RF-A3H40-W60P-E5 White LED Specification - 5.6x3.0x0.8mm - 12V - 12W - 1200-1750lm

1. Product Overview

This white LED is fabricated using a blue chip and phosphor conversion technology, delivering a broad white spectrum suitable for automotive exterior lighting. The package dimensions are 5.6mm x 3.0mm x 0.8mm, featuring a robust ceramic substrate that ensures excellent thermal management and reliability. Key features include an extremely wide viewing angle of 120 degrees, compatibility with all SMT assembly and soldering processes, packaging on tape and reel, moisture sensitivity level 2, full RoHS compliance, and qualification per the AEC-Q102 stress test standard for automotive-grade discrete semiconductors. This LED is specifically designed for demanding automotive lighting applications such as headlights, daytime running lights, and fog lamps, where high luminous flux, long lifetime, and environmental robustness are critical.

2. Technical Parameter Interpretation

2.1 Electrical and Optical Characteristics (at Ts=25°C, IF=1000mA)

The following table summarizes the key parameters:

• Forward Voltage (VF): Min 12.0V, Typ 12.0V (typical curve), Max 14.4V. (Note: typical curves show 12.0V at 1000mA.)
• Reverse Current (IR): Max 10 µA at VR=20V.
• Luminous Flux (Φ): Min 1200 lm, Typ 1300-1750 lm (depending on bin), Max 1750 lm.
• Viewing Angle (2θ1/2): Typ 120 degrees.
• Thermal Resistance (RTHJ-S): Typ 0.83 °C/W, Max 1.08 °C/W.

These parameters indicate a high-efficiency, high-power device. The low thermal resistance is crucial for maintaining junction temperature below the maximum rated 150°C, especially under high current operation.

2.2 Absolute Maximum Ratings

• Power Dissipation (PD): 21600 mW (21.6 W)
• Forward Current (IF): 1500 mA DC, peak forward current (IFP) 2000 mA (1/10 duty cycle, 10ms pulse).
• Reverse Voltage (VR): 20 V
• Electrostatic Discharge (ESD HBM): 8000 V (>90% yield)
• Operating Temperature (TOPR): -40°C ~ +125°C
• Storage Temperature (TSTG): -40°C ~ +125°C
• Junction Temperature (TJ): 150°C max

Designers must ensure that power dissipation never exceeds the absolute maximum rating. Adequate heat sinking is essential, and current should be derated at high solder temperatures (see performance curves).

3. Binning System

3.1 Forward Voltage Bins (IF=1000mA)

The forward voltage is divided into three bins: D1 (12.0-12.8V), E1 (12.8-13.6V), F1 (13.6-14.4V). This allows tight regulation of system voltage design.

3.2 Luminous Flux Bins

Luminous flux is binned as follows: DF (1200-1300 lm), EA (1300-1450 lm), EB (1450-1600 lm), EC (1600-1750 lm).

3.3 Chromaticity Bins

Three color bins are defined: 57N, 60N, 65N, each with four quadrilateral corner coordinates (CIE 1931). For example, bin 57N: X1=0.3221 Y1=0.3255, X2=0.3206 Y2=0.3474, X3=0.3375 Y3=0.3628, X4=0.3365 Y4=0.3381. Users can select the desired color point for specific application requirements.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (Fig. 1-7)

The curve shows a typical increase from 9V at 0mA to 14V at 1500mA, with a knee around 10-11V. At 1000mA, VF is approximately 12V. The non-linear behavior must be accounted for in driving current design.

4.2 Forward Current vs. Relative Intensity (Fig. 1-8)

Relative luminous flux increases sub-linearly with current. At 1000mA, relative intensity is about 100% (normalized). At 500mA, about 60%; at 1500mA, about 140%. This helps estimate flux at different drive currents.

4.3 Solder Temperature vs. Relative Intensity (Fig. 1-9)

Relative intensity decreases with rising solder temperature: -40°C gives ~130%, 25°C ~100%, 125°C ~70%. Thermal management is critical to maintain high light output.

4.4 Solder Temperature vs. Forward Current (Fig. 1-10, Tj≤150°C)

This derating curve shows maximum allowed forward current decreases from 1500mA at 25°C to 800mA at 100°C, and 0mA above 125°C. Designing for worst-case solder temperature is essential.

4.5 Forward Voltage vs. Solder Temperature (Fig. 1-11)

Forward voltage drops linearly with temperature (approximately -2mV/°C). At -40°C VF~13.6V, at 125°C VF~12.2V. This affects power dissipation calculations.

4.6 Radiation Diagram (Fig. 1-12)

The radiation pattern is Lambertian-like: relative intensity drops to 50% at ±60°, 10% at ±90°. The wide 120° viewing angle makes this LED suitable for applications requiring uniform illumination.

4.7 Chromaticity vs. Solder Temperature (Fig. 1-13)

Color coordinates shift slightly with temperature. For example, at 25°C, CIE x ~0.325, y ~0.330; at 125°C, x ~0.318, y ~0.323. This shift is small and within acceptable limits for automotive lighting.

4.8 Spectrum Distribution (Fig. 1-14)

The emission spectrum is broad from 400nm to 750nm, with a blue peak around 450nm and a broad yellow phosphor peak around 560nm. This yields a high color rendering suitable for exterior signal lights.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED is housed in a 5.60mm × 3.00mm × 0.80mm ceramic package. The bottom view shows two large thermal pads (2.75mm × 1.20mm) and two smaller anode/cathode pads. Polarity is marked with a notch on the top. Soldering patterns are recommended with pads of 2.35mm × 1.25mm spaced at 5.05mm pitch. All dimensions have ±0.2mm tolerance unless otherwise noted.

5.2 Polarity Identification

The anode pad is larger at the bottom, and the cathode pad is smaller. A corner chamfer on the top indicates polarity (see Fig. 1-4).

5.3 Soldering Pattern Recommendation

To optimize thermal and electrical performance, the recommended PCB land pattern should match the bottom pad dimensions. A symmetrical layout helps balance thermal expansion.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The standard reflow soldering profile includes: ramp-up rate ≤3°C/s; preheat from 150°C to 200°C for 60-120s; time above 217°C (TL) max 60s; peak temperature (TP) 260°C for max 10s; cooling rate ≤6°C/s. Total time from 25°C to peak is maximum 8 minutes. Reflow soldering should not exceed two times, and the interval between two reflows should not exceed 24 hours to avoid moisture damage.

6.2 Repair and Rework

Repair should be avoided. If necessary, a double-head soldering iron may be used, but the reliability impact must be pre-validated.

6.3 Handling Precautions

The silicone encapsulant is soft; mechanical pressure on the lens surface must be avoided. Do not mount on warped PCBs, and do not apply force/vibration during cooling. Use isopropyl alcohol for cleaning if needed; ultrasonic cleaning is not recommended as it may damage the LED.

6.4 Storage and Baking

Before opening the aluminum bag: store at ≤30°C and ≤75% RH, use within 1 year. After opening: use within 24 hours at ≤30°C and ≤60% RH. If storage exceeds these conditions, bake at 60±5°C for >24 hours before use.

7. Packaging and Ordering Information

7.1 Packaging Specifications

LEDs are shipped in tape and reel packaging: 4000 pieces per reel. Carrier tape dimensions: A0=3.40±0.1mm, B0=6.10±0.1mm, K0=1.00±0.1mm, P0=4.00±0.1mm, W=12.0±0.1mm, T=0.25±0.05mm, etc. Reel dimensions: A=13.6±0.1mm, B=180±1mm, C=100±1mm, D=13.0±0.5mm.

7.2 Label Information

Each reel includes a label with: Part Number, Spec Number, Lot Number, Bin Code (luminous flux, chromaticity, forward voltage, wavelength), Quantity, and Date.

7.3 Moisture Resistant Packing

The reel is sealed in a moisture barrier bag with a desiccant and humidity indicator card. After opening, the LEDs should be used immediately or stored in a dry cabinet.

8. Application Recommendations

8.1 Typical Applications

Automotive exterior lighting: headlights (low beam, high beam), daytime running lights (DRL), front fog lights, turn signals, and taillights.

8.2 Design Considerations

• Thermal management: Use adequate heat sinking to keep solder temperature below 125°C. The thermal resistance from junction to solder point is 0.83°C/W typical.
• Current regulation: Always include a series resistor or use constant-current drivers to prevent current runaway due to VF temperature coefficient.
• ESD protection: Although the device withstands 8kV HBM, proper ESD handling during assembly is mandatory.
• Sulfur and halogen limits: Avoid materials containing >100ppm sulfur compounds, and keep bromine and chlorine each <900ppm (total <1500ppm) to prevent LED degradation.

9. Comparative Advantages

Compared to conventional plastic-packaged high-power LEDs, this ceramic-package device offers superior thermal dissipation (low thermal resistance), higher reliability under thermal shock, and compatibility with AEC-Q102 qualification. The wide viewing angle of 120° reduces the need for secondary optics in spread-light applications. The high luminous efficacy (up to 1750 lm at 12W) makes it competitive with other automotive-grade LEDs in its power class.

10. Frequently Asked Questions

Q1: What is the recommended operating current for maximum reliability?
A1: For long-term reliability, operate at 1000mA or lower with proper heat sinking. The absolute maximum is 1500mA DC, but derating is required at elevated temperatures.

Q2: Can this LED be used in indoor lighting?
A2: It is optimized for automotive exterior applications, but can be used in high-bay or outdoor lighting if the thermal and environmental conditions are met.

Q3: How should I clean the LED after soldering?
A3: Use isopropyl alcohol with a soft brush. Do not use ultrasonic cleaning or solvents that may attack silicone.

Q4: What is the lifetime expectancy?
A4: Based on AEC-Q102 testing, the LED should maintain >90% lumen maintenance for >5000 hours at rated current and temperature. Contact manufacturer for detailed LM-80 data.

11. Practical Design Cases

Case 1: Low-beam Headlamp Module
A typical design uses 6-8 LEDs in series driven by a constant current of 1000mA. Total voltage ~72-96V. A metal-core PCB (MCPCB) with thermal vias connects to the heatsink. Simulation shows junction temperature remains below 130°C at 85°C ambient with proper heatsink.

Case 2: Daytime Running Light (DRL)
For a linear DRL strip, 3-4 LEDs in series are used at 700mA to achieve ~1000 lm. The wide viewing angle ensures uniform light distribution. The ceramic package allows a compact, low-profile design.

12. Working Principle

This white LED uses a blue InGaN chip that emits light at approximately 450nm. The blue light excites a yellow-emitting phosphor (YAG:Ce or similar) embedded in the silicone encapsulant. The combination of blue and yellow light produces white light. The phosphor composition can be fine-tuned to achieve specific color temperatures; the bins in this specification correspond to cool white (5000-6000K) typical for automotive front lighting.

13. Technology Trends

Automotive lighting LEDs are evolving toward higher luminous efficacy (>200 lm/W), smaller footprints, and integration of advanced features like adaptive driving beams (ADB) and matrix lighting. The trend toward all-LED lighting systems drives demand for packages that offer high reliability under harsh conditions. Ceramic packages like this one are becoming the standard for high-power automotive LEDs due to their superior thermal performance and long-term stability. Future developments may include multi-chip modules, higher voltage configurations, and even tighter binning for color uniformity.