RF-GSB170TS-BC Green-Yellow SMD LED - 2.0x1.25x0.7mm - 1.8-2.4V - 72mW - Technical Datasheet

1. Description

1.1 General Description

The RF-GSB170TS-BC is a surface-mount color LED fabricated using a green-yellow chip. It is packaged in a compact 2.0mm x 1.25mm x 0.7mm package, suitable for various general lighting and indicator applications.

1.2 Features

• Extremely wide viewing angle of 140 degrees.
• Suitable for all SMT assembly and solder processes.
• Moisture sensitivity level: Level 3.
• RoHS compliant.

1.3 Applications

• Optical indicator.
• Switch and symbol, display.
• General use.

1.4 Package Dimension

The package dimensions are 2.0mm (length) x 1.25mm (width) x 0.7mm (height). Refer to the figures in the datasheet for detailed mechanical drawings. All dimensions have tolerances of ±0.2mm unless otherwise noted. The bottom view shows the terminal configuration. The soldering patterns are provided for PCB land pattern design.

1.5 Product Parameters

1.5.1 Electrical/Optical Characteristics (at Ts=25°C)

The following are the key electrical and optical parameters measured at 20mA forward current and 25°C:

Note: Forward voltage measurement allowance tolerance is ±0.1V. Dominant wavelength tolerance is ±2nm. Luminous intensity tolerance is ±10%.

1.5.2 Absolute Maximum Ratings

Note: Pulse condition: 1/10 duty cycle, 0.1ms pulse width. Care must be taken to not exceed the absolute maximum ratings. The junction temperature should not exceed 95°C.

1.6 Typical Optical Characteristics Curves

The following curves illustrate the typical performance of the LED under various conditions.

1.6.1 Forward Voltage vs Forward Current

Figure 1-6 shows the relationship between forward voltage and forward current. At 20mA, the forward voltage is approximately 2.0V (typical). The curve is typical for an LED, with increasing current requiring higher forward voltage.

1.6.2 Forward Current vs Relative Intensity

Figure 1-7 shows that relative luminous intensity increases with forward current. At 20mA, the relative intensity is approximately 1 (normalized).

1.6.3 Pin Temperature vs Relative Intensity

Figure 1-8 indicates that the relative intensity decreases as ambient temperature increases. At 100°C, the intensity drops to about 0.85 of the value at 25°C.

1.6.4 Pin Temperature vs Forward Current Derating

Figure 1-9 shows the maximum allowed forward current as a function of pin temperature. At 85°C pin temperature, the forward current must be reduced to maintain reliability.

1.6.5 Forward Current vs Dominant Wavelength

Figure 1-10 shows that wavelength decreases slightly with increasing forward current. At 20mA, the dominant wavelength is about 568nm (typical for green-yellow).

1.6.6 Relative Intensity vs Wavelength (Spectrum)

Figure 1-11 is the spectral distribution plot. The peak wavelength is around 570nm with a half bandwidth of 15nm. The emission is in the green-yellow region.

1.6.7 Radiation Pattern

Figure 1-12 shows the far-field radiation pattern. The viewing angle is 140 degrees, indicating a wide emission angle suitable for indicator applications.

2. Packaging

2.1 Packaging Specification

The LED is packaged in reels containing 4000 pieces per reel.

2.1.1 Carrier Tape Dimensions

The carrier tape has a width of 8.00mm, with a pitch of 4.00mm between cavities. The cavity size accommodates the LED package dimensions. The top tape covers the components during transportation. A polarity mark is indicated on the tape for correct orientation.

2.1.2 Reel Dimensions

The reel diameter is 178mm ±1mm, with a width of 8.0mm. The hub diameter is 60mm ±0.1mm, and the axle hole diameter is 13.0mm ±0.5mm.

2.1.3 Label Form Specification

Each reel is labeled with part number, spec number, lot number, bin code, luminous flux, chromaticity bin, forward voltage, wavelength, quantity, and date of manufacture.

2.2 Moisture Resistant Packing

The reels are placed in a moisture barrier bag with desiccant to protect against moisture absorption. The bag is labeled with handling precautions for electrostatic sensitive devices.

2.3 Cardboard Box

Multiple moisture barrier bags are packed in a cardboard box for shipment.

2.4 Reliability Test Items and Conditions

The LED undergoes reliability tests including reflow soldering (260°C max, 2 times), temperature cycling (-40°C to 100°C, 100 cycles), thermal shock (-40°C to 100°C, 300 cycles), high temperature storage (100°C, 1000 hours), low temperature storage (-40°C, 1000 hours), and life test (25°C, 20mA, 1000 hours). All tests are conducted with 22 pieces per test and the acceptance criteria is 0/1 failure.

2.5 Criteria for Judging Damage

After reliability tests, the criteria for failure are: Forward voltage (at 20mA) exceeds 1.1 times the upper standard level; Reverse current (at 5V) exceeds 2 times the upper standard level; Luminous flux (at 20mA) falls below 0.7 times the lower standard level.

3. SMT Reflow Soldering Instructions

3.1 SMT Reflow Soldering Profile

The recommended reflow soldering profile includes: average ramp-up rate ≤3°C/s; preheat from 150°C to 200°C for 60-120 seconds; time above 217°C (TL) for 60-120 seconds; peak temperature (TP) of 260°C for maximum 10 seconds; cooling rate ≤6°C/s. The total time from 25°C to peak should be ≤8 minutes.

Notes:

• Reflow soldering should not be done more than twice. If more than 24 hours between two solderings, the LED may be damaged.
• Do not put stress on the LEDs during heating.

3.1.1 Soldering Iron

If hand soldering, keep iron temperature below 300°C and soldering time under 3 seconds. Soldering by hand should be done only once.

3.1.2 Repairing

Repair is not recommended. If unavoidable, use a double-head soldering iron. Ensure beforehand that the LED characteristics will not be damaged.

3.1.3 Cautions

Do not mount components on warped PCB portions. After soldering, do not warp the circuit board. Do not apply mechanical force or vibration during cooling. Do not rapidly cool the device after soldering.

4. Handling Precautions

4.1 Handling Precautions

• The operating environment and mating materials should not contain sulfur elements exceeding 100 PPM.
• The single content of Bromine element should be less than 900 PPM, single content of Chlorine element less than 900 PPM, and total content of Bromine and Chlorine less than 1500 PPM in external materials.
• VOCs from fixture materials can penetrate silicone encapsulants and cause discoloration. Avoid using adhesives that outgas organic vapor.
• In circuit design, do not exceed the absolute maximum current per LED. Use protective resistors to prevent burn out from voltage shift. Ensure reverse voltage is not applied to the LED.
• Thermal design is critical. Heat generation can cause brightness decrease and color shift. Consider heat dissipation in the system design.
• Storage conditions: Before opening aluminum bag, store at ≤30°C and ≤75% humidity within 1 year from date. After opening, store at ≤30°C and ≤60% humidity for 168 hours. If storage time exceeded, bake at 60°C ±5°C for ≥24 hours.
• LEDs are sensitive to electrostatic discharge (ESD) and electrical over stress (EOS). Take proper ESD precautions.