LED Orange PLCC2 2.2x1.4x1.3mm - Forward Voltage 1.8V - Power 69mW - Dominant Wavelength 605nm - English Technical Data Sheet

1. Product Overview

The RF-AURB14TS-AA-B is a high-performance surface-mount LED in a PLCC2 package, designed for demanding automotive and industrial applications. The device utilizes advanced AlGaInP (Aluminum Gallium Indium Phosphide) epitaxial technology on a substrate to generate saturated orange light with a dominant wavelength centered at 605 nm. The compact package measures 2.2 mm × 1.4 mm × 1.3 mm, making it suitable for space-constrained designs while providing excellent thermal dissipation through the bottom thermal pad.

Key features include an extremely wide viewing angle of 120°, compatibility with all SMT assembly processes, and compliance with RoHS and REACH directives. The product qualification test plan is based on the AEC-Q101 Stress Test Qualification for Automotive Grade Discrete Semiconductors, ensuring robust reliability under harsh conditions. The moisture sensitivity level is rated at Level 2, requiring careful handling after opening the sealed packaging.

1.1 Features

• PLCC2 standard package for easy pick-and-place
• Extremely wide 120° viewing angle for uniform light distribution
• Suitable for all SMT assembly and soldering processes (reflow, wave, hand soldering)
• Available on tape and reel for automated manufacturing
• Moisture sensitivity level: Level 2 (per J-STD-033)
• Compliant with RoHS and REACH environmental standards
• Qualified according to AEC-Q101 for automotive applications

1.2 Applications

Primary application: Automotive lighting interior, including dashboard indicators, infotainment system backlighting, ambient lighting strips, and button illumination. The wide viewing angle and high luminous intensity (up to 120 mcd at 5 mA) ensure excellent visibility and aesthetic appeal in vehicle cabins.

2. Technical Parameters

All electrical and optical characteristics are measured at a solder temperature of 25°C unless otherwise noted. The LED is designed to operate at a forward current of 5 mA for typical applications, with an absolute maximum rating of 30 mA DC.

The forward voltage of this LED is relatively low compared to competing technologies, with a typical value of 1.8 V at 5 mA. This low voltage enables direct drive from low-voltage power rails and reduces power dissipation in the LED itself. The reverse current is limited to 10 µA at 5 V reverse bias, ensuring negligible leakage in reverse polarity conditions.

Luminous intensity is binned from 65 to 120 mcd at 5 mA, providing three intensity grades (F1, F2, G1). The dominant wavelength is tightly controlled within a 7.5 nm range (602.5–610 nm), with center at 605 nm, corresponding to a saturated orange hue. The wide 120° viewing angle makes the LED ideal for applications requiring large-area illumination without hot spots.

2.1 Absolute Maximum Ratings

The absolute maximum ratings must never be exceeded during operation. The LED can handle a peak forward current of 100 mA with a 1/10 duty cycle and 10 ms pulse width, which is useful for multiplexed drive schemes. The junction temperature limit of 120°C requires proper thermal management; the thermal resistance (junction to solder pad) is specified as 300°C/W maximum, so for a power dissipation of 69 mW, the temperature rise above solder point is approximately 20.7°C. This allows the LED to operate safely even under elevated ambient temperatures up to 100°C.

3. Bin System for Forward Voltage, Luminous Intensity, and Dominant Wavelength

To ensure consistent optical and electrical performance, this LED is sorted into bins based on forward voltage, luminous intensity, and dominant wavelength. The binning system enables customers to select devices with tightly matched characteristics for uniform lighting in multi-LED applications.

3.1 Forward Voltage Bins (at IF=5mA)

The forward voltage is divided into six bins: A2 (1.7–1.8 V), B1 (1.8–1.9 V), B2 (1.9–2.0 V), C1 (2.0–2.1 V), C2 (2.1–2.2 V), and D1 (2.2–2.3 V). The typical voltage of 1.8 V falls in bin B1. Choosing a narrow voltage bin reduces variation in current sharing when LEDs are connected in parallel.

3.2 Luminous Intensity Bins (at IF=5mA)

Three intensity bins are defined: F1 (65–80 mcd), F2 (80–100 mcd), and G1 (100–120 mcd). The typical value of 100 mcd is at the boundary of F2 and G1. For maximum brightness, select G1; for cost-sensitive applications, F1 may be sufficient.

3.3 Dominant Wavelength Bins (at IF=5mA)

Three wavelength bins cover the orange spectrum: A2 (602.5–605 nm), B1 (605–607.5 nm), and B2 (607.5–610 nm). The typical value of 605 nm is the lower bound of bin B1. Tight wavelength control ensures color consistency across production batches.

4. Performance Curves Analysis

The typical optical characteristics curves provided in the datasheet offer insight into the LED behavior under various operating conditions. Understanding these curves is critical for proper circuit design and thermal management.

4.1 Forward Voltage vs. Forward Current (I-V Curve)

Figure 1-6 shows the exponential relationship typical of LEDs. At 1.5 V, current is negligible; at 1.7 V, current rises sharply to about 2 mA; at 1.9 V, current reaches approximately 10 mA. This steep slope emphasizes the need for current regulation rather than voltage driving. A small change in voltage (0.2 V) can cause a fivefold change in current, potentially exceeding the absolute maximum rating.

4.2 Forward Current vs. Relative Intensity

Figure 1-7 illustrates the nearly linear relationship between forward current and relative light output up to 8 mA. Doubling the current from 2 mA to 4 mA approximately doubles the light output. Beyond 5 mA, the curve begins to saturate slightly, indicating that maximum efficiency occurs at moderate currents.

4.3 Temperature Effects on Light Output and Forward Voltage

Figure 1-8 shows that as solder temperature increases from room temperature to 120°C, relative luminous flux drops by about 40%. This thermal droop is typical for AlGaInP LEDs and must be accounted for in high-temperature environments such as automotive interiors. Figure 1-10 indicates that forward voltage decreases linearly with temperature (about -2 mV/°C). This negative temperature coefficient helps reduce power dissipation at high temperatures but also requires careful current limiting.

4.4 Maximum Forward Current vs. Solder Temperature

Figure 1-9 provides a derating curve: at a solder temperature of 25°C, the maximum forward current is 30 mA; at 100°C, it reduces to about 12 mA. This derating ensures the junction temperature never exceeds 120°C. Designers should use this curve to determine safe operating current at the expected ambient temperature.

4.5 Radiation Pattern and Spectrum

The radiation diagram (Figure 1-11) confirms a wide lambertian emission pattern with half-power angle of ±60°. The spectrum (Figure 1-13) shows a narrow emission peak at about 605 nm with a full-width at half-maximum (FWHM) of approximately 20 nm, providing pure orange color.

5. Mechanical Dimensions and Packaging

5.1 Package Outline

The LED package is a standard PLCC2 format: 2.2 mm × 1.4 mm × 1.3 mm (L×W×H). The top view shows a rectangular optical window; the side view reveals the package thickness. The bottom view indicates two anode/cathode pads and a central thermal pad. Polarity is marked by a notch on the package (see Figure 1-4). The recommended soldering pattern (Figure 1-5) includes generous copper pads for heat dissipation and proper alignment.

5.2 Tape and Reel Packaging

Components are supplied in 8 mm wide carrier tape on 178 mm diameter reels with 3000 pieces per reel. The carrier tape dimensions (A0 = 1.50 mm, B0 = 2.35 mm, K0 = 1.48 mm) ensure secure pocket retention. The reel has a hub diameter of 60 mm and a total thickness of 13 mm. Each reel is sealed in a moisture barrier bag with desiccant and a humidity indicator card. Storage conditions require temperature ≤30°C and humidity ≤60% RH. After opening, LEDs should be used within 24 hours; otherwise, baking at 60±5°C for at least 24 hours is recommended.

6. SMT Reflow Soldering Guide

Proper soldering is essential to maintain LED reliability. The recommended reflow profile follows JEDEC J-STD-020 with a peak temperature of 260°C (max). The preheat zone (150–200°C) should last 60–120 seconds. The time above 217°C must not exceed 60 seconds, with the peak temperature held for no more than 10 seconds. The cooling rate should not exceed 6°C/s. Two reflow cycles are allowed, provided the interval between them is less than 24 hours; otherwise, the moisture sensitivity may degrade.

Hand soldering is permitted with a tip temperature below 300°C for a maximum of 3 seconds per joint, and only one rework is allowed. Repair work using a dual-head soldering iron should be verified not to damage the LED. The silicone encapsulation is soft; avoid mechanical pressure on the lens during soldering or handling. Do not warp the PCB after soldering, and do not apply rapid cooling.

7. Reliability Tests and Qualification

The LED has undergone extensive qualification tests based on AEC-Q101 standards. Table 2-3 lists five key tests: Reflow (260°C, 10 sec, 2 cycles), MSL2 preconditioning (85°C/60%RH, 168 hrs), Thermal Shock (-40°C to 125°C, 15 min dwell, 1000 cycles), Life Test (Ta=105°C, IF=5mA, 1000 hrs), and High Temperature High Humidity Life Test (85°C/85%RH, IF=5mA, 1000 hrs). All tests accept zero failures out of 20 samples. The pass/fail criteria are: forward voltage shift ≤1.1× USL, reverse current ≤2.0× USL, and luminous intensity ≥0.7× LSL.

8. Handling Precautions and Application Design Considerations

To ensure long-term reliability, several design and handling precautions must be observed:

• Sulfur and Halogen Control: The sulfur element content in the environment and mating materials must not exceed 100 ppm. Bromine and chlorine contents must each be below 900 ppm, and their total below 1500 ppm. Volatile organic compounds (VOCs) can penetrate the silicone encapsulant and cause discoloration; therefore, adhesives and potting materials should be tested for outgassing compatibility.
• ESD Protection: The LED is rated at 2000 V HBM with >90% yield, but handling in ESD-protected areas is mandatory. Use grounded workstations, ionizers, and conductive tools.
• Current Regulation: Always use a current-limiting resistor or constant-current driver. Do not exceed 30 mA DC. Under pulsed conditions, observe duty cycle limits.
• Thermal Management: Provide adequate copper area and thermal vias under the LED pad. The junction temperature must stay below 120°C. Consider ambient temperature derating as per Figure 1-9.
• Cleaning: If cleaning is required, use isopropyl alcohol. Do not use ultrasonic cleaning as it may damage the LED bond wires.
• Storage: Follow the moisture-sensitive device storage conditions. Baking is required if the humidity indicator card shows >30% RH or if the exposure time exceeds 24 hours.

9. Technology Comparison: AlGaInP vs. Other LED Technologies

The RF-AURB14TS-AA-B uses AlGaInP material on a substrate (likely GaAs), which provides high efficiency in the red-orange-yellow spectrum. Compared to InGaN-based LEDs for blue/green, AlGaInP offers very low forward voltage (1.8 V typical vs. 2.8–3.2 V for InGaN), enabling direct battery operation. However, AlGaInP has a higher thermal droop, so derating is essential. The PLCC2 package is widely adopted in automotive applications because of its small footprint and compatibility with automated assembly.

10. Design Case Study: Automotive Interior Ambient Lighting

Consider a dashboard ambient light strip requiring 10 orange LEDs with uniform brightness. Using the G1 intensity bin (100–120 mcd) and B1 wavelength bin (605–607.5 nm) ensures tight color and brightness matching. The LEDs are driven at 5 mA via a constant-current IC. A resistor in series with each LED compensates for forward voltage variations. Thermal analysis shows that at 5 mA and 25°C ambient, the junction temperature rise is only about 4.5°C (0.009 W × 300°C/W = 2.7°C plus ambient margin), well within the safe range. The wide 120° viewing angle provides even illumination without visible hotspots.

11. Frequently Asked Questions

Q1: Can I drive this LED at 20 mA directly from a 3.3V supply without a resistor?
A: No. The forward voltage at 20 mA is approximately 2.0 V (see I-V curve). A 3.3 V supply would cause excessive current (over 30 mA) and damage the LED. Always use a current-limiting resistor (e.g., (3.3–2.0)/0.02 = 65 Ω) or a constant-current driver.

Q2: What is the typical lifetime of this LED?
A: Based on the AEC-Q101 life test at 105°C and 5 mA for 1000 hours with zero failures, extrapolated lifetime is typically >50,000 hours at lower temperatures. Actual lifetime depends on operating conditions.

Q3: Can I parallel multiple LEDs without individual resistors?
A: It is not recommended because variations in forward voltage lead to current imbalance. If parallel operation is necessary, select LEDs from the same voltage bin and add small balancing resistors (e.g., 10 Ω) in each branch.

Q4: What is the minimum current for visible light output?
A: Even at 0.5 mA, the LED emits detectable orange light due to the high efficiency. The minimum recommended operating current is 1 mA to ensure stable color.

12. Working Principle of AlGaInP LEDs

AlGaInP is a direct bandgap semiconductor compound from the III-V group. The active layer consists of a quantum well structure grown on a lattice-matched GaAs substrate (or with a transparent substrate for improved light extraction). When forward-biased, electrons and holes recombine radiatively, emitting photons with energy corresponding to the bandgap. By adjusting the aluminum and gallium fractions, the emission wavelength can be tuned from about 560 nm (yellow-green) to 650 nm (deep red). For this orange LED, the composition yields a peak wavelength around 605 nm. The AlGaInP material system has high internal quantum efficiency and low resistivity, resulting in low forward voltage.

13. Development Trends in Automotive LED Packaging

The industry trend is toward smaller packages with higher reliability and more stringent color control. PLCC2 remains popular for mid-power applications, while chip-scale packages (CSP) and EMC packages are emerging for higher power density. However, for automotive interior lighting where cost and robustness are priorities, PLCC2 continues to be widely adopted. Future developments include improved thermal performance through advanced substrate materials (e.g., AlN) and tighter wavelength binning to meet the requirements of multi-LED systems with minimal color deviation.