1. Product Overview
This technical document pertains to a specific revision of a product or component, identified as Revision 3. The lifecycle phase is explicitly stated as 'Revision', indicating this is a formal update to a previous version. The document's validity is marked with an 'Expired Period' of 'Forever', suggesting it contains foundational or reference specifications that do not expire under normal circumstances. The official release date for this revision was December 2, 2014, at 14:59:56. This document serves as the definitive source for the technical parameters, performance characteristics, and application guidelines for this specific revision.
The core advantage of this revision lies in its formalized and frozen specification set, providing stability for design and manufacturing processes. It targets engineers, procurement specialists, and quality assurance personnel who require precise and unchanging technical data for integration, sourcing, and validation of the component in their systems.
2. Technical Parameters Deep Objective Interpretation
While the provided PDF snippet is limited to metadata, a complete technical document for an electronic component, such as an LED, IC, or sensor, would contain detailed sections as outlined below. The following is a comprehensive explanation of the typical content expected in each section, based on the lifecycle and revision control indicated.
2.1 Photometric & Electrical Characteristics
A detailed datasheet would list absolute maximum ratings and recommended operating conditions. For an optoelectronic device, this includes forward voltage, reverse voltage, continuous forward current, and power dissipation. Photometric characteristics would cover luminous intensity, viewing angle, dominant wavelength, and chromaticity coordinates. Each parameter is presented with typical and minimum/maximum values, often under specified test conditions (e.g., 25°C ambient temperature, pulsed current).
2.2 Thermal Characteristics
This section defines the thermal performance, crucial for reliability. Key parameters include the thermal resistance from junction to ambient (RθJA) and junction to case (RθJC). These values are used to calculate the maximum junction temperature under given operating conditions, ensuring the component remains within its safe operating area to prevent premature failure.
3. Binning System Explanation
Manufacturing processes introduce natural variances. A binning system categorizes components based on key performance parameters measured after production.
3.1 Wavelength/Color Temperature Binning
For LEDs, emitted light wavelength (for monochromatic) or correlated color temperature (CCT for white) is sorted into predefined bins (e.g., 2700K, 3000K, 4000K, 5000K for white LEDs). This ensures color consistency within a single production batch and across different batches.
3.2 Luminous Flux Binning
Components are sorted according to their light output (in lumens) at a standard test current. Bins are defined by a minimum luminous flux value, allowing designers to select parts that meet their specific brightness requirements.
3.3 Forward Voltage Binning
LEDs and other semiconductors are also binned by their forward voltage (Vf) at a specified test current. This helps in designing efficient driver circuits and ensures uniform current distribution when components are connected in parallel.
4. Performance Curve Analysis
Graphical data provides deeper insight than tabular data alone.
4.1 Current vs. Voltage (I-V) Curve
This fundamental curve shows the relationship between the forward current and the voltage drop across the device. It is essential for determining the operating point and designing the appropriate current-limiting circuitry.
4.2 Temperature Characteristics
Graphs typically show how key parameters like forward voltage, luminous flux, and dominant wavelength shift with changes in junction temperature. Understanding these deratings is critical for designing robust systems that operate over a wide temperature range.
4.3 Spectral Power Distribution
For light-emitting devices, this graph plots the relative intensity of light emitted at each wavelength. It defines the color quality, including color rendering index (CRI) for white light, and is vital for color-critical applications.
5. Mechanical & Packaging Information
5.1 Outline Dimensions
A detailed mechanical drawing provides all critical dimensions: length, width, height, lead spacing, and component tolerances. This is necessary for PCB footprint design and ensuring proper fit within the assembly.
5.2 Pad Layout Design
The recommended PCB land pattern (pad geometry and size) is provided to ensure reliable solder joint formation during reflow or wave soldering processes.
5.3 Polarity Indication
The document clearly indicates how to identify the anode and cathode, usually through a diagram showing a notch, dot, or shorter lead, preventing incorrect orientation during assembly.
6. Soldering & Assembly Guidelines
6.1 Reflow Soldering Profile
A detailed temperature vs. time profile is provided, specifying preheat, soak, reflow peak temperature, and cooling ramp rates. Adherence to this profile is mandatory to avoid thermal damage to the component.
6.2 Precautions
Warnings include handling procedures to avoid electrostatic discharge (ESD), maximum storage time for moisture-sensitive devices before baking, and cleaning agent compatibility.
6.3 Storage Conditions
Recommended long-term storage temperature and humidity ranges are specified to maintain solderability and prevent degradation of materials.
7. Packaging & Ordering Information
7.1 Packaging Specifications
Details on tape and reel dimensions (for automated assembly), reel quantities, and embossed carrier tape specifications are included.
7.2 Labeling Information
The format and content of labels on reels or boxes, including part number, lot code, date code, and quantity, are explained.
7.3 Model Numbering Rules
A breakdown of the part number code explains how each segment denotes characteristics like color, flux bin, voltage bin, packaging type, and special features, enabling accurate ordering.
8. Application Suggestions
8.1 Typical Application Circuits
Schematic examples show common configurations, such as a single LED with a series resistor, multiple LEDs in series/parallel arrays driven by constant current sources, or PWM dimming circuits.
8.2 Design Considerations
Guidance is provided on heat sinking design to manage junction temperature, optical design for desired beam patterns, and electrical design to ensure stable, long-term operation within specifications.
9. Technical Comparison
This section, if applicable, objectively compares this revision (Rev. 3) with its predecessor (Rev. 2) or with functionally similar components from other technologies. Differences may include improved efficacy, tighter parametric tolerances, enhanced reliability data, or a modified package for better thermal performance. The comparison is factual and data-driven.
10. Frequently Asked Questions
Based on common technical queries, this section provides clear answers. Examples: \"How do I calculate the required series resistor?\" \"What is the impact of driving the device below/above the rated current?\" \"How does high ambient temperature affect the luminous output and lifetime?\" \"Can devices from different flux bins be mixed in one assembly?\"
11. Practical Use Cases
Detailed examples illustrate real-world implementation. Case 1: Integrating the component into a residential downlight, focusing on thermal management via an aluminum core PCB. Case 2: Using it in an automotive interior lighting strip, detailing the design for wide input voltage range and protection against load dump transients. Case 3: Implementation in a wearable device, emphasizing low-power operation and miniaturized driver design.
12. Principle Introduction
An objective description of the fundamental operating principle. For an LED, this would explain electroluminescence in a semiconductor p-n junction, where electron-hole recombination releases energy in the form of photons. The bandgap energy of the semiconductor material determines the wavelength (color) of the emitted light. The explanation is technical and avoids marketing language.
13. Development Trends
An objective analysis of industry direction based on the document's context (2014 release). Trends at that time likely included the ongoing push for higher luminous efficacy (lumens per watt), improved color rendering indices (CRI >90), the adoption of new substrate materials for better thermal conductivity, and the miniaturization of packages while maintaining or increasing light output. The trend towards intelligent, connected lighting systems using protocols like DALI or Zigbee might also be noted as an emerging application driver.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |