LED RED 3.5x2.8x1.85mm 2.3V 70mA 196mW 621nm PLCC4 Automotive Grade - AEC-Q101 Qualified

1. Product Overview

1.1 General Description

This red LED is based on AlGaInP technology in a PLCC4 package with dimensions of 3.50mm x 2.80mm x 1.85mm. It is designed for automotive interior and exterior lighting and meets the AEC-Q101 stress test qualification guidelines for automotive grade discrete semiconductors.

1.2 Features

• PLCC4 package
• Extremely wide viewing angle: 120 degrees
• Suitable for all SMT assembly and solder processes
• Available on tape and reel (2000pcs/reel)
• Moisture sensitivity level: Level 2
• Compliance with RoHS and REACH
• Automotive grade qualification based on AEC-Q101

1.3 Applications

Automotive lighting: interior ambient lighting, exterior tail lights, brake lights, turn signals, and side markers.

2. Package Dimensions and Mechanical Information

2.1 Package Outline

The LED package measures 3.50 mm in length, 2.80 mm in width, and 1.85 mm in height. The top view shows a polarity mark indicating the cathode side. The bottom view has four solder pads arranged as per the drawing. All dimensions are in millimeters with tolerances of ±0.2 mm unless noted.

2.2 Soldering Patterns

The recommended solder pad layout is provided in the datasheet (Fig. 1-5). The overall footprint is 4.60 mm x 2.60 mm. Individual pad dimensions are 0.80 mm x 0.70 mm. Proper alignment and pad design ensure good solder joint reliability and thermal conduction.

3. Technical Parameters

3.1 Electrical / Optical Characteristics at 25°C

3.2 Absolute Maximum Ratings

• Power Dissipation: 196 mW
• Forward Current: 70 mA (100 mA peak, 1/10 duty, 10ms)
• Reverse Voltage: 5 V
• ESD (HBM): 2000 V
• Operating Temperature: -40 to +100 °C
• Storage Temperature: -40 to +100 °C
• Junction Temperature: 120 °C

4. Bin Range System

4.1 Forward Voltage Bins

At IF=50mA, forward voltage is sorted into bins: C1 (2.0-2.1V), C2 (2.1-2.2V), D1 (2.2-2.3V), D2 (2.3-2.4V), E1 (2.4-2.5V), E2 (2.5-2.6V).

4.2 Luminous Intensity Bins

Luminous intensity bins: N1 (1800-2300 mcd), N2 (2300-2800 mcd), O1 (2800-3500 mcd).

4.3 Dominant Wavelength Bins

Wavelength bins: D2 (617.5-620 nm), E1 (620-622.5 nm), E2 (622.5-625 nm).

5. Typical Optical Characteristics Curves

The datasheet provides several characteristic curves at 25°C. Fig. 1-7 shows forward voltage versus forward current: the current rises exponentially after threshold near 2.0V. Fig. 1-8 shows relative intensity versus forward current: intensity increases with current up to 70mA. Fig. 1-9 shows solder temperature versus relative intensity: at 100°C the intensity drops to about 80%. Fig. 1-10 shows solder temperature versus forward current derating: maximum current reduces from 70mA at 25°C to about 40mA at 100°C. Fig. 1-11 shows forward voltage decreasing with temperature (~ -2mV/°C). Fig. 1-12 is the radiation pattern with 120° viewing angle. Fig. 1-13 shows dominant wavelength slightly increasing with current (about 2nm shift). Fig. 1-14 shows the spectrum centered at 621 nm.

6. Packaging Information

6.1 Carrier Tape and Reel Dimensions

The LEDs are packaged in a carrier tape with dimensions as per Fig. 2-1. The reel has a diameter of 330 mm, hub diameter 100 mm, and width 8.0 mm. Quantity per reel is 2000 pieces.

6.2 Label Specifications

Each reel has a label stating part number, spec number, lot number, bin code (flux, chromaticity, forward voltage, wavelength), quantity, and date code.

6.3 Moisture Resistant Packing

The reel is sealed in a moisture barrier bag with desiccant and a humidity indicator card. The moisture sensitivity level is 2, as per JEDEC standards.

6.4 Reliability Test Conditions

Reliability tests per JEDEC standards include: MSL2 preconditioning (85°C/60%RH for 168h), thermal shock (-40°C to 125°C, 1000 cycles), life test (100°C, 50mA, 1000h), and high temperature high humidity (85°C/85%RH, 50mA, 1000h). Acceptance criteria: 0/1.

6.5 Failure Criteria

During reliability, failure is defined as: forward voltage > 1.1× upper spec limit, reverse current > 2× upper spec limit, luminous flux < 0.7× lower spec limit.

7. SMT Reflow Soldering Instructions

7.1 Reflow Profile

The typical lead-free reflow profile: preheat from 150°C to 200°C for 60-120s, ramp-up to 217°C at max 3°C/s, time above 217°C max 60s, peak temperature 260°C for max 10s. Cooling ramp-down max 6°C/s. Total time from 25°C to peak max 8 minutes. Only two reflow cycles allowed. If the interval between cycles exceeds 24 hours, baking is required.

7.2 Soldering Iron and Repairing

Manual soldering: temperature <300°C, time <3 seconds, one time only. Repairing should be avoided; if necessary, use a double-head soldering iron to prevent damage.

7.3 Cautions

Do not exert pressure on the silicone lens during soldering. Avoid mounting on warped PCBs. Do not apply mechanical stress or rapid cooling after reflow.

8. Handling Precautions

8.1 Environmental Considerations

The operating environment and mating materials must have sulfur content below 100 ppm. Bromine single content below 900 ppm, chlorine below 900 ppm, total halogen below 1500 ppm. VOCs from fixtures can discolour the silicone; use only tested compatible materials.

8.2 Thermal Design

Proper thermal management is critical. Heat reduces luminous efficiency and shifts colour. The junction temperature must not exceed 120°C. Use adequate PCB copper area or heat sinks.

8.3 Cleaning

Isopropyl alcohol is recommended for cleaning. Ultrasonic cleaning is not advised. Ensure solvents do not attack the silicone package.

8.4 Storage Conditions

Before opening: store at <30°C, <75% RH for up to one year. After opening: <30°C, <60% RH, use within 24 hours. If exceeded, bake at 60±5°C for >24 hours.

8.5 ESD Protection

The LED is ESD sensitive (2000V HBM). Use proper ESD precautions: grounding wrist straps, ionizers, and conductive workstations.

9. Application Design Considerations

9.1 Circuit Design

Each LED should be driven with a current-limiting resistor to keep the current below 70 mA. The forward voltage varies with temperature and bin; account for worst-case VF. Avoid reverse voltage.

9.2 Thermal Management

Design the PCB to dissipate heat from the LED solder points. Thermal vias and copper planes help. Follow the derating curve (Fig. 1-10) to determine maximum current at the actual operating temperature.

9.3 Compatibility with Materials

Use no-clean flux and avoid silicone-attacking chemicals. Ensure the fixture materials do not contain high sulfur or halogens.

10. Principle of Operation

AlGaInP (Aluminum Gallium Indium Phosphide) is a direct bandgap semiconductor material used for high-efficiency red LEDs. When forward biased, electrons and holes recombine in the active region, emitting photons with energy corresponding to the bandgap. The dominant wavelength of 621 nm corresponds to a deep red color. The PLCC4 package houses the LED chip and provides electrical connections and mechanical protection.

11. Technology Comparison

Compared to GaAsP or GaP red LEDs, AlGaInP LEDs offer higher luminous efficacy (up to 100 lm/W or more), better temperature stability, and longer lifetime. The AEC-Q101 qualification ensures reliability under harsh automotive conditions, making it superior to commercial-grade LEDs.

12. Common Technical Questions

Q: What is the typical forward voltage?

A: 2.3 V at 50 mA, but binning allows 2.0-2.6 V.

Q: Can I drive at 70 mA continuously?

A: Yes, with adequate heat sinking; ensure junction temperature <120°C.

Q: What is the tolerance on dominant wavelength?

A: ±2.25 nm (from min 617.5 to max 625).

Q: How many reflows?

A: Maximum two.

13. Practical Application Case

Consider an automotive tail light using 20 of these LEDs in two parallel strings of 10 series-connected LEDs each. Each string is driven at 50 mA with a series resistor. An aluminum-core PCB with thermal vias ensures effective heat dissipation. The wide viewing angle provides uniform illumination. The LEDs are sealed with conformal coating to protect against moisture. This design meets automotive requirements for brightness and reliability.

14. Development Trends

The automotive LED industry is moving toward higher efficiency, smaller packages, and higher operating temperatures. Chip-scale packaging and flip-chip technology are emerging. Driving currents may increase with improved thermal management. The PLCC4 package remains popular for its robustness and ease of assembly. Compliance with automotive standards like AEC-Q101 is becoming mandatory.