature vs Forward Current) indicates the maximum allowed forward current must be derated as junction temperature rises; at 100°C the allowable current is reduced to about 15mA.
4.4 Spectral Distribution
Fig. 1-12 shows the relative intensity vs wavelength plot. The LED emits blue light peaked around 450-460nm and phosphor-converted yellow light covering 500-650nm, resulting in white light with a correlated color temperature (CCT) around 6000K-7000K (cool white).
4.5 Radiation Pattern
Fig. 1-13 illustrates the radiation pattern. The LED has a Lambertian-like emission profile with intensity dropping to 50% at approximately ±60° and near zero at ±90°. The wide 140° viewing angle ensures good off-axis visibility.
5. Mechanical & Packaging Information
5.1 Package Dimensions
The LED package measures 1.60 x 0.80 x 0.55 mm (L x W x H). Top view shows dimensions 1.600mm x 0.800mm with a LED chip location offset. Side view height 0.55mm. Bottom view shows two solder pads: pad 1 (anode) and pad 2 (cathode). Polarity is marked on the bottom view (Fig. 1-4).
5.2 Soldering Patterns
Recommended solder pad layout (Fig. 1-5): two rectangular pads of 0.4mm x 0.8mm separated by 0.5mm gap; total pad width 1.2mm; overall pattern dimensions 2.4mm x 0.8mm. All dimensions in mm, tolerance ±0.2mm unless noted.
5.3 Polarity Identification
The cathode (negative) side is indicated by a corner mark on the bottom view. In the carrier tape, the polarity mark (cathode) is located at the feeding direction side.
6. Soldering & Assembly Guidelines
6.1 Reflow Soldering Profile
The recommended reflow profile (Fig. 3-1) follows IPC/JEDEC J-STD-020. Key parameters: Preheating: ramp-up rate ≤3°C/s to 150-200°C, soak for 60-120 seconds. Reflow: ramp-up rate ≤3°C/s to 217°C (TL), time above TL (tL) 60-150 seconds, peak temperature (Tp) 260°C max with dwell time ≤10 seconds. Cooling rate ≤6°C/s. Total time from 25°C to peak ≤8 minutes. Reflow soldering should not exceed two times; if more than 24 hours between two soldering, vacuum baking may be required.
6.2 Manual Soldering
If hand soldering is used, keep iron temperature below 300°C and contact time less than 3 seconds, and perform only once.
6.3 Repairing
Repairing after soldering is not recommended. If unavoidable, use a double-head soldering iron and verify LED integrity. Do not apply mechanical stress during cooling.
7. Packaging & Ordering Information
7.1 Packaging Specification
Standard packaging: 4000 pieces per reel. Carrier tape dimensions: width 8.0mm, pitch 4.0mm, cavity width 1.55mm, depth 0.68mm. Reel dimensions: 178mm outer diameter (A), 60mm hub (C), 13.0mm spindle hole (D). Sealed in moisture barrier bag with desiccant and humidity indicator card.
7.2 Label Information
Each reel label includes: Part Number, Spec Number, Lot Number, Bin Code (luminous flux, chromaticity XY, forward voltage), Wavelength, Quantity, Date. Customers should specify required bins when ordering.
7.3 Storage Conditions
Before opening aluminum bag: store at ≤30°C / ≤75% RH for up to 1 year from date of sealing. After opening: store at ≤30°C / ≤60% RH for up to 168 hours. If these conditions are exceeded or the moisture indicator card shows >60% RH, baking is required at (60±5)°C for ≥24 hours before use.
8. Application Recommendations
8.1 Circuit Design
Current per LED must not exceed absolute maximum rating. A current-limiting resistor is essential to prevent thermal runaway due to small voltage shifts. Ensure reverse voltage is never applied during operation or switching to avoid migration damage.
8.2 Thermal Management
Thermal design is critical. The LED’s junction temperature must stay below 95°C. Adequate PCB copper area and vias should be used to dissipate heat. Derate forward current if ambient temperature exceeds 25°C according to Fig. 1-10.
8.3 Environmental Compatibility
LEDs are sensitive to sulfur and halogen compounds. The mating material (e.g., potting, adhesive, housing) must contain less than 100ppm total sulfur. Single bromine and chlorine each less than 900ppm, total Br+Cl less than 1500ppm. Avoid materials that release volatile organic compounds (VOCs) that can discolor the silicone encapsulant.
8.4 Electrostatic Discharge Protection
ESD sensitivity: HBM 1000V. Use proper grounding and anti-static measures during handling, assembly, and testing. If ESD protection is insufficient, consider adding Zener diodes in parallel.
9. Reliability Test Summary
The LED has passed standard reliability tests per JEDEC: Temperature Cycle (-40°C to 100°C, 100 cycles), Thermal Shock (-40°C to 100°C, 15min transitions, 300 cycles), High Temperature Storage (100°C, 1000h), Low Temperature Storage (-40°C, 1000h), and Life Test (25°C, 5mA, 1000h). Acceptance criteria: forward voltage shift ≤10% of USL, reverse current ≤2x USL, luminous flux ≥70% of LSL.
10. Frequently Asked Questions
Q: What is the recommended operating current for maximum efficacy?
A: While tested at 5mA, the LED can operate up to 20mA continuously. Efficacy peaks around 5-10mA; for higher brightness use 20mA with thermal derating. Use a resistor to set current.
Q: Can this LED be used in outdoor applications?
A: The LED itself is rated for -40 to +85°C, but the package is not sealed against moisture ingress. For outdoor use, conformal coating or encapsulation is recommended.
Q: What is the typical color temperature?
A: The chromaticity bins (GW10-GW18) correspond to cool white with correlated color temperature approximately 6000-7000K. For warm white, other part numbers are available.
Q: How to interpret the bin code?
A: Bin code includes luminous flux bin (e.g., J00), chromaticity bin (e.g., GW14), and forward voltage bin (e.g., G2). Always match required bins for consistent color and brightness.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |