RF-H**HI32DS-EF-2N White LED Specification - 2.8x3.5x0.7mm PLCC-2 - 2.6-3.0V Forward Voltage - 60mA - 2700K-6500K - 80+ CRI

1. Product Overview

The RF-H**HI32DS-EF-2N series is a high-performance white LED designed for general indoor lighting applications. It utilizes a blue LED chip combined with yellow phosphor to produce white light with high color rendering index (CRI ≥80). The device is housed in a compact PLCC-2 package measuring 2.8mm × 3.5mm × 0.7mm, making it suitable for surface-mount assembly and compatible with standard reflow soldering processes. Key advantages include an extremely wide viewing angle of 120 degrees, excellent thermal resistance (15°C/W), and moisture sensitivity level 3. The product is RoHS compliant and available in tape-and-reel packaging (4000 pcs/reel). It offers multiple color temperature bins ranging from warm white (2700K) to cool daylight (6500K), with typical luminous flux between 29 and 36 lumens at 60mA drive current.

2. Detailed Technical Parameter Analysis

2.1 Electrical Characteristics

At a test current of 60mA and solder temperature Ts=25°C, the forward voltage (VF) ranges from 2.6V to 3.0V, with a typical value of 2.77V. This narrow VF range ensures consistent brightness and power consumption across different bins. The reverse current (IR) is specified at 10µA maximum when a reverse voltage of 5V is applied, indicating good junction integrity. Absolute maximum ratings allow a continuous forward current of 180mA, a peak forward current of 300mA (1/10 duty cycle, 0.1ms pulse width), and a power dissipation of 540mW. The junction temperature must not exceed 125°C, and the operating temperature range is -40°C to +85°C. ESD withstand capability is 2000V (HBM).

2.2 Optical Characteristics

The LED is available in seven correlated color temperature (CCT) bins: 27H (2570-2870K), 30H (2870-3220K), 35H (3230-3660K), 40H (3640-4260K), 50H (4640-5350K), 57H (5300-6110K), and 65H (6070-7120K). The 40H bin is further subdivided into four sub-bins (40H-1 to 40H-4) with precise chromaticity coordinates provided in the CIE 1931 diagram. Typical luminous flux at 60mA varies from 31lm (warm bins) to 36lm (cool bins). The viewing angle (2θ1/2) is 120 degrees, providing wide beam spread suitable for bulb and indoor lighting. Color rendering index (Ra) is typically 81.5, with minimum 80.

2.3 Thermal Characteristics

The thermal resistance from junction to solder pad (RTHJ-S) is 15°C/W, indicating good heat dissipation capability. Proper thermal management is critical to maintain junction temperature below 125°C and prevent accelerated degradation. The LED's performance, including luminous flux and forward voltage, varies with solder temperature as shown in the optical curves.

3. Binning System Explanation

3.1 Forward Voltage Bins

Forward voltage is sorted into four bins: F1 (2.6-2.7V), F2 (2.7-2.8V), G1 (2.8-2.9V), and G2 (2.9-3.0V). This tight binning facilitates consistent current distribution in parallel circuits and simplifies thermal design.

3.2 Luminous Flux Bins

Luminous flux bins are labeled REC (29-30lm), RFD (30-31lm), RFE (31-32lm), RFF (32-33lm), RGB (33-34.5lm), and RGC (34.5-36lm). The bin code on the product label indicates both VF and flux ranges, enabling easy selection for specific brightness requirements.

3.3 Color Temperature Bins

Chromaticity coordinates for each CCT bin are specified in Table 1-4. For example, the 40H bin has four sub-bins with coordinates (x,y) precisely defined. This ensures color consistency across production lots. The tolerance for color coordinates measurement is ±0.003.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

Figure 1-7 shows a linear relationship between forward voltage and current. At 60mA, VF is approximately 2.77V; at 210mA, VF rises to about 3.05V. Designers must account for this variation when setting the drive current.

4.2 Forward Current vs. Relative Intensity

Relative luminous intensity increases nearly linearly with current up to about 150mA, then begins to saturate. At 180mA, relative intensity is about 250% of the value at 60mA. This allows dimming through current reduction with predictable brightness changes.

4.3 Solder Temperature vs. Relative Intensity and Forward Current

Figure 1-9 indicates that as solder temperature rises from 25°C to 100°C, relative luminous flux decreases by about 30%. Similarly, the maximum allowed forward current must be derated at higher temperatures (Figure 1-10). For example, at 80°C solder temperature, the maximum current is reduced to approximately 120mA to maintain junction temperature below 125°C.

4.4 Forward Voltage vs. Solder Temperature

Forward voltage decreases linearly with increasing temperature at a rate of about -2.5mV/°C. At 85°C, VF is roughly 2.5V, compared to 2.8V at 25°C. This negative temperature coefficient must be considered in constant-current driver design.

4.5 Radiation Pattern and Spectrum

The radiation diagram (Figure 1-12) shows a typical Lambertian distribution with half-intensity angle of ±60°, confirming the 120° viewing angle. The spectrum (Figure 1-13) displays a blue peak around 450nm and a broad phosphor emission band from 500nm to 700nm. Different CCTs result from varying the phosphor concentration, with 6500K showing a stronger blue component and 3000K a more balanced spectrum.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED package measures 2.80mm × 3.50mm × 0.70mm (length × width × height). The bottom view shows a cathode pad (2.10mm × 1.82mm) and an anode pad (2.10mm × 0.48mm), with a polarity mark indicating the cathode corner. The soldering pattern recommended for PCB layout has pads of 2.10mm × 1.10mm with 0.5mm spacing, ensuring good solder fillet formation.

5.2 Carrier Tape and Reel Dimensions

Carrier tape has a pitch of 4.00mm, width 8mm, with a cavity size of 3.84mm × 5.24mm. The reel dimensions are: outer diameter 178±1.0mm, inner diameter 59±1.0mm, hub diameter 13.5±0.3mm, and width 8.5±0.3mm. Each reel holds 4000 units. The feed direction is indicated by arrows, and polarity is marked on the tape.

5.3 Label Information

The reel label includes part number, spec number, lot number, bin code (including flux, chromaticity, VF, wavelength), quantity, and date. A moisture barrier bag with desiccant and a humidity indicator card are used for moisture-sensitive storage.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

Table 3-1 specifies the recommended reflow profile: preheating from 150°C to 200°C for 60-120 seconds, ramp-up rate ≤3°C/s, temperature above 217°C (liquidus) for 60 seconds maximum, peak temperature 260°C with dwell time at peak ≤10 seconds, and cooling rate ≤6°C/s. Total time from 25°C to peak should not exceed 8 minutes. Only two reflow cycles are allowed, and if more than 24 hours passes after first reflow, the LEDs may be damaged.

6.2 Hand Soldering and Repair

If hand soldering is necessary, iron temperature must be below 300°C and contact time less than 3 seconds, limited to one attempt. Repair should be avoided; if unavoidable, a double-head soldering iron is recommended. The silicone encapsulant is soft and can be damaged by excessive pressure during pick-and-place or rework.

6.3 Storage and Baking

Before opening the aluminum bag, LEDs can be stored at ≤30°C / ≤75% RH for up to one year from the date of sealing. After opening, they must be used within 24 hours at ≤30°C / ≤60% RH. If the humidity indicator card shows excessive moisture or storage time exceeds limits, baking at 60±5°C for ≥24 hours is required.

7. Packaging and Ordering Information

Standard packaging: 4000 pieces per reel, sealed in moisture barrier bag with desiccant and label. The cardboard box (Fig. 2-5) provides mechanical protection during transport. Reliability tests (Table 2-3) include reflow soldering, thermal shock (-40°C to 100°C), high temperature storage (100°C/1000h), low temperature storage (-40°C/1000h), life test (25°C/60mA/1000h), high temperature high humidity life test (60°C/90%RH/60mA/1000h), and temperature humidity storage (85°C/85%RH). Acceptance criteria (Table 2-4) allow VF up to 1.1× U.S.L., IR up to 2.0× U.S.L., and luminous flux not lower than 0.7× L.S.L.

8. Application Recommendations

8.1 Typical Applications

The RF-H**HI32DS-EF-2N is ideal for indoor lighting including LED bulbs, downlights, panel lights, and general illumination where high CRI and wide beam angle are desired. Its small footprint allows dense packing for high-lumen-density designs. The wide color temperature range suits both warm and cool white markets.

8.2 Design Considerations

• Current Limiting: Always use a current-limiting resistor or constant-current driver to prevent thermal runaway due to negative VF temperature coefficient.
• Thermal Management: Provide adequate heat sinking to keep solder temperature below 85°C to maintain lumen output and lifetime.
• Series/Parallel Configurations: Account for VF binning to balance current distribution; use separate drivers for parallel strings.
• ESD Protection: Use ESD protection devices (e.g., Zener diodes) on the LED lines, especially in high-ESD environments.
• Chemical Compatibility: Avoid materials that outgas volatile organic compounds (VOCs) or contain sulfur (limit 100ppm), bromine (<900ppm), chlorine (<900ppm), total halogens <1500ppm.
• Mechanical Stress: Do not apply pressure to the silicone lens; handle by the sides using tweezers.

9. Technical Comparison with Alternatives

Compared to conventional 2835 LEDs from other manufacturers, the RF-H**HI32DS-EF-2N offers several advantages: (1) Higher CRI (80 min vs typical 70 for standard) for better color rendering. (2) Wider viewing angle (120°) versus typical 110°, providing more uniform illumination. (3) Lower thermal resistance (15°C/W) enabling better heat dissipation. (4) Tighter color binning (±0.003) ensuring color consistency. However, its maximum current rating (180mA continuous) is moderate; some competing parts may handle higher currents for increased lumen output at the cost of efficacy.

10. Common Technical Questions

Q: Can I drive this LED at 150mA continuously?

A: The absolute maximum continuous current is 180mA, but you must ensure the solder temperature does not exceed the derating curve (Fig. 1-10). At 25°C ambient with good thermal management, 150mA is acceptable. However, luminous flux will be about 2× that at 60mA, and junction temperature must remain below 125°C.

Q: How does the LED perform at high ambient temperatures?

A: At 85°C ambient, the maximum allowable forward current is reduced to approximately 60mA to prevent exceeding TJmax. Luminous flux drops by about 30% compared to 25°C (Fig. 1-9). Thermal design is critical for high-temperature applications.

Q: Can I mix different CCT bins in the same fixture?

A: It is not recommended because chromaticity shifts will be visible. Always order the same bin code to ensure color uniformity. The ±0.003 coordinate tolerance is tight enough for most commercial applications.

Q: What cleaning solvents are safe?

A: Isopropyl alcohol is recommended. Avoid solvents that may attack the silicone encapsulant (e.g., acetone, toluene). Ultrasonic cleaning is not recommended as it may damage wire bonds.

11. Application Design Example

Design Target: A 7W LED bulb with 800lm output, 3000K CCT, CRI>80.
Solution: Use 24 LEDs in a 12S2P configuration (12 series, 2 parallel). Each LED runs at 60mA, total current 120mA. With VF typical 2.77V, total voltage ~33.2V. Power = 33.2V × 0.12A ≈ 4W. To reach 800lm, considering optical losses (~85% efficiency), need about 941lm from the LEDs. Each LED delivers ~32lm at 60mA (30H bin), so 24 LEDs give 768lm, insufficient. Increase current to 80mA per LED: relative intensity ~130% → ~41.6lm each → 998lm total, power ~33.2V × 0.16A = 5.3W, still within thermal limits if heat sink is adequate. Adjust bin selection to RFF (32-33lm) for higher flux. Thermal simulation required to ensure junction temperature <125°C.

12. White Light Generation Principle

This LED produces white light through phosphor conversion: a blue InGaN/GaN LED chip emits blue light (peak ~450nm). The blue light excites a yellow-emitting phosphor (typically YAG:Ce) which down-converts some of the blue photons to longer wavelengths (green to red region). The combination of the remaining blue light and the broad yellow emission appears white to the human eye. By adjusting the phosphor composition and concentration, different correlated color temperatures from warm (more yellow/red) to cool (more blue) are achieved. The color rendering index is enhanced by using phosphors with additional red emission to improve R9 values.

13. Technology Trends

The LED industry continues to push for higher efficacy (lm/W), better color quality (CRI >90, R9 >50), and smaller packages. This product represents a mature PLCC-2 technology, but future trends include: (1) Chip-scale packages (CSP) for even smaller size. (2) Multi-chip or chip-on-board (COB) modules for high-power applications. (3) Full-spectrum LEDs with violet or near-UV chips and RGB phosphors for ultimate color rendering. (4) Smart LED modules with integrated drivers and wireless control. The demand for high-CRI LEDs (Ra>90) is growing in retail and museum lighting. This specific series may be updated with higher efficiency and better thermal performance in future revisions.