Table of Contents
- 1. Product Overview
- 1.1 General Description
- 1.2 Features
- 1.3 Applications
- 2. Package Dimensions
- 2.1 Soldering Pad Layout
- 3. Technical Parameters
- 3.1 Electrical and Optical Characteristics (at Ts=25°C, IF=350mA)
- 3.2 Absolute Maximum Ratings
- 4. Bin Range and Chromaticity
- 4.1 Forward Voltage and Luminous Flux Bins (IF=350mA)
- 4.2 Chromaticity Bins
- 5. Typical Optical Characteristics Curves
- 5.1 Forward Voltage vs. Forward Current
- 5.2 Relative Luminous Flux vs. Forward Current
- 5.3 Temperature Effects
- 5.4 Radiation Diagram
- 5.5 Spectrum Distribution
- 5.6 Chromaticity Coordinate Shift
- 6. Packaging Information
- 6.1 Carrier Tape and Reel Dimensions
- 6.2 Label and Moisture Barrier Bag
- 7. Reliability Test and Qualification
- 8. SMT Reflow Soldering Guidelines
- 9. Handling and Storage Precautions
- 9.1 Handling Precautions
- 9.2 Storage Conditions
- 10. Application Notes
- 11. Design Considerations
- 12. Technical Comparison
- 13. Common Questions
- 14. Actual Application Cases
- 15. Principle of Operation
- 16. Development Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
1.1 General Description
This product is a high-power amber LED using a ceramic package structure, designed for high reliability in demanding automotive exterior lighting applications. The device measures 1.65mm x 1.25mm x 0.80mm, making it compact for space-constrained modules. It delivers excellent thermal performance and long lifetime under automotive stress conditions.
1.2 Features
- Ceramic package for superior heat dissipation and reliability.
- High power and high luminance output.
- Pb-free reflow soldering compatible.
- Moisture sensitivity level: Level 2.
- Compliance with RoHS and REACH directives.
- Qualified according to AEC-Q102 Stress Test Qualification for Automotive Grade Discrete Semiconductors.
1.3 Applications
Automotive exterior lighting including daytime running lamps, headlamps, and fog lamps. The robust ceramic package and high luminous efficacy make it ideal for demanding automotive environments.
2. Package Dimensions
The LED package has dimensions of 1.65mm (length) x 1.25mm (width) x 0.80mm (height). All tolerances are ±0.2mm unless otherwise specified. The bottom view shows two anode/cathode pads with polarity markings. The recommended soldering pattern provides optimal thermal and electrical connection.
2.1 Soldering Pad Layout
The recommended solder pad dimensions are 0.45mm x 0.76mm on each side, with a spacing of 0.30mm between pads. Proper pad design ensures good heat transfer and mechanical stability.
3. Technical Parameters
3.1 Electrical and Optical Characteristics (at Ts=25°C, IF=350mA)
| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Forward Voltage | VF | 2.8 | — | 3.4 | V |
| Reverse Current | IR | — | — | 10 | µA |
| Luminous Flux | Φ | 90 | — | 135 | lm |
| Viewing Angle | 2θ1/2 | — | 120 | — | deg |
| Thermal Resistance (Reel) | RTHJ-S reel | — | 7.6 | 8.3 | °C/W |
| Thermal Resistance (Electrical) | RTHJ-S el | — | 5.1 | 5.6 | °C/W |
Note: The photoelectric conversion efficiency at 25°C pulse mode is 42%. Thermal resistance values are measured with 1000mA at 25°C.
3.2 Absolute Maximum Ratings
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Power Dissipation | PD | 2380 | mW |
| Forward Current | IF | 700 | mA |
| Peak Forward Current (1/10 duty, 10ms) | IFP | 1000 | mA |
| Reverse Voltage | VR | 5 | V |
| Electrostatic Discharge (HBM) | ESD | 8000 | V |
| Operating Temperature | TOPR | -40 ~ +125 | °C |
| Storage Temperature | TSTG | -40 ~ +125 | °C |
| Junction Temperature | TJ | 150 | °C |
Care must be taken not to exceed these limits. The maximum current should be determined based on actual heat dissipation and junction temperature must stay below 150°C.
4. Bin Range and Chromaticity
4.1 Forward Voltage and Luminous Flux Bins (IF=350mA)
The LED is sorted into bins for forward voltage and luminous flux. Voltage bins: G0 (2.8-3.0V), H0 (3.0-3.2V), I0 (3.2-3.4V). Luminous flux bins: AC (90-105 lm), AD (105-120 lm), AE (120-135 lm). This binning system allows customers to select the desired performance range.
4.2 Chromaticity Bins
Two chromaticity bins are defined: AM1 and AM2. Their coordinates are given in the datasheet, covering the amber region of the CIE 1931 diagram. Bin AM1 center is around x=0.57, y=0.42, and AM2 center around x=0.58, y=0.41. This ensures consistent color for automotive lighting applications.
5. Typical Optical Characteristics Curves
5.1 Forward Voltage vs. Forward Current
The forward voltage increases with forward current as expected from a typical LED. At 350mA the voltage ranges from 2.8V to 3.4V. Designers must account for this variation when designing constant current drivers.
5.2 Relative Luminous Flux vs. Forward Current
Relative luminous flux increases non-linearly with current. At higher currents, flux increases at a slower rate due to thermal effects. Operation near the maximum rated current requires careful thermal management.
5.3 Temperature Effects
Junction temperature strongly affects luminous flux: as temperature rises, flux decreases. The curve shows that at 150°C junction temperature, relative flux drops to about 70% of the value at 25°C. Similarly, forward voltage shifts negatively with temperature.
5.4 Radiation Diagram
The LED has a wide viewing angle of 120 degrees (FWHM), suitable for applications requiring broad illumination such as fog lamps and daytime running lights. The radiation pattern is symmetrical.
5.5 Spectrum Distribution
The amber LED spectrum peaks around 590-595 nm with a narrow half-width. This is typical for InGaAlP-based amber LEDs used in automotive signaling.
5.6 Chromaticity Coordinate Shift
Chromaticity coordinates shift slightly with both junction temperature and forward current. The shifts are within acceptable limits for automotive exterior lighting, ensuring consistent color appearance over the operating range.
6. Packaging Information
6.1 Carrier Tape and Reel Dimensions
The LEDs are packed in carrier tape with dimensions: A0=1.50mm, B0=1.80mm, K0=1.00mm, pitch P0=4.00mm, P1=2.00mm, P2=2.00mm, width W=8.00mm. The reel has an outer diameter of 180±2mm, hub diameter 60±1mm, and width 12±0.3mm. Each reel contains 4000pcs.
6.2 Label and Moisture Barrier Bag
The reel is sealed in a moisture barrier bag with a desiccant and a humidity indicator card. The label includes part number, spec number, lot number, bin code, luminous flux and chromaticity bin, forward voltage bin, quantity, and date.
7. Reliability Test and Qualification
The product is qualified according to AEC-Q102. Key tests include: MSL2 preconditioning with reflow, thermal shock (-40°C to 125°C, 1000 cycles), life test at 120°C with 350mA for 1000 hours, and high temperature high humidity life test (85°C/85%RH, 350mA, 1000 hours). Acceptance criteria: forward voltage change <10% of initial max spec, reverse current <200% of max spec, luminous flux degradation <30% of initial min spec.
8. SMT Reflow Soldering Guidelines
Follow the recommended reflow profile: preheat from 150°C to 200°C for 60-120 seconds, ramp-up rate ≤3°C/s, time above 217°C for 60-120 seconds, peak temperature 260°C for max 10 seconds, cooling rate ≤6°C/s. Do not perform reflow more than twice. If more than 24 hours between soldering, LEDs must be baked. Do not apply stress during heating. Repairing is not recommended; if unavoidable, use a double-head soldering iron.
9. Handling and Storage Precautions
9.1 Handling Precautions
- Avoid mechanical stress on the silicone lens surface.
- Do not mount on warped PCBs or bend the PCB after soldering.
- Do not apply mechanical force or vibration during cooling.
- ESD protection is required: the LED is sensitive to electrostatic discharge up to 8kV HBM.
- Sulfur compounds in the environment must be less than 100PPM; bromine and chlorine compounds each less than 900PPM, total less than 1500PPM.
- VOCs from fixture materials can discolor the LED; verify compatibility before use.
- Use proper current limiting resistors; never exceed absolute maximum ratings.
- Thermal design is critical: consider heat generation to avoid luminous flux drop and color shift.
9.2 Storage Conditions
Before opening the aluminum bag: store at ≤30°C and ≤75% RH for up to one year. After opening: use within 24 hours at ≤30°C and ≤60% RH. If exceed storage time, bake at 60±5°C for at least 24 hours. Do not use if the moisture barrier bag is damaged.
10. Application Notes
This amber LED is ideal for automotive exterior lighting such as daytime running lamps, headlamps, and fog lamps. The ceramic package provides excellent thermal conductivity, enabling high current operation with proper heatsinking. A constant current driver with adequate derating is recommended. For parallel strings, ensure good current sharing. The wide 120° viewing angle is suitable for signal lights. The product meets AEC-Q102 requirements, ensuring reliability under harsh automotive conditions.
11. Design Considerations
When designing the PCB, use a thermal pad under the LED to dissipate heat effectively. The solder pad pattern as shown in the datasheet should be followed to achieve optimal thermal and electrical performance. It is recommended to use a 4-layer PCB with thermal vias if possible. The driving circuit must allow forward voltage only; reverse voltage damage must be prevented. For high-temperature environments, consider the flux derating shown in the characteristic curves. Always test the LED in the final fixture to verify thermal and optical performance.
12. Technical Comparison
Compared to plastic package LEDs, this ceramic package LED offers higher thermal conductivity, better resistance to temperature cycling, and lower thermal resistance, making it more suitable for automotive applications. The AEC-Q102 qualification further distinguishes it from standard commercial LEDs. The binning system provides tighter control over color and flux, essential for consistent lighting in vehicles.
13. Common Questions
Q: What is the recommended drive current? A: The typical drive current is 350mA, but up to 700mA is allowed with proper thermal management. For longer life, it is recommended to stay at or below 350mA.
Q: Can this LED be used in turn signals? A: Yes, the amber color and high brightness make it suitable for turn signals, provided the optical design meets regulations.
Q: How should I clean the LED after soldering? A: Use isopropyl alcohol. Do not use ultrasonic cleaning as it may damage the device.
Q: What is the lifespan of this LED? A: The datasheet does not specify lifetime, but based on AEC-Q102 tests, it is expected to last over 10,000 hours under rated conditions.
14. Actual Application Cases
In one case, a daytime running lamp module used 12 of these LEDs driven at 350mA each, achieving over 800 lumens with a beam pattern meeting ECE regulations. The ceramic package allowed the module to operate at 85°C ambient without active cooling. Another fog lamp design used 6 LEDs with a total flux of 600 lumens, passing thermal shock tests from -40°C to 125°C.
15. Principle of Operation
This LED is based on the InGaAlP material system, which emits amber light through electroluminescence. When forward biased, electrons and holes recombine in the active region, releasing photons. The ceramic substrate provides efficient heat extraction, maintaining junction temperature within limits.
16. Development Trends
Automotive lighting is moving toward higher efficacy and smaller packages. Ceramic-based LEDs with AEC-Q102 qualification are becoming standard for exterior lighting. Future trends include integration with smart drivers and adaptive lighting systems. This product is well-positioned to meet current and future automotive requirements.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |