LED Specification RF-BNB170TS-CE - 2.0x1.25x0.7mm - 3.2V Forward Voltage - 70mW Power - Blue Color

1. Product Overview

1.1 General Description

The colour LED is fabricated using a blue chip. Package dimensions: 2.0mm x 1.25mm x 0.7mm. It is designed for surface mount technology and offers a wide viewing angle. This LED provides consistent blue light emission with high reliability.

1.2 Features

• Extremely wide viewing angle (140° typical)
• Suitable for all SMT assembly and solder processes
• Moisture sensitivity level: Level 3 (MSL 3)
• RoHS compliant, free of hazardous substances

1.3 Application

• Optical indicator
• Switch and symbol display
• General use in various electronic devices

2. Technical Parameters

2.1 Electrical and Optical Characteristics

All measurements are performed at Ts=25°C, IF=20mA unless otherwise noted.

Note: Voltage bins G1–J1, wavelength bins D10–E20, and intensity bins 1AP–1AW are available for selection according to application needs. Measurement tolerances: VF ±0.1V, λD ±2nm, IV ±10%.

2.2 Absolute Maximum Ratings

These ratings must not be exceeded even momentarily. Operating beyond absolute maximum ratings may cause permanent damage.

2.3 Binning System

The LED is binned by forward voltage, dominant wavelength, and luminous intensity. Voltage bins range from 2.8V to 3.5V in steps of 0.1V. Wavelength bins cover 465.0–475.0nm in 2.5nm increments. Intensity bins offer three levels from 90 to 200mcd. This binning ensures consistency and allows customers to select the exact performance needed for their design.

3. Performance Curves

3.1 Forward Voltage vs Forward Current

The I-V characteristic shows a nearly linear increase in forward current from 0 to 30mA as voltage rises from 0 to about 3.3V. At the typical operating point of 20mA, the forward voltage is around 3.0–3.3V depending on bin.

3.2 Forward Current vs Relative Intensity

Relative intensity increases with forward current, approaching saturation at higher currents. At 20mA, the relative intensity is approximately 1.0 (normalized).

3.3 Pin Temperature vs Relative Intensity

As the pin temperature rises from 25°C to 100°C, relative intensity decreases by about 20–30%. Thermal management is important to maintain consistent light output.

3.4 Pin Temperature vs Forward Current

The maximum allowable forward current derates as pin temperature increases. At 85°C, the recommended current is reduced to prevent overheating.

3.5 Forward Current vs Dominant Wavelength

Dominant wavelength shifts slightly with forward current. Over the 0–30mA range, the change is less than 2nm, indicating good wavelength stability.

3.6 Relative Intensity vs Wavelength

The spectral distribution peaks at approximately 470nm with a half-bandwidth of 15nm. The emission is in the blue region, typical for InGaN-based chips.

3.7 Radiation Characteristics

The radiation pattern is Lambertian-like, with a wide viewing angle of 140° (full width at half maximum). This makes the LED suitable for applications requiring broad illumination.

4. Mechanical and Package Information

4.1 Package Dimensions

The package is 2.0mm x 1.25mm x 0.7mm (LxWxH). The top view shows a rectangular body with two corner chamfers. The bottom view indicates two electrodes: pad 1 (cathode) and pad 2 (anode). The recommended soldering pattern includes a central thermal pad measuring 1.4mm x 0.8mm. All dimensions have a tolerance of ±0.2mm unless noted.

4.2 Carrier Tape and Reel Dimensions

LEDs are packaged in carrier tape with width 8.0mm, pitch 4.0mm, and cavity depth 1.42mm. The tape includes a polarity mark. Reel dimensions: outer diameter 178±1mm, hub diameter 60±1mm, arbor hole 13.0±0.5mm, tape width 8.0±0.1mm. Each reel holds 4000 units.

4.3 Label and Marking

The label on the reel includes part number, spec number, lot number, bin code (for flux, chromaticity, forward voltage, wavelength), quantity, and date code. This ensures full traceability.

5. Packaging and Moisture Protection

5.1 Moisture Resistant Packing

Each reel is placed in a moisture barrier bag with a desiccant. The bag is vacuum-sealed and labeled. Storage conditions before opening: ≤30°C, ≤75% RH, shelf life 1 year from date of seal. After opening: ≤30°C, ≤60% RH, usage within 168 hours. If exceeded, baking at 60±5°C for ≥24 hours is required.

5.2 Cardboard Box

Multiple reels are packed in a sturdy cardboard box for shipping. The box is labeled with product information and handling instructions.

6. Soldering Guidelines

6.1 Reflow Soldering Profile

Recommended reflow profile: ramp-up rate ≤3°C/s from 25°C to preheat. Preheat from 150°C to 200°C for 60–120s. Time above 217°C (TL): 60–150s. Peak temperature (TP): 260°C, maximum time at peak: 10s. Cooling rate ≤6°C/s. Total time from 25°C to peak: ≤8 minutes. Reflow soldering should not exceed two times, and the interval between reflows should be within 24 hours to avoid moisture damage.

6.2 Hand Soldering and Repair

If hand soldering is necessary, use a soldering iron with temperature ≤300°C and contact time ≤3 seconds. Only one hand soldering allowed. For repair, a double-head soldering iron is recommended; pre-qualify that the repair does not affect LED characteristics.

6.3 Cautions

Do not mount LEDs on warped PCB. After soldering, avoid bending the board. Do not apply mechanical force or vibration during cooling. Rapid cooling after soldering should be avoided.

7. Handling and Storage

7.1 ESD Sensitivity

This LED is ESD-sensitive (HBM 1000V). Proper ESD protection measures must be taken during handling, assembly, and storage. Use grounded workstations, wrist straps, and conductive containers.

7.2 Chemical Compatibility

The LED should not be exposed to environments with sulfur content exceeding 100ppm. Bromine and chlorine in surrounding materials must each be ≤900ppm, and their total ≤1500ppm. VOCs can discolor the silicone encapsulant; avoid adhesives that outgas organic vapor. For cleaning, isopropyl alcohol is recommended. Ultrasonic cleaning may damage the LED; avoid it.

7.3 Storage Conditions

Store in original moisture barrier bag until use. If bag is damaged or expired, bake before use. Recommended baking: 60±5°C for >24 hours.

8. Reliability Testing

8.1 Test Items and Conditions

The LED has been qualified under:

• Reflow Soldering (JESD22-B106): 260°C max, 10s, 2 times, 22 pcs, 0/1 accept/reject.
• Temperature Cycle (JESD22-A104): -40°C (30min) ↔ 100°C (30min), 5min transition, 100 cycles.
• Thermal Shock (JESD22-A106): -40°C (15min) ↔ 100°C (15min), 300 cycles.
• High Temperature Storage (JESD22-A103): 100°C, 1000 hrs.
• Low Temperature Storage (JESD22-A119): -40°C, 1000 hrs.
• Life Test (JESD22-A108): Ta=25°C, IF=20mA, 1000 hrs.

All tests pass with 0 failures out of 22 samples.

8.2 Failure Criteria

After reliability tests, the device is considered failed if: VF > U.S.L × 1.1, IR > U.S.L × 2.0, or luminous flux < L.S.L × 0.7. U.S.L and L.S.L refer to the upper and lower specification limits defined in the datasheet.

9. Application Notes and Design Considerations

9.1 Circuit Design

To ensure reliable operation, current through each LED must not exceed 20mA. A series resistor is necessary to limit current; a small change in voltage can cause large current variation. For multiple LEDs in parallel, current balancing resistors or matched bins are recommended. Reverse voltage protection should be implemented to prevent damage.

9.2 Thermal Management

Heat generation can reduce light output and change color. The junction temperature must stay below 95°C. PCB design should include adequate copper area for heat sinking. Thermal resistance (junction to solder point) is 450°C/W maximum.

10. Comparison and Market Trends

This LED offers a wide 140° viewing angle and multiple binning options, making it suitable for indicator and display applications where consistent color and brightness are required. Compared to similar 2.0x1.25mm packages, its low thermal resistance (450°C/W) is competitive. The trend in the industry is toward smaller packages, higher efficacy, and tighter binning. This product aligns with those trends by providing a compact footprint, high reliability, and strict parameter control.