Amber LED 1.6x0.8x0.7mm - Forward Voltage 1.8-2.4V - Power 72mW - Product Specification

1. Product Overview

1.1 General Description

The RF-AUB190TS-CA is a surface-mount amber LED fabricated using an amber chip. Its compact package dimensions are 1.6mm x 0.8mm x 0.7mm, making it ideal for space-constrained applications. The LED emits light in the amber wavelength range (600–610 nm) and is designed for general indication and display purposes.

1.2 Features

• Extremely wide viewing angle: 140° (typical)
• Suitable for all SMT assembly and solder processes
• Moisture sensitivity level: Level 3 (MSL 3)
• RoHS compliant
• Multiple binning options for forward voltage, dominant wavelength, and luminous intensity

1.3 Applications

• Optical indicators (e.g., status lights, backlighting)
• Switches and symbol displays
• General lighting and decorative applications

1.4 Package Dimensions

The LED package measures 1.60mm x 0.80mm x 0.70mm (LxWxH). The recommended soldering pad pattern is provided in the datasheet (Fig. 1-5). Tolerances are ±0.2mm unless otherwise noted. The polarity is indicated by a cathode mark on the bottom view. The package is designed for standard SMT soldering.

1.5 Product Parameters

1.5.1 Electrical/Optical Characteristics (Ts=25°C, I_F=20mA)

1.5.2 Absolute Maximum Ratings (Ts=25°C)

Notes: Pulse condition: 1/10 duty cycle, 0.1ms pulse width. Forward voltage measurement tolerance is ±0.1V. Dominant wavelength measurement tolerance is ±2nm. Luminous intensity measurement tolerance is ±10%. Care must be taken not to exceed the absolute maximum rating. The maximum current should be determined based on package temperature to keep junction temperature below the maximum.

1.6 Typical Optical Characteristics Curves

The datasheet provides several characteristic curves measured at 25°C:

• Forward Voltage vs Forward Current (Fig 1-6): Shows the typical I-V relationship. As forward current increases, forward voltage rises slightly. At 20mA, V_F is around 2.0V (depending on bin).
• Forward Current vs Relative Intensity (Fig 1-7): Relative luminous intensity increases with forward current, approximately linearly at low currents, then saturates. At 30mA, relative intensity is about 1.3 times that at 20mA.
• Pin Temperature vs Relative Intensity (Fig 1-8): As the solder point temperature increases, relative intensity decreases. At 100°C, intensity drops to about 70% of the value at 25°C.
• Pin Temperature vs Forward Current (Fig 1-9): This curve shows the allowable forward current as a function of solder point temperature. At higher temperatures, the maximum allowable current must be derated.
• Forward Current vs Dominant Wavelength (Fig 1-10): The dominant wavelength shifts slightly with current. At higher currents, the wavelength may shift to longer wavelengths (red shift). At 30mA, the shift is about 1-2nm compared to 20mA.
• Relative Intensity vs Wavelength (Fig 1-11): The spectral distribution is narrow with a half bandwidth of about 15nm. The peak is around 605nm (typical amber).
• Radiation Characteristics (Fig 1-12): The polar radiation pattern shows a wide viewing angle of 140°. The intensity is relatively uniform across ±70°.

2. Packaging

2.1 Packaging Specification

The LEDs are packaged in reels of 4000 pieces per reel. The carrier tape dimensions are standard 8mm wide tape with feeding direction indicated. The reel has a diameter of 178±1mm and a width of 8.0±0.1mm. Labels include part number, spec number, lot number, bin code (luminous flux, chromaticity bin, forward voltage, wavelength), quantity, and date code.

2.2 Moisture Resistant Packing

Each reel is placed in a moisture barrier bag with desiccant and a humidity indicator card. The bag is then sealed and placed in a cardboard box. The MSL level is 3, meaning the floor life after opening the bag is 168 hours under controlled conditions (≤30°C, ≤60% RH). If the bag is opened for longer, baking is required (60±5°C for ≥24 hours).

2.3 Cardboard Box

The outer cardboard box contains multiple reels. The box is labeled with product information and handling precautions.

2.4 Reliability Test Items and Conditions

The LED has been qualified through the following reliability tests (all passed with 0 failure in 22 samples):

• Reflow Soldering: 260°C max, 10 sec, 2 times (JESD22-B106)
• Temperature Cycle: -40°C to 100°C, 100 cycles (JESD22-A104)
• Thermal Shock: -40°C to 100°C, 300 cycles (JESD22-A106)
• High Temperature Storage: 100°C, 1000 hrs (JESD22-A103)
• Low Temperature Storage: -40°C, 1000 hrs (JESD22-A119)
• Life Test: 25°C, 20mA, 1000 hrs (JESD22-A108)

2.5 Criteria for Judging Damage

After reliability testing, the LED is considered failed if:

• Forward voltage (V_F at 20mA) exceeds the initial upper spec limit by 1.1 times.
• Reverse current (I_R at 5V) exceeds the initial upper spec limit by 2.0 times.
• Luminous flux drops below 70% of the initial lower spec limit.

3. SMT Reflow Soldering Instructions

3.1 Reflow Soldering Profile

The recommended reflow soldering profile is as follows:

• Average ramp-up rate (from Tsmin to Tp): max 3°C/s
• Preheat temperature range: 150°C to 200°C
• Preheat time (Tsmin to Tsmax): 60-120 seconds
• Time above 217°C: max 60 seconds
• Peak temperature (Tp): 260°C
• Time within 5°C of peak temperature: max 30 seconds
• Cooling rate: max 6°C/s
• Time from 25°C to peak temperature: max 8 minutes

Reflow soldering should not be performed more than twice. If more than 24 hours elapse between two soldering passes, the LED may be damaged due to moisture absorption. Do not apply mechanical stress during heating.

3.2 Soldering Iron

For manual soldering, use a soldering iron temperature below 300°C for less than 3 seconds. Only one manual soldering operation is allowed.

3.3 Repair

Repair after soldering is not recommended. If unavoidable, use a double-head soldering iron and confirm that the LED characteristics will not be damaged.

3.4 Cautions

• Do not mount LEDs on warped PCBs. After soldering, avoid bending the board.
• Do not apply mechanical force or vibration during cooling to room temperature.
• Do not rapidly cool the device after soldering.

4. Handling Precautions

4.1 Environmental Considerations

The operating environment and mating materials should contain less than 100 ppm of sulfur compounds to prevent corrosion. Additionally, the single content of bromine should be less than 900 ppm, chlorine less than 900 ppm, and total bromine and chlorine less than 1500 ppm. VOCs from fixture materials can penetrate the silicone encapsulant and cause discoloration under heat and light, leading to light output loss. It is advised to test all materials for compatibility with the LED.

4.2 Circuit Design

Each LED must not exceed its absolute maximum current rating. Use current-limiting resistors to prevent slight voltage shifts from causing large current changes. The drive circuit should only apply forward voltage during ON/OFF states. Reverse voltage can cause migration and LED damage.

4.3 Thermal Design

Thermal management is critical. Heat generation can lead to brightness reduction and color shift. Proper heat sinking and derating should be considered in system design.

4.4 Storage Conditions

If the moisture absorbent material has faded or storage time exceeded, baking is required. If the package is damaged, contact support.

4.5 ESD and EOS Protection

Like most solid-state devices, LEDs are sensitive to electrostatic discharge (ESD) and electrical overstress (EOS). Proper ESD precautions must be taken during handling and assembly.

5. Application Guidance

Typical applications include optical indicators, switch and symbol displays, and general use. When designing with this amber LED, consider the following: The wide viewing angle (140°) makes it suitable for indicators that need visibility from various angles. The forward voltage binning allows selection of specific voltage ranges to ensure consistent brightness in series strings. For high-reliability applications, derate current based on ambient temperature using the provided derating curves. Ensure adequate heat dissipation, especially when multiple LEDs are closely packed.

6. Technical Comparison

Compared to standard brightness amber LEDs, this model offers a wider viewing angle (140° vs typically 120°) and tighter binning options for wavelength and intensity. The MSL Level 3 allows moderate floor life, but careful moisture control is needed. The LED is RoHS compliant, meeting environmental requirements.

7. Frequently Asked Questions

1. What is the recommended operating current? 20mA is the test condition and typical operating point. Maximum continuous current is 30mA.
2. Can I use this LED at higher currents? Yes, up to 30mA, but ensure the junction temperature does not exceed 95°C.
3. How long can the LED be stored after opening the bag? 168 hours at ≤30°C and ≤60% RH. If exceeded, baking at 60±5°C for 24 hours is required.
4. What is the typical luminous intensity? It depends on the bin selected, ranging from 70 mcd to 260 mcd at 20mA.
5. Is the LED resistant to sulfur? The environment should contain less than 100 ppm sulfur compounds.

8. Physical Principle

An amber LED emits light through electroluminescence in a semiconductor material (likely AlGaInP or similar) with a bandgap corresponding to amber light (600-610 nm). When forward biased, electrons recombine with holes in the active region, releasing photons. The wide viewing angle is achieved by the package design, which disperses light through a diffusing encapsulant.

9. Development Trends

The LED industry continues to improve efficacy and reduce cost. For amber LEDs, trends include higher luminous efficacy, narrower spectral widths for better color purity, and improved thermal management to allow higher drive currents in smaller packages. This product represents a balance between performance and compact size, suitable for modern SMT assembly.