LED Spec Sheet RF-GNB170TS-CF - Size 2.0x1.25x0.7mm - Forward Voltage 2.8-3.4V - Power 105mW - Green Color - English Technical Documentation

1. Product Overview

This device is a color LED fabricated using a green chip. It is designed for general purpose optical indication, switch and symbol displays, and other applications requiring a compact, surface-mount light source. The LED features an extremely wide viewing angle of 140 degrees, making it suitable for applications where uniform light distribution is critical. It is compatible with all standard SMT assembly and soldering processes and meets RoHS compliance requirements. The moisture sensitivity level is rated at Level 3, requiring proper handling and storage to prevent moisture absorption. The package dimensions are 2.0 mm x 1.25 mm x 0.7 mm, allowing for high-density PCB designs.

2. In-Depth Technical Parameter Analysis

2.1 Electrical / Optical Characteristics (at Ts=25°C)

The electrical and optical parameters are specified at a test current of 20 mA unless otherwise noted. The forward voltage (VF) is divided into multiple bins ranging from a minimum of 2.8 V (G1 bin) to a maximum of 3.4 V (J1 bin), with typical values varying across bins. The dominant wavelength (λD) spans from 515.0 nm to 530.0 nm, covering bins D10 through F20. Luminous intensity (IV) ranges from 260 mcd to 900 mcd across bins 1AU to 1CM. The spectral half bandwidth (Δλ) is typically 15 nm. The viewing angle (2θ1/2) is 140 degrees typical. Reverse current (IR) at VR=5V is limited to 10 μA maximum. Thermal resistance from junction to solder point (RTHJ-S) is 450 °C/W maximum.

2.2 Absolute Maximum Ratings

Absolute maximum ratings must not be exceeded even momentarily to avoid permanent damage. The power dissipation (Pd) is 105 mW. Forward current (IF) is 30 mA continuous, with a peak forward current (IFP) of 60 mA at 1/10 duty cycle, 0.1 ms pulse width. Electrostatic discharge (ESD) withstand voltage (HBM) is 1000 V. Operating temperature range (Topr) is -40°C to +85°C. Storage temperature range (Tstg) is -40°C to +85°C. Junction temperature (Tj) should not exceed 95°C.

2.3 Measurement Tolerances

Forward voltage measurement tolerance is ±0.1 V. Dominant wavelength measurement tolerance is ±2 nm. Luminous intensity measurement tolerance is ±10%. All measurements are performed under standard Refond test conditions (note: manufacturer name omitted for compliance).

3. Binning System

The LED is binned according to forward voltage, dominant wavelength, and luminous intensity. Forward voltage bins range from G1 (2.8 V typical) to J1 (3.4 V typical). Wavelength bins include D10 (515.0-517.5 nm), D20 (517.5-520.0 nm), E10 (520.0-522.5 nm), E20 (522.5-525.0 nm), F10 (525.0-527.5 nm), and F20 (527.5-530.0 nm). Luminous intensity bins are 1AU (260-330 mcd), 1AV (330-430 mcd), 1CG (430-560 mcd), 1CL (560-700 mcd), and 1CM (700-900 mcd). End users can specify the required combination of bins for their application.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

The forward voltage increases with forward current in a typical diode exponential relationship. At the test current of 20 mA, the forward voltage is within the specified bins. The curve is provided in Figure 1-6 of the original specification.

4.2 Forward Current vs. Relative Intensity

Relative intensity increases nearly linearly with forward current up to 30 mA, with slight saturation at high currents. This relationship is shown in Figure 1-7.

4.3 Pin Temperature vs. Relative Intensity and Forward Current

As pin temperature rises, relative intensity decreases gradually. For example, at 100°C ambient, relative intensity drops to approximately 80% of the value at 25°C. The maximum allowable forward current also decreases with increasing pin temperature, as shown in Figures 1-8 and 1-9.

4.4 Wavelength Shift with Current and Temperature

The dominant wavelength shifts slightly with forward current, increasing by about 2-3 nm from 5 mA to 30 mA (Figure 1-10). The spectral distribution (Figure 1-11) shows a peak at approximately 520 nm with a half bandwidth of 15 nm.

4.5 Radiation Pattern

The radiation pattern (Figure 1-12) shows a wide angular distribution with relative intensity above 0.8 up to ±60° from the optical axis. The viewing angle of 140° corresponds to the full width at half maximum.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The package measures 2.0 mm (length) x 1.25 mm (width) x 0.7 mm (height). The top view shows two pads (Pad 1 and Pad 2) for electrical connection. Polarity is indicated on the bottom view: the cathode is marked with a green-colored area (as per recent revision). The soldering pattern recommends a pad layout with dimensions of 1.20 mm x 0.80 mm for each pad, with a spacing of 3.20 mm between the centers of the two pads. All dimensions tolerances are ±0.2 mm unless otherwise noted.

5.2 Carrier Tape Dimensions

The LEDs are packaged in carrier tape with a width of 8.00 mm. The pitch between pockets is 4.00 mm, and the distance from the sprocket hole to the pocket center is 1.75 mm. The pocket depth is 1.42 mm, accommodating the 0.7 mm thick LED. The top tape covers the pockets, and polarity marks are provided for orientation.

5.3 Reel Dimensions

The reel diameter is 178 ± 1 mm, with a hub diameter of 60 ± 1 mm and a width of 8.0 ± 0.1 mm. The arbor hole diameter is 13.0 ± 0.5 mm. A label is attached to the reel for identification.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering Profile

The recommended reflow soldering profile follows the standard JEDEC J-STD-020. The average ramp-up rate from Tsmin (150°C) to TP (260°C peak) should not exceed 3°C/s. Preheating zone: Tsmin = 150°C, Tsmax = 200°C, with a soak time of 60-120 seconds. The time above liquidus temperature (TL = 217°C) should be 60-150 seconds. The peak temperature (TP) is 260°C with a maximum time within 5°C of TP of 30 seconds, and the time at actual peak temperature (tp) should not exceed 10 seconds. Cooling rate should not exceed 6°C/s. Total time from 25°C to peak should be less than 8 minutes.

6.2 Hand Soldering and Repair

Manual soldering should be performed at a temperature below 300°C for less than 3 seconds, and only one time. Repair of soldered LEDs is not recommended; if unavoidable, use a double-head soldering iron and verify that the LED characteristics are not damaged.

6.3 Storage Conditions and Baking

Before opening the aluminum bag, store at ≤30°C and ≤75% RH for up to one year from the date of packaging. After opening, the LEDs must be used within 168 hours (≧24 hours) under ≤30°C and ≤60% RH. If the moisture indicator card shows excessive moisture or the storage time has been exceeded, bake the LEDs at 60±5°C for at least 24 hours before use.

7. Packaging and Ordering Information

7.1 Packaging Quantity

The standard packaging quantity is 4000 pieces per reel. The reels are placed in moisture barrier bags with desiccant and a humidity indicator card. The bags are then packed in cardboard boxes.

7.2 Label Information

Each reel is labeled with a label containing: Part Number, Spec Number, Lot Number, Bin Code (including luminous flux bin, chromaticity bin, forward voltage code, wavelength code), Packing Quantity, and Date of Manufacture. An additional ESD warning label is attached to the moisture barrier bag.

8. Application Notes

8.1 Typical Applications

This green LED is ideal for optical indicators, backlighting, switch and symbol illumination, dashboard displays, and general signage. Its wide viewing angle makes it suitable for large-area indication where visibility from multiple angles is required.

8.2 Design Considerations

• Current Limiting: Always use a series resistor to limit current. A slight voltage shift can cause a large current change due to the steep I-V curve. Ensure the current never exceeds the absolute maximum rating of 30 mA.
• Thermal Management: Heat generation degrades luminous efficiency and shifts color. Design the PCB with adequate copper area for heat sinking. For high-density arrays, consider thermal vias.
• ESD Protection: The device is sensitive to electrostatic discharge. Use proper ESD precautions during handling and assembly. Consider adding a reverse protection diode in the driving circuit.
• Environmental Compatibility: Avoid exposure to sulfur compounds (below 100 ppm). Bromine and chlorine content in mating materials should each be below 900 ppm, and total below 1500 ppm. Volatile organic compounds (VOCs) can penetrate the silicone encapsulant and cause discoloration; verify material compatibility before use.
• Mechanical Handling: Do not apply mechanical force on the silicone lens. Use tweezers on the side surfaces. Avoid bending the PCB after soldering. Do not rapidly cool the device after reflow.
• Cleaning: If cleaning is needed, use isopropyl alcohol. Other solvents must be verified not to damage the package. Ultrasonic cleaning is not recommended as it may cause internal damage.

9. Frequently Asked Questions

Q1: What is the maximum storage time before opening the sealed bag?
A: Up to one year at ≤30°C and ≤75% RH.

Q2: Can the LED be used in outdoor applications?
A: The operating temperature range is -40°C to +85°C, which covers many outdoor environments. However, protection from moisture and UV exposure should be considered.

Q3: How do I interpret the bin codes on the label?
A: The bin code includes a luminous flux bin (e.g., 1AU), chromaticity bin (e.g., D10), forward voltage bin (e.g., G1), and wavelength code (e.g., 515). Refer to the product specification for exact boundaries.

Q4: What is the recommended cleaning method if the LED gets contaminated?
A: Isopropyl alcohol is recommended. Do not use ultrasonic cleaning.

10. Practical Application Case

Consider a smart home switch panel with multiple status indicators. A green LED (dominant wavelength ~520 nm) can indicate 'on' or 'connected' status. Because this LED has a wide viewing angle of 140°, the indicator is visible from almost any angle. The small package (2.0x1.25mm) allows multiple indicators to be placed closely together on a compact PCB. Using a series resistor of approximately 180 ohms (for a 5V supply and 2.8V typical forward voltage) limits the current to about 12 mA, well within the safe operating range. The PCB design includes a ground plane for heat dissipation, ensuring the junction temperature stays below 95°C even in a warm enclosure.

11. Principle of Operation

A green LED (light-emitting diode) is a semiconductor device that emits light when electrons recombine with holes in the active region. The green chip is typically made from gallium nitride (GaN) or indium gallium nitride (InGaN) materials. When a forward bias is applied, electrons from the n-type region and holes from the p-type region are injected into the quantum well active layer, where they recombine radiatively, emitting photons with energy corresponding to the bandgap. For green emission, the bandgap is approximately 2.3-2.4 eV, corresponding to a wavelength around 520 nm. The device is encapsulated in a silicone lens that improves light extraction and protects the chip.

12. Industry Development Trends

The market for surface-mount LEDs continues to demand smaller packages with higher luminous efficacy and better color consistency. The trend toward miniaturization (e.g., 0603, 0402 packages) allows for more design flexibility. In the green spectrum, improvements in epitaxial growth and chip design are pushing luminous efficacy above 200 lm/W for high-power devices. Additionally, environmental regulations such as RoHS and REACH drive the elimination of hazardous substances. The integration of ESD protection and improved moisture resistance are ongoing reliability enhancements. Finally, the adoption of smart lighting and IoT will increase the need for reliable, long-life indicator LEDs in connected devices.