RF-A1F30-W269-A2 White LED Specification - Size 3.0x1.4x0.55mm - Voltage 2.8-3.4V - Power 238mW - Automotive Interior Lighting

1. Product Overview

1.1 General Description

The RF-A1F30-W269-A2 is a white LED fabricated using a blue chip and phosphor conversion. It comes in a compact 3.00mm x 1.40mm x 0.55mm EMC (Epoxy Molding Compound) package, designed for surface mount technology. The package offers an extremely wide viewing angle of 120 degrees, making it suitable for uniform illumination in tight spaces. This LED is qualified under the AEC-Q101 stress test qualification for automotive grade discrete semiconductors, ensuring high reliability for automotive interior lighting applications.

1.2 Features

• EMC Package for excellent heat dissipation and reliability.
• Extremely wide viewing angle (120° typical).
• Suitable for all SMT assembly and solder processes.
• Supplied on tape and reel (5000 pcs/reel).
• Moisture sensitivity level: Level 2 (MSL 2).
• Compliant with RoHS and REACH directives.
• Qualification based on AEC-Q101 guidelines for automotive applications.

1.3 Applications

• Automotive interior lighting (dashboard, dome lights, ambient lighting).
• Switches and indicators in automotive and industrial panels.

2. Package and Mechanical Information

2.1 Package Dimensions

The LED has a top-view footprint of 3.0mm x 1.4mm with a height of 0.55mm. The bottom view shows a central thermal pad and two anode/cathode pads. The polarity is marked by a '+' sign on the package. All dimensions are in millimeters with tolerances of ±0.2mm unless otherwise specified.

2.2 Soldering Patterns

The recommended soldering pattern includes two rectangular pads for anode and cathode and a larger central pad for heat sinking. Dimensions: anode pad 0.5mm x 0.86mm, cathode pad 1.0mm x 0.91mm, and a central pad 1.6mm x 2.61mm (approximate). Proper alignment ensures adequate thermal management.

2.3 Polarity Marking

Anode is marked with a '+' indicator on the top surface, and the cathode corresponds to the other side. The bottom view shows two pads labeled A (anode) and C (cathode). Correct polarity must be observed to avoid reverse current damage.

3. Technical Parameters

3.1 Electrical / Optical Characteristics (at Ts=25°C, IF=60mA)

• Forward Voltage (VF): Min 2.8V, Typ 3.1V, Max 3.4V
• Reverse Current (IR): Not designed for reverse operation; typical leakage is very low at VR=5V.
• Luminous Flux (Φ): Min 17.7 lm, Typ 24 lm, Max 26.9 lm
• Viewing Angle (2θ1/2): Typical 120°
• Thermal Resistance (RTHJ-S): Typical 21°C/W (junction to solder point)

3.2 Absolute Maximum Ratings

• Power Dissipation (PD): 238 mW
• Forward Current (IF): 70 mA (DC), 120 mA (peak, 1/10 duty, 10ms pulse)
• Reverse Voltage (VR): Not designed for reverse operation
• ESD (HBM): 8000 V (90% yield)
• Operating Temperature (TOPR): -40°C to +110°C
• Storage Temperature (TSTG): -40°C to +110°C
• Junction Temperature (TJ): 125°C

4. Bin Ranges and Color Coordinates

4.1 Forward Voltage and Luminous Flux Bins

The LED is sorted into bins across six voltage ranges (G1: 2.8-2.9V, G2: 2.9-3.0V, H1: 3.0-3.1V, H2: 3.1-3.2V, I1: 3.2-3.3V, I2: 3.3-3.4V) and four flux bins (JB: 17.7-19.6 lm, KA: 19.6-21.8 lm, KB: 21.8-24.2 lm, LA: 24.2-26.9 lm). Bins are combined to specify exact VF and flux combinations for consistent performance in production.

4.2 Chromaticity Bins

The CIE chromaticity diagram shows three color bins: IA7, IA8, and IA9. Their coordinates are given in Table 1-4. These bins represent a warm white region with correlated color temperatures approximately in the 3000K-4000K range (typical for automotive interior use). The bin coordinates are tightly controlled to ensure color consistency across production.

5. Typical Performance Curves

5.1 Forward Voltage vs Forward Current

The VF-IF curve (Fig. 1-7) shows a near-linear relationship from 0mA to 140mA. At 60mA the forward voltage is around 3.1V typical. Designers should consider this when calculating power dissipation and current limiting resistor values.

5.2 Forward Current vs Relative Intensity

The relative luminous flux increases with forward current but follows a saturating trend. At 60mA the intensity is approximately 100% relative. Operating at lower currents yields higher efficacy, while higher currents push towards thermal limits.

5.3 Solder Temperature vs Relative Intensity

As solder point temperature rises from 20°C to 120°C, relative intensity drops by about 15% (from 100% to ~85%). Proper heat sinking is essential to maintain light output at high ambient temperatures.

5.4 Solder Temperature vs Forward Current

To avoid exceeding the maximum junction temperature of 125°C, the forward current must be derated as solder point temperature increases. At Ts=100°C, the allowable current is reduced to about 40mA from 70mA at 25°C.

5.5 Forward Voltage vs Solder Temperature

Forward voltage decreases linearly with increasing temperature at a rate of approximately -2 mV/°C. This temperature coefficient is important for constant-current driver design, as voltage variation can affect current regulation.

5.6 Radiation Pattern

The LED exhibits a Lambertian-like emission pattern with wide angular distribution. The relative intensity at ±60° is about 50% of the on-axis value, confirming the 120° viewing angle specification.

5.7 Current vs Color Shift

The CIE-x and CIE-y coordinate shifts are within ±0.005 over the forward current range from 20mA to 120mA at Ts=25°C. This indicates stable color performance across typical driving conditions.

5.8 Spectrum Distribution

The emission spectrum spans from 400nm to 750nm with a peak around 450nm (blue chip) and a broad phosphor emission in the yellow-green region. The relative intensity curve shows typical white LED spectral shape, suitable for general illumination with good color rendering in automotive interiors.

6. Application Design Considerations

6.1 Thermal Management

With a maximum power dissipation of 238 mW and a thermal resistance of 21°C/W, the LED can generate significant self-heating. Proper PCB thermal design (e.g., using thermal vias and a copper plane) is crucial to keep the junction temperature below 125°C. In automotive applications, ambient temperatures can reach 85°C or more, requiring derating of forward current as shown in the derating curve (Fig. 1-10).

6.2 Electrostatic Discharge Protection

The ESD rating is 8000V HBM, but handling precautions are still necessary. Use grounded workstations, antistatic wrist straps, and conductive packaging. Avoid direct contact with the silicone lens to prevent particle contamination and mechanical damage.

6.3 Circuit Design

Always use a current-limiting resistor or constant-current driver to prevent overcurrent. The forward voltage tolerance means that simple voltage driving can lead to current variation. For parallel arrays, consider binning VF groups or using individual resistors. Reverse voltage must be avoided; a blocking diode can be added if reverse polarity is possible.

7. Soldering and Assembly Guidelines

7.1 SMT Reflow Soldering Profile

The recommended reflow profile (Fig. 3-1) specifies a preheat zone from 150°C to 200°C for 60-120 seconds, a ramp-up to 217°C with a maximum time above 217°C of 60 seconds, and a peak temperature of 260°C for up to 10 seconds (within 5°C of peak). Cooling rate should not exceed 6°C/s. Only two reflow cycles are allowed, and if more than 24 hours pass between cycles, the LEDs must be baked again.

7.2 Hand Soldering and Repair

If hand soldering is necessary, use a soldering iron tip temperature below 300°C for less than 3 seconds. Only one hand-soldering operation is permitted. Repair after reflow is not recommended; if unavoidable, use a dual-head soldering iron and verify that LED characteristics are not degraded.

7.3 Handling Precautions

The silicone encapsulant is soft. Avoid applying pressure to the top surface. Do not use adhesives that outgas organic vapors. Avoid exposure to sulfur compounds above 100 ppm, bromine and chlorine compounds above 900 ppm each, and total halogens above 1500 ppm. Use isopropyl alcohol for cleaning if needed; ultrasonic cleaning is not recommended.

7.4 Storage Conditions

Unopened moisture barrier bags can be stored at ≤30°C and ≤75% RH for up to one year. After opening, LEDs should be used within 24 hours (≤30°C, ≤60% RH). If not used within that time, bake at 60±5°C for more than 24 hours. If the desiccant has faded or packaging is damaged, baking is required.

8. Packaging and Storage

8.1 Packaging Specification

The LEDs are supplied on 8mm carrier tape with 178mm diameter reels, each containing 5000 pieces. The tape has a leader and trailer of 80-100 empty pockets. The reel hub diameter is 60mm and the arbor hole is 13mm. Label information includes part number, specification number, lot number, bin code, luminous flux, chromaticity bin, forward voltage, wavelength code, quantity, and date.

8.2 Moisture Sensitivity and Baking

The product is MSL Level 2. If the floor life (24 hours) is exceeded, baking at 60±5°C for more than 24 hours is required. After baking, the device should be used within the specified time or re-baked. Follow the JEDEC moisture sensitivity handling guidelines.

8.3 Storage Recommendations

Keep the sealed bag in a dry, cool environment. Avoid exposure to direct sunlight or high humidity. For long-term storage, maintain temperature below 30°C and humidity below 75% RH.

9. Reliability Testing

9.1 Test Items and Conditions

Reliability tests include: Reflow (260°C, 10 sec, 2x), Thermal Shock (-40°C to 125°C, 15 min dwell, 1000 cycles), High Temperature Storage (125°C, 1000h), Low Temperature Storage (-40°C, 1000h), Life Test (25°C, IF=60mA, 1000h), High Temperature High Humidity Life Test (85°C/85% RH, IF=60mA, 1000h), and Temperature Humidity Storage (85°C/85% RH, 1000h). Acceptance criteria: 0 failure in 20 samples.

9.2 Failure Criteria

Failure is defined as: VF exceeding U.S.L. x 1.1, IR exceeding U.S.L. x 2.0, or luminous flux falling below L.S.L. x 0.7 (U.S.L. = upper spec limit, L.S.L. = lower spec limit). These criteria ensure the LED still meets minimum performance after stress testing.

10. Application Examples

In automotive interior lighting, this LED can be used for dashboard backlighting, indicator lights, and ambient light strips. Its compact size (3.0x1.4mm) allows placement in tight spaces, while the 120° viewing angle provides wide illumination. The AEC-Q101 qualification guarantees reliability under harsh automotive conditions (vibration, temperature extremes). For switch backlighting, the high flux density (up to 26.9 lm at 60mA) ensures clear visibility even in bright daylight. Designers can create uniform light bars by spacing multiple LEDs along a PCB with proper thermal management.

11. Technology Trends

The trend in automotive LED lighting is toward smaller packages with higher efficacy and better thermal performance. EMC packages like this one are replacing traditional PPA/PCT packages due to their superior heat resistance and reliability. Additionally, the push for autonomous driving and advanced driver-assistance systems (ADAS) increases the demand for high-reliability LEDs that can withstand vibration and temperature cycling. Color consistency and binning (as provided here) are also critical for automakers who require uniform lighting across different production batches. Future developments may include even higher efficacy (e.g., >200 lm/W for white LEDs) and integration of smart features (e.g., addressable LEDs for dynamic lighting).