LED Red 1.60x0.80x0.55mm 2.0V 72mW Technical Datasheet - PLCC2 Package AEC-Q101

1. Product Overview

1.1 General Description

The RF-A2P08-R195-A2 is a high-brightness red LED based on AlGaInP epitaxial technology on a substrate. It is housed in a compact PLCC2 package measuring 1.60mm × 0.80mm × 0.55mm (length × width × height). This LED delivers saturated red light with a dominant wavelength centered around 620 nm, a wide 120° viewing angle, and high luminous intensity up to 1200 mcd at 20 mA. It is designed for automotive interior lighting and switch applications, meeting AEC-Q101 stress test qualification. The device is suitable for all SMT assembly processes and is available on tape and reel with 4000 pieces per reel.

1.2 Features

• PLCC2 (1.6×0.8×0.55mm) surface-mount package
• Extremely wide 120° viewing angle
• Suitable for all SMT assembly and soldering processes
• Available on tape and reel (4000pcs/reel)
• Moisture sensitivity level: Level 2 (MSL 2)
• Compliance with RoHS and REACH directives
• Qualifications based on AEC-Q101 guidelines for automotive grade discrete semiconductors

1.3 Application

Typical applications include automotive interior lighting (e.g., dashboard indicators, ambient lighting) and switches. The device's wide viewing angle and high brightness make it ideal for backlighting and status indication in vehicle cabins.

1.4 Package Dimension

The package outline is illustrated in Figures 1-1 to 1-5 of the datasheet. Key dimensions: package body 1.60mm × 0.80mm, height 0.55mm. There is a polarity mark (cathode) indicated by a small notch or dot. The soldering pattern recommended includes pads of suitable size to ensure proper heat dissipation and mechanical strength. All units are in millimeters, with tolerances ±0.2mm unless otherwise noted.

1.5 Product Parameters

Electrical and optical characteristics at Ts=25°C (IF=20mA unless specified):

Absolute maximum ratings at Ts=25°C:

Notes: Forward voltage tolerance ±0.1V, color coordinates tolerance ±0.005, luminous intensity tolerance ±10%. Power dissipation must not exceed absolute maximum rating. The maximum operating current should be determined based on package temperature to keep junction temperature below 120°C. ESD withstand yield >90% at 2000V (HBM), proper ESD handling required.

1.6 Bin Range of Forward Voltage and Luminous Intensity

At IF=20mA, the devices are binned for forward voltage, luminous intensity, and dominant wavelength to ensure consistency:

Forward Voltage Bins: B1 (1.8-1.9V), B2 (1.9-2.0V), C1 (2.0-2.1V), C2 (2.1-2.2V), D1 (2.2-2.3V), D2 (2.3-2.4V)

Luminous Intensity Bins: K2 (650-800mcd), L1 (800-1000mcd), L2 (1000-1200mcd)

Wavelength Bins: D2 (617.5-620nm), E1 (620-622.5nm), E2 (622.5-625nm)

Customers can specify bin combinations for tighter control of optical and electrical characteristics.

1.7 Typical Optical Characteristics Curves

The datasheet includes several characteristic curves measured at Ts=25°C (unless noted):

Forward Voltage vs. Forward Current (Fig.1-7): Shows a nonlinear increase from about 1.7V at 0mA to 2.3V at 30mA. The typical forward voltage at 20mA is 2.0V.

Forward Current vs. Relative Intensity (Fig.1-8): Relative luminous intensity increases approximately linearly with current up to 30mA, reaching about 150% relative to the intensity at 20mA.

Solder Temperature vs. Relative Intensity (Fig.1-9): As the solder point temperature rises from 20°C to 100°C, relative luminous flux decreases to about 80% of the room temperature value, indicating thermal droop.

Solder Temperature vs. Forward Current (Fig.1-10): This curve shows the permissible forward current reduction at elevated solder temperatures to keep the junction temperature below 120°C. At 100°C, the maximum current is reduced to approximately 15mA.

Forward Voltage vs. Solder Temperature (Fig.1-11): Forward voltage decreases linearly with increasing temperature, with a coefficient of approximately -2mV/°C.

Radiation Diagram (Fig.1-12): The radiation pattern is lambertian-like, with intensity dropping to 50% at approximately ±60° off-axis, confirming the 120° viewing angle.

Forward Current vs. Color Shift (Fig.1-13): Dominant wavelength shows a slight shift to shorter wavelengths (blue shift) at higher currents, from about 624nm at 0mA to 622nm at 30mA.

Spectrum Distribution (Fig.1-14): The spectral emission is centered around 620nm with a full width at half maximum (FWHM) of approximately 20nm. No secondary peaks are observed.

2. Packaging Information

2.1 Packaging Specification

Each reel contains 4000 pieces of LEDs. The carrier tape has a width of 8.0±0.1mm, with a pitch of 4.0mm for component pockets. Empty pockets (80-100 pieces) are provided at both ends. The reel dimensions are: outer diameter 178±1mm, hub diameter 60±1mm, and hub slot width 13.0±0.5mm. A polarity mark is printed on the tape.

2.2 Label Form Specification

The label includes: Part Number, Spec Number, Lot Number, Bin Code (for luminous flux, chromaticity, forward voltage, wavelength), Packing Quantity, and Date of manufacture. This ensures traceability.

2.3 Moisture Resistant Packing

The reel is sealed in a moisture barrier bag with a desiccant and a humidity indicator card. An ESD warning label is attached. The bag is then placed into a cardboard box for shipping.

2.4 Reliability Test Items and Conditions

Tests are performed based on industry standards (JEDEC, JEITA). The following tests are conducted with 20 pieces each, acceptance criterion 0/1 (failures/sample):

• Reflow (JESD22-B106): 260°C max, 10 seconds, 2 times
• Thermal Shock (JEITA ED-4701): -40°C(15min) ↔ +125°C(15min), 1000 cycles
• High Temperature Storage (JEITA ED-4701): 125°C, 1000 hours
• Low Temperature Storage (JEITA ED-4701): -40°C, 1000 hours
• Life Test (JESD22-A108): Ta=25°C, IF=20mA, 1000 hours
• High Temperature High Humidity Life (JESD22-A101): 85°C/85%RH, IF=20mA, 1000 hours
• Temperature Humidity Storage (JEITA ED-4701): 85°C/85%RH, 1000 hours

2.5 Failure Criteria for Reliability Tests

After testing, the following limits apply:

• Forward Voltage (VF at IF=20mA): must not exceed 1.1 times the upper specification limit (USL)
• Reverse Current (IR at VR=5V): must not exceed 2.0 times the upper specification limit
• Luminous Flux (at IF=20mA): must not drop below 0.7 times the lower specification limit (LSL)

These criteria ensure that the LED maintains adequate performance over its lifetime.

3. SMT Reflow Soldering Instructions

3.1 Reflow Profile

The recommended reflow soldering profile (based on Sn-Ag-Cu solder) is as follows:

• Ramp-up rate (Tsmax to TP): max 3°C/s
• Preheat: 150°C to 200°C, 60-120 seconds
• Time above 217°C (TL): max 60 seconds
• Peak temperature (TP): 260°C, max 10 seconds (hold time within 5°C of TP: max 30 seconds)
• Ramp-down rate: max 6°C/s
• Time from 25°C to peak temperature: max 8 minutes

Reflow soldering should not be performed more than twice. If the time between two soldering operations exceeds 24 hours, the LEDs may absorb moisture and become damaged. Do not apply stress to the LEDs during heating.

3.2 Soldering Iron

If hand soldering is necessary, use a soldering iron temperature of less than 300°C for less than 3 seconds. Hand soldering should be done only once per LED.

3.3 Repairing

Repair after reflow is not recommended. When unavoidable, use a double-head soldering iron and verify that the LED characteristics are not degraded.

3.4 Cautions

The LED encapsulant is silicone, which has a soft surface. Avoid strong pressure on the top surface during pick-and-place. Do not mount LEDs on warped PCB sections. After soldering, do not bend the board or apply mechanical stress during cooling. Rapid cooling after soldering is prohibited.

4. Handling Precautions

4.1 Operating Environment

Materials in contact with or near the LED must not contain sulfur compounds exceeding 100 ppm. For halogen compliance, the single content of bromine must be less than 900 ppm, chlorine less than 900 ppm, and total content of bromine and chlorine less than 1500 ppm. Volatile organic compounds (VOCs) from fixture materials can penetrate the silicone lens and cause discoloration under heat and light, leading to light loss. Test all materials for compatibility before use. Do not use adhesives that outgas organic vapors.

4.2 Storage Conditions

Before opening the moisture barrier bag: store at ≤30°C and ≤75% RH, within 1 year from the date of shipment. After opening: recommended to use within 24 hours at ≤30°C and ≤60% RH. If the moisture indicator card shows excess humidity or the storage time has exceeded, bake the LEDs at 60±5°C for more than 24 hours before use. If the bag is damaged, contact the supplier.

4.3 ESD Protection

LEDs are sensitive to electrostatic discharge (ESD) and electrical overstress (EOS). Use proper ESD control measures (e.g., grounded workstations, conductive floor mats, wrist straps) when handling. The device is rated for 2000V HBM, with >90% yield. However, ESD damage can still occur if precautions are neglected.

5. Application Recommendations

5.1 Current Limiting and Driving

Always use a current-limiting resistor or constant current driver to keep the forward current within the absolute maximum rating (30 mA). Without a resistor, a small voltage variation can cause a large current shift, potentially burning out the LED. The driving circuit must ensure that reverse voltage is never applied, as it may cause migration and damage.

5.2 Thermal Management

Thermal design is critical. The junction temperature must not exceed 120°C. Consider the ambient temperature, current level, and PCB copper area for heat dissipation. The thermal resistance from junction to solder point is 300°C/W; for example, at 20 mA and 2.0V (40 mW power dissipation), the temperature rise is about 12°C. In high-temperature environments, derate the current as shown in the solder temperature vs. forward current curve.

5.3 Cleaning

If cleaning is required after soldering, isopropyl alcohol is recommended. Do not use solvents that may attack the silicone encapsulant. Ultrasonic cleaning is not recommended as it may damage the LED. Ensure the cleaning solution does not leave residues.

5.4 Mechanical Handling

Handle LEDs with tweezers by the sides, not by the lens. Avoid dropping or applying pressure to the top surface. The silicone lens is softer than standard epoxy and can be scratched or cracked by sharp objects.

6. Principle of Operation

The RF-A2P08-R195-A2 is a direct bandgap semiconductor device based on the AlGaInP (aluminum gallium indium phosphide) material system. The active region consists of a multiple quantum well (MQW) structure sandwiched between p-type and n-type cladding layers. When forward biased, electrons and holes are injected into the quantum wells and recombine radiatively, emitting photons with energy corresponding to the red wavelength (~620 nm). The substrate and transparent contact layers are optimized for light extraction. The wide 120° viewing angle is achieved through the package lens design and the use of a transparent encapsulant.

7. Frequently Asked Questions

Q: Can I use this LED for general illumination?
A: It is primarily designed for indicator and automotive interior applications, not for general lighting. The luminous flux is up to 1200 mcd, which is suitable for status indication.

Q: What is the maximum ambient temperature for continuous operation?
A: The operating temperature range is -40°C to +100°C. However, at higher temperatures, the forward current must be derated to keep the junction temperature below 120°C.

Q: How should I store opened reels?
A: Store at ≤30°C and ≤60% RH and use within 24 hours. If not used within that time, bake at 60°C for 24 hours before use.

Q: Can I solder two times?
A: Yes, but not more than twice. Ensure the interval between soldering cycles is less than 24 hours; otherwise, baking may be required.

Q: Is the device suitable for high-humidity environments?
A: The moisture sensitivity level is 2, so it can withstand exposure to 85°C/85%RH during life testing, but prolonged high-humidity without power should consider the storage conditions.

Q: What precautions should I take against ESD?
A: Use grounded workstations, conductive mat, and wrist strap. The device has 2kV ESD rating, but ESD events above that can damage it.