LED Red 3.0x3.0x2.1mm - 2.2V - 1.1W - 620nm Technical Specification

1. Product Overview

The RF-E30AG-OUH-FS is a high-power red LED employing an EMC (Epoxy Molding Compound) package that offers excellent reliability and thermal performance. With a compact footprint of 3.00mm x 3.00mm and a low profile of 2.10mm, this device is designed for a wide range of applications including security monitoring, sensors, landscape lighting, and general optical indicators. The LED is RoHS compliant and rated for moisture sensitivity level 3 (MSL 3), making it suitable for lead-free reflow soldering processes.

2. Mechanical Details and Package Dimensions

2.1 Package Outline

The LED is housed in a surface-mount package with dimensions of 3.00mm x 3.00mm x 2.10mm (length x width x height). The top view shows a clear lens with polarity markings: pad ① is the anode and pad ② is the cathode. The side view indicates a total height of 2.10mm. The bottom view reveals the solder pad layout with dimensions: the anode pad is 2.26mm x 0.69mm and the cathode pad is 1.45mm x 0.50mm, with a pitch of 0.46mm between the two pads. A recommended soldering pattern is provided to ensure proper heat dissipation and mechanical stability. All dimensions have a tolerance of ±0.2mm unless otherwise specified.

3. Electrical and Optical Characteristics

3.1 Forward Voltage and Current

At a test condition of IF = 500mA and Ts = 25°C, the forward voltage (VF) has a typical value of 2.2V, with a minimum of 1.8V and a maximum not specified (open). The device can handle a maximum forward current of 500mA and a power dissipation of up to 1.1W. The reverse voltage is rated at 5V maximum, and the reverse current (IR) at VR = 5V is a maximum of 10µA.

3.2 Optical Performance

The dominant wavelength (λD) is 620nm (red) with a typical value and a bandwidth (Δλ) of 30nm. The luminous flux (Φ) at 500mA is 45lm typical. The viewing angle (2θ1/2) is 90 degrees, providing a wide beam suitable for indicator and illumination applications. The thermal resistance from junction to solder point (RTHJ-S) is 14°C/W, ensuring efficient heat transfer.

3.3 Absolute Maximum Ratings

The absolute maximum ratings are as follows: Power dissipation 1.1W, forward current 500mA (with derating considerations), reverse voltage 5V, electrostatic discharge (HBM) 2000V, operating temperature range -40°C to +85°C, storage temperature range -40°C to +100°C, and junction temperature 115°C. Note that for pulsed operation (1/10 duty cycle, 0.1ms pulse width), higher currents may be permissible but must not exceed the junction temperature limit.

4. Typical Optical Characteristics Curves

4.1 Forward Voltage vs. Forward Current

The typical IV curve shows a non-linear relationship. At low currents (<100mA), the forward voltage rises steeply, while above 200mA the slope decreases, indicating the ohmic resistance of the die and package. At 500mA, the forward voltage is approximately 2.2V.

4.2 Forward Current vs. Relative Intensity

The relative light output increases almost linearly with forward current up to 500mA. There is no saturation effect visible within the specification range, suggesting the LED can be efficiently driven at its rated current.

4.3 Temperature vs. Relative Intensity

The light output decreases with increasing solder point temperature. At 85°C, the relative intensity drops to approximately 75% of its value at 25°C. This thermal derating must be considered in system design.

4.4 Spectrum Distribution

The spectral power distribution shows a peak at around 620nm with a full width at half maximum (FWHM) of 30nm. The color is a pure red, suitable for signaling and decorative lighting.

4.5 Radiation Diagram

The radiation pattern is Lambertian-like, with intensity dropping to 50% at ±45° from the optical axis. This provides a wide, uniform illumination beam.

4.6 Solder Point Temperature vs. Forward Current

The maximum allowable forward current decreases as the solder point temperature rises. At 85°C, the recommended current is reduced to about 350mA to keep the junction below its maximum rating.

5. Reliability Test Items and Conditions

The LED has been qualified through a series of reliability tests based on JEDEC standards. Key tests include:

• Reflow soldering: 260°C max for 10 seconds, 3 cycles, 0 failures out of 10 samples.
• Temperature cycle: -40°C to 100°C, 300 cycles, 0 failures.
• Thermal shock: -40°C to 100°C, 100 cycles, 0 failures.
• High temperature storage: 100°C for 1000 hours, 0 failures.
• Low temperature storage: -40°C for 1000 hours, 0 failures.
• Life test: 25°C, IF=500mA for 1000 hours, 0 failures.

Failure criteria: forward voltage increase >1.1x upper spec limit, reverse current >2x upper spec limit, or luminous flux <0.7x lower spec limit.

6. Packaging Information

The LEDs are packaged in tape and reel format with 3000 pieces per reel. The carrier tape has a specific pocket design with polarity marking. The reel dimensions are: flange diameter 330.2±2mm, hub diameter 79.5±1mm, width 14.3±0.2mm, and thickness 12.7±0.3mm. Each reel is sealed in a moisture barrier bag with desiccant and a humidity indicator card. The outer cardboard box dimensions are shown in the specification (not explicitly listed in the PDF but typical for 330mm reels). The label includes part number, spec number, lot number, bin code, luminous flux, dominant wavelength, forward voltage, quantity, and date code.

7. Soldering and Assembly Guidelines

7.1 SMT Reflow Soldering Profile

The LED is compatible with lead-free reflow soldering. The recommended profile has the following parameters:

• Average ramp-up rate: 3°C/s max (from Tsmax to Tp)
• Preheat: 150°C to 200°C for 60-120 seconds
• Time above 217°C: 60 seconds max
• Peak temperature: 260°C, time within 5°C of peak: 30 seconds max, absolute peak time (tp): 10 seconds max
• Cooling rate: 6°C/s max
• Time from 25°C to peak: 8 minutes max

Reflow soldering should not exceed two times. If more than 24 hours elapse between the first and second pass, the LEDs may absorb moisture and be damaged. Hand soldering is allowed with a soldering iron tip temperature below 300°C for less than 3 seconds, only once. Repair work is discouraged; if necessary, use a double-head soldering iron and pre-validate the process.

7.2 Handling Precautions

• The LED encapsulant is silicone, which is soft. Avoid applying pressure on the lens surface during pick-and-place or assembly. Use appropriate nozzles with proper force.
• Do not mount LEDs on warped PCBs nor bend the board after soldering.
• Avoid mechanical stress or vibration during cooling after soldering.
• The operating environment and mating materials must contain sulfur compounds less than 100PPM, bromine content less than 900PPM, chlorine content less than 900PPM, and total bromine+chlorine less than 1500PPM.
• Volatile organic compounds (VOCs) from fixture materials can penetrate the silicone and cause discoloration. Test all materials for compatibility before use.
• Use proper ESD protection; the LED is rated for 2000V HBM but precautions are still needed.
• Storage conditions: before opening aluminum bag, store at ≤30°C and ≤75% RH for up to 1 year. After opening, use within 168 hours at ≤30°C and ≤60% RH. If exceeded, bake at 60±5°C for ≥24 hours.
• Cleaning: isopropyl alcohol is recommended. Other solvents must be verified not to damage the package. Ultrasonic cleaning is not recommended.

8. Application Considerations

This LED is designed for optical indicators, landscape lighting, and general illumination. When designing the driving circuit, always include a current-limiting resistor to prevent overcurrent due to voltage variations. The thermal design is critical: the junction temperature must not exceed 115°C. Ensure adequate heat sinking, especially when operating at high currents. The wide viewing angle (90°) and high luminous flux (45lm at 500mA) make it suitable for area illumination and backlighting. The 620nm red color is ideal for warning lights, traffic signals, and decorative applications. For pulsed operation, duty cycle and peak current must be carefully controlled to avoid exceeding the maximum junction temperature.

9. Principle of Operation

The LED is based on a semiconductor p-n junction made of AlGaInP (aluminum gallium indium phosphide) material system, which is typical for red wavelengths. When forward biased, electrons recombine with holes in the active region, releasing energy in the form of photons with a wavelength corresponding to the bandgap of the material. The EMC package provides a robust, low-stress encapsulation that protects the die and allows efficient light extraction through a clear silicone lens.

10. Development Trends

The trend in high-power LEDs is toward higher efficacy, better thermal management, and smaller footprints. This product, with its EMC package and 3.0x3.0mm form factor, aligns with the industry movement toward compact, reliable surface-mount devices. Future developments may include even higher luminous fluxes and improved color stability. The use of silicone encapsulation rather than epoxy is also a current trend to improve reliability under thermal cycling and UV exposure.