1. Product Overview
This technical document pertains to a component or system that has undergone a formal revision process. The primary focus of this document is to define the specifications and parameters associated with Lifecycle Phase: Revision 2. The release date for this revision is documented as February 22, 2014, at 10:00:59. A critical characteristic noted is the 'Expired Period', which is designated as 'Forever'. This indicates that this specific revision is intended to remain valid and active indefinitely, without a planned obsolescence or superseding date under normal circumstances. This is a significant attribute for long-term projects, archival purposes, or systems requiring stable, unchanging specifications over extended periods.
The core advantage of this documentation lies in its permanence and stability. For engineers, designers, and system integrators, having a 'Forever' expired period provides certainty. It means that the technical data, interfaces, and performance characteristics described herein are fixed. This eliminates the risk of future changes that could impact compatibility, redesign efforts, or long-term maintenance plans. The target market for such a document includes industries and applications where product lifecycles are exceptionally long, such as aerospace, defense, industrial automation, critical infrastructure, and archival systems. It is also valuable for legacy system support and for creating documentation that serves as a permanent reference point.
2. Technical Parameters and Specifications
While the provided PDF snippet is concise, a complete technical document for a 'Revision 2' would contain extensive objective data. The following sections detail the typical parameters that would be included and their significance.
2.1 Electrical Parameters
A comprehensive set of electrical parameters is fundamental. This includes operating voltage ranges (e.g., nominal voltage, absolute maximum ratings), current consumption (static and dynamic), input/output logic levels (for digital components), impedance characteristics, and power dissipation specifications. For power components, parameters like efficiency, ripple, and noise figures are critical. Each parameter must be presented with clear conditions (e.g., temperature, supply voltage) and include minimum, typical, and maximum values where applicable. The 'Forever' status of this revision implies that these electrical parameters are guaranteed not to change, providing a solid foundation for circuit design.
2.2 Physical and Mechanical Specifications
This section covers all physical attributes. For electronic components, this includes detailed package dimensions (length, width, height, often provided in millimeters), pinout diagrams, pad layout recommendations for PCB design, and material composition. Mechanical specifications might cover weight, mounting hole patterns, connector types, and environmental sealing ratings (e.g., IP rating). The dimensional stability is crucial for mechanical integration and ensuring fit within assemblies over the product's lifetime.
2.3 Environmental and Reliability Data
Key to any technical document are the limits within which the component or system can operate reliably. This includes the operating temperature range (commercial, industrial, or military grade), storage temperature range, humidity tolerance, and resistance to shock and vibration. Reliability data, often presented as Mean Time Between Failures (MTBF) or Failure In Time (FIT) rates, is derived from standardized testing. The 'Forever' expired period suggests that the reliability claims and environmental ratings are considered permanently valid for this revision.
3. Performance Characteristics and Curves
Graphical data provides deeper insight than tabular data alone.
3.1 Characteristic Curves
Typical performance curves include the current-voltage (I-V) characteristic, which shows the relationship between applied voltage and resulting current. Transfer characteristics show output response versus input signal. For frequency-dependent components, Bode plots (gain and phase vs. frequency) are essential. These curves help designers understand non-linear behavior and optimize circuit performance.
3.2 Temperature Dependency Analysis
Most electrical parameters vary with temperature. Graphs showing key parameters (e.g., forward voltage, output current, gain) plotted against temperature are vital for designing robust systems that must operate across a specified temperature range. This analysis ensures performance is maintained at environmental extremes.
4. Application Guidelines and Design Considerations
This section translates raw specifications into practical design advice.
4.1 Typical Application Circuits
Schematics showing recommended circuit configurations for common use cases. This might include basic connection diagrams, biasing networks for active components, recommended external component values (resistors, capacitors), and layout examples. These circuits serve as a proven starting point for designers.
4.2 Critical Design Considerations
Highlights potential pitfalls and best practices. Topics include thermal management recommendations (heatsinking requirements), noise mitigation strategies (decoupling capacitor placement, grounding schemes), signal integrity concerns for high-speed applications, and load matching advice. For components with a 'Forever' lifecycle, these considerations are especially important as the design may need to be maintained for decades.
5. Manufacturing and Assembly Information
5.1 Soldering and Reflow Profiles
Provides the thermal profile recommended for soldering the component to a PCB. This includes preheat temperature and time, peak temperature, time above liquidus (TAL), and cooling rate. Adhering to this profile is critical to prevent damage (e.g., delamination, cracking) and ensure reliable solder joints.
5.2 Handling and Storage Conditions
Specifies how components should be stored (typically in moisture-sensitive bags with desiccant for surface-mount devices) and handled (e.g., ESD precautions for sensitive components). Proper storage prevents oxidation of leads and moisture absorption which can cause 'popcorning' during reflow.
6. Lifecycle and Revision Control
6.1 Understanding Revision 2
This document explicitly defines Lifecycle Phase as 'Revision 2'. This indicates it is the second major version of the product's documentation or specifications. Revisions typically incorporate corrections, improvements, or clarifications based on feedback, testing, or field experience with previous versions. The 'Release Date' of 2014-02-22 10:00:59.0 provides a precise timestamp for this revision's formal issuance.
6.2 The Significance of 'Expired Period: Forever'
This is a defining attribute. Unlike many components which have an 'Active', 'Not Recommended for New Designs (NRND)', or 'Obsolete' lifecycle stage, this revision is marked as permanently valid. This decision is often made for products used in long-lifecycle systems where change introduces risk and cost. It assures users that the specifications will not be altered or declared obsolete, supporting long-term availability, maintenance, and repeatability of designs.
7. Technical Comparison and Differentiation
While this document is for a specific revision, its value is often understood in context. The primary differentiator of this revision, as stated, is its permanent 'Forever' status. Compared to standard components with evolving lifecycles, this offers unparalleled stability. There is no need to plan for future component end-of-life (EOL) notifications, last-time buys, or costly redesigns to migrate to a new version. This can result in significant long-term cost savings and risk reduction for suitable applications.
8. Frequently Asked Questions (FAQs)
Q: What does 'LifecyclePhase: Revision' mean?
A: It indicates the document or product is in a revision state, meaning it has been updated from a previous version. 'Revision 2' specifies it is the second such update.
Q: Can the specifications in this document ever change?
A: No. The 'Expired Period: Forever' designation means this specific revision (Revision 2) is frozen. Its content is intended to remain unchanged and valid indefinitely.
Q: How should I reference this document in my own design files?
A: Always reference the full document identifier, including 'Revision 2' and the release date (2014-02-22), to ensure clarity and traceability.
Q: Is the component itself guaranteed to be available forever?
A: Not necessarily. The 'Forever' status applies to the *documentation and specifications* of Revision 2. Physical component manufacturing and availability are separate business decisions, though such a document often aligns with long-term product support plans.
9. Practical Use Cases and Examples
Case Study 1: Aerospace Avionics System
A manufacturer designs a flight control module with a certified operational life of 30 years. Using components and specifications from a document with 'Expired Period: Forever' ensures that the technical baseline for the module remains constant for its entire service life, simplifying maintenance, spare parts provisioning, and recertification processes.
Case Study 2: Industrial Process Control
A factory installs an automated control system for a chemical process. The system must operate reliably for decades. By designing with components specified in 'Forever' revision documents, the plant engineers can be confident that replacement boards or modules built years later will be functionally identical to the originals, ensuring consistent process quality and safety.
10. Technical Principles and Operational Theory
The underlying principle embodied in this document is one of specification stability. In engineering, a specification is a controlled document that precisely defines requirements, dimensions, materials, functions, and performance. The decision to assign a 'Forever' expired period is a formal commitment to the immutability of that specification. This is grounded in configuration management and quality assurance practices, where controlling change is essential for predictability, reliability, and safety in complex systems. It allows for the creation of a permanent technical artifact that can be relied upon without concern for version drift.
11. Industry Trends and Context
The trend in electronics has generally been towards shorter product lifecycles and rapid iteration. However, a counter-trend exists in specific sectors demanding extreme longevity and reliability. The concept of a 'Forever' or 'Long-Term Support' revision addresses this need. It reflects an industry response to markets like industrial IoT, infrastructure, and legacy system support, where products may be in service far longer than the typical commercial technology cycle. This approach prioritizes long-term value, reduced total cost of ownership, and risk mitigation over the latest features or process nodes. It represents a mature segment of the electronics industry focused on durability and dependability.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |