LED 1.6x0.8x0.7mm Green-Yellow Specification - Voltage 1.8-2.4V - Power 72mW - English Technical Data

1. Product Overview

This Green-Yellow SMD LED is designed for general indication and display applications. The device is fabricated using a green-yellow chip and housed in a miniature 1.6mm x 0.8mm x 0.7mm package. It offers an extremely wide viewing angle of 140 degrees, making it suitable for applications requiring broad visibility. The LED is compatible with all standard SMT assembly and solder processes, and meets RoHS requirements. Its moisture sensitivity level is rated Level 3, necessitating proper storage and handling conditions.

Key features include high luminous intensity options ranging from 12 mcd to 80 mcd (at 20 mA), dominant wavelength selection from 562.5 nm to 575.0 nm, and forward voltage bins from 1.8 V to 2.4 V. The product is ideal for optical indicators, switches, symbol displays, and general-purpose lighting.

2. Technical Parameter Deep Dive

2.1 Electrical / Optical Characteristics (Ta=25°C)

The following table summarizes the key electrical and optical parameters measured at a forward current of 20 mA unless otherwise stated:

• Forward Voltage (VF): VF is binned into multiple groups: B0 (1.8-2.0V), C0 (2.0-2.2V), D0 (2.2-2.4V). Typical spectral half bandwidth is 15 nm.
• Dominant Wavelength (λD): Available bins include A20 (562.5-565 nm), B10 (565.0-567.5 nm), B20 (567.5-570.0 nm), C10 (570.0-572.5 nm), C20 (572.5-575.0 nm).
• Luminous Intensity (IV): Bins range from B00 (12-18 mcd), C00 (18-28 mcd), D00 (28-43 mcd), E00 (43-65 mcd), to F10 (65-80 mcd).
• Viewing Angle (2θ1/2): Typically 140 degrees at 20 mA.
• Reverse Current (IR): Maximum 10 μA at VR=5V.
• Thermal Resistance (RTHJ-S): Maximum 450°C/W at 20 mA.

2.2 Absolute Maximum Ratings

The absolute maximum ratings must not be exceeded during operation to prevent permanent damage:

• Power Dissipation (Pd): 72 mW
• Forward Current (IF): 30 mA
• Peak Forward Current (Pulse, 1/10 duty, 0.1ms): 60 mA
• ESD (HBM): 2000 V
• Operating Temperature (Topr): -40°C to +85°C
• Storage Temperature (Tstg): -40°C to +85°C
• Junction Temperature (Tj): 95°C

Note: All measurements are performed under standardized conditions. Care must be taken to ensure power dissipation does not exceed the maximum rating. The maximum forward current should be determined based on actual package temperature and heat dissipation to keep junction temperature below the limit.

3. Binning System Explanation

3.1 Voltage Binning

The forward voltage is sorted into three main bins: B0 (1.8-2.0V), C0 (2.0-2.2V), and D0 (2.2-2.4V). This allows customers to select devices suited to their driving circuit design, minimizing current variation when using a fixed resistor.

3.2 Wavelength Binning

Dominant wavelength is binned into 5 nm intervals: A20 (562.5-565 nm), B10 (565-567.5 nm), B20 (567.5-570 nm), C10 (570-572.5 nm), C20 (572.5-575 nm). This ensures color consistency for applications requiring precise hue matching.

3.3 Luminous Intensity Binning

Luminous intensity is sorted into six bins: B00 (12-18 mcd), C00 (18-28 mcd), D00 (28-43 mcd), E00 (43-65 mcd), F10 (65-80 mcd). Designers can select the appropriate bin to achieve the desired brightness level.

4. Performance Curve Analysis

The typical optical characteristic curves provide valuable insights for circuit design:

• Forward Voltage vs. Forward Current (Fig 1-6): Shows the exponential relationship; at 20 mA the VF is around 2.0V typical.
• Forward Current vs. Relative Intensity (Fig 1-7): Relative luminous output increases with current up to 30 mA. Saturation begins at higher currents.
• Pin Temperature vs. Relative Intensity (Fig 1-8): As temperature rises, relative intensity decreases (~20% drop from 25°C to 85°C). Thermal management is critical.
• Pin Temperature vs. Forward Current (Fig 1-9): Shows derating necessary to avoid thermal runaway.
• Forward Current vs. Dominant Wavelength (Fig 1-10): Wavelength shifts slightly with current (approx. 1-2 nm over the range).
• Relative Intensity vs. Wavelength (Fig 1-11): The spectral peak is around 570 nm (green-yellow).
• Radiation Diagram (Fig 1-12): The emission pattern is Lambertian-like with half-power angle of ±70°.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED measures 1.6mm (length) x 0.8mm (width) x 0.7mm (height). The bottom view shows two cathode/anode pads. Polarity is indicated by a chamfered corner on the package. Soldering pads recommended pattern is 0.8mm x 0.8mm with 2.4mm spacing between pads. Tolerances are ±0.2mm unless otherwise noted.

5.2 Carrier Tape and Reel

Standard packaging is 4,000 pieces per reel. The carrier tape has a pitch of 4.00mm, width 8.00mm, and includes a polarity mark. The reel outer diameter is 178±1mm, inner hub 60±1mm, and flange thickness 13.0±0.5mm.

5.3 Label and Moisture Barrier Bag

Each reel is labeled with part number, spec number, lot number, bin code (including luminous flux, chromaticity bin, forward voltage, wavelength), quantity, and date. The reel is sealed in a moisture barrier bag with desiccant and a humidity indicator card.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Profile

The recommended reflow profile follows JEDEC standards with a peak temperature of 260°C for max 10 seconds. Preheat from 150°C to 200°C for 60-120 seconds. Ramp-up rate ≤3°C/s, ramp-down rate ≤6°C/s. Total time from 25°C to peak should be ≤8 minutes. Soldering should not be performed more than twice, and if the interval between two reflows exceeds 24 hours, baking is required to prevent moisture damage.

6.2 Hand Soldering

If manual soldering is necessary, use a soldering iron temperature below 300°C for less than 3 seconds. Only one hand-soldering operation is allowed.

6.3 Storage and Baking

Before opening the sealed bag, the LED should be stored at ≤30°C and ≤75% RH for up to one year. After opening, the devices must be used within 168 hours (≤30°C, ≤60% RH). If these conditions are not met, bake at 60±5°C for ≥24 hours.

7. Packaging and Ordering Information

Standard reel quantity is 4,000 pieces per reel. Outer cardboard box dimensions are standard for SMD reels. Label includes all necessary traceability information. No specific ordering code beyond the part number RF-GSB190TS-BC is provided; customers specify required bins for VF, wavelength, and intensity.

8. Application Recommendations

Typical applications include optical indicators (e.g., status lights), switch backlighting, symbol displays, and general indication in consumer electronics, automotive interiors, and industrial control panels. Due to the wide viewing angle, the LED is suitable for edge-lit panels and area illumination where uniform light distribution is desired. Designers should always incorporate a current-limiting resistor to prevent overcurrent. Thermal design is critical—adequate PCB copper area and heat sinking are recommended when operating near maximum ratings. The LED should not be exposed to environments with sulfur concentration exceeding 100 ppm, nor to materials releasing halogens (Bromine <900 ppm, Chlorine <900 ppm, total <1500 ppm) to avoid corrosion of the silver lead frame. VOCs from adhesives or potting compounds may discolor the silicone encapsulant; compatibility testing is advised.

9. Common Technical Questions

9.1 How to handle ESD sensitivity?

This LED has an ESD rating of 2000V (HBM). Standard ESD precautions (grounded workstations, conductive mats, antistatic wrist straps) should be used during handling and assembly.

9.2 What if the storage time after opening is exceeded?

If the 168-hour floor life is exceeded, bake the devices at 60±5°C for ≥24 hours before soldering to avoid popcorning.

9.3 Can the LED be driven with PWM?

Yes, but ensure the peak current does not exceed 60 mA (pulse width 0.1ms, duty cycle 1/10). For general PWM, derating may be needed based on average current.

9.4 Why is the forward voltage binned?

Binning allows tight control of VF for consistent brightness in series-parallel arrays. Using the same VF bin ensures uniform current sharing.

10. Practical Design Case Study

Consider an indicator light for a white goods appliance. The customer requires a green-yellow LED with a dominant wavelength around 570 nm and luminous intensity of 20-30 mcd. By selecting bin C00 for intensity and B20 for wavelength, the design achieves consistent color and brightness. A 120Ω series resistor with a 5V supply limits current to approximately 20 mA (assuming VF ~2.0V). The PCB layout includes thermal vias under the LED pads to keep junction temperature below 85°C even in a sealed enclosure. The assembly follows the recommended reflow profile and passes reliability tests for 1000 hours at 25°C.

11. Working Principle of the LED

This green-yellow LED is based on an InGaN (indium gallium nitride) or GaP (gallium phosphide) semiconductor chip. When forward biased, electrons and holes recombine in the active region, emitting photons with energy corresponding to the bandgap. The specific chip composition yields a peak wavelength near 570 nm, perceived as green-yellow. The silicone encapsulant protects the chip and acts as a lens to increase light extraction and define the radiation pattern.

12. Technology Trends and Future Outlook

The market trend for miniature SMD LEDs continues toward smaller footprints (e.g., 1.0x0.5mm), higher efficacy, and broader color gamut. This 1.6x0.8mm package remains popular due to its balance of size and ease of handling. Future developments may include improved thermal management (lower RTHJ-S) and higher ESD robustness. For green-yellow LEDs, phosphor-converted designs are emerging to achieve more saturated colors, but direct emission chips like this one offer better efficiency and simplicity.

13. Reliability Test Summary

The LED has been qualified through standard reliability tests per JEDEC: Reflow (260°C, 2 times), Temperature Cycle (-40°C to 100°C, 100 cycles), Thermal Shock (-40°C to 100°C, 300 cycles), High Temperature Storage (100°C, 1000h), Low Temperature Storage (-40°C, 1000h), and Life Test (25°C, 20 mA, 1000h). Judging criteria allow VF increase up to 1.1x USL, IR up to 2x USL, and luminous flux drop not below 0.7x LSL.