Red LED PLCC4 3.5x2.8x1.85mm - 2.0-2.6V Forward Voltage - 70mA - 615nm Dominant Wavelength Technical Specification

1. Product Overview

This document provides a comprehensive technical specification for a high-performance red LED (model RF-OMRA30TS-BM-G) designed for automotive interior and exterior lighting applications. The LED features a compact PLCC4 package measuring 3.50 mm × 2.80 mm × 1.85 mm and is built on advanced AlGaInP (Aluminum Gallium Indium Phosphide) substrate technology. It delivers superior brightness, wide viewing angle, and excellent thermal performance, making it suitable for demanding automotive environments. The device complies with RoHS and REACH directives and meets the qualification requirements of AEC-Q101 for automotive-grade discrete semiconductors.

2. Technical Parameter Deep Analysis

The electrical and optical characteristics are specified at a test condition of IF = 50 mA and solder temperature Ts = 25 °C. All measurements are performed under standardized laboratory conditions with defined tolerances as noted.

2.1 Forward Voltage (VF)

The forward voltage ranges from 2.0 V (minimum) to 2.6 V (maximum) with a typical value of 2.2 V at 50 mA. This relatively low forward voltage enables efficient power conversion and reduces thermal dissipation. The measurement tolerance is ±0.1 V. When designing circuits, series resistors should be included to stabilize current against voltage variations.

2.2 Luminous Intensity (IV)

The luminous intensity spans from 2300 mcd (minimum) to 4300 mcd (maximum) with a typical value of 2900 mcd at 50 mA. This high brightness level is achieved through the AlGaInP material system and optimized phosphor-free red emission. The measurement tolerance is ±10 %. The intensity is binned into three groups: N2 (2300–2800 mcd), O1 (2800–3500 mcd), and O2 (3500–4300 mcd).

2.3 Dominant Wavelength (Wd)

The dominant wavelength ranges from 612.5 nm (minimum) to 620 nm (maximum) with a typical value of 615 nm at 50 mA. This corresponds to a deep red color. The wavelength is binned into three groups: C2 (612.5–615 nm), D1 (615–617.5 nm), and D2 (617.5–620 nm). The measurement tolerance is ±0.005 in color coordinates.

2.4 Thermal Characteristics

The thermal resistance from junction to solder point (RTHJ-S) is typically 180 °C/W (maximum). The maximum junction temperature is 120 °C. Proper thermal management is essential to maintain reliability; the forward current should be derated based on solder temperature to prevent exceeding the maximum junction temperature. The ambient operating temperature range is –40 °C to +100 °C, and the storage temperature range is the same. Electrostatic discharge protection is provided up to 2000 V (HBM).

3. Binning System Description

To ensure consistency in performance, the LED is sorted into bins based on forward voltage, luminous intensity, and dominant wavelength at IF = 50 mA.

• Forward Voltage Bins: C1 (2.0–2.1 V), C2 (2.1–2.2 V), D1 (2.2–2.3 V), D2 (2.3–2.4 V), E1 (2.4–2.5 V), E2 (2.5–2.6 V)
• Luminous Intensity Bins: N2 (2300–2800 mcd), O1 (2800–3500 mcd), O2 (3500–4300 mcd)
• Wavelength Bins: C2 (612.5–615 nm), D1 (615–617.5 nm), D2 (617.5–620 nm)

Customers can specify bin combinations during ordering to meet precise application requirements.

4. Performance Curve Analysis

The typical optical characteristic curves provide insight into the behavior of the LED under various operating conditions.

• Forward Voltage vs. Forward Current (Fig. 1-7): The forward voltage increases moderately with current, from about 1.9 V at 10 mA to 2.4 V at 70 mA. This non-linear relationship is typical of semiconductor diodes.
• Forward Current vs. Relative Intensity (Fig. 1-8): The relative luminous intensity increases approximately linearly with forward current up to 70 mA, indicating good current-to-light conversion efficiency.
• Solder Temperature vs. Relative Intensity (Fig. 1-9): As the solder temperature rises from 20 °C to 120 °C, the relative luminous flux decreases by about 30 %, highlighting the need for thermal management.
• Solder Temperature vs. Forward Current (Fig. 1-10): The maximum allowable forward current must be derated at higher solder temperatures to avoid exceeding 120 °C junction temperature.
• Forward Voltage vs. Solder Temperature (Fig. 1-11): Forward voltage decreases slightly with increasing temperature, approximately –2 mV/°C.
• Radiation Pattern (Fig. 1-12): The viewing angle (2θ1/2) is 120 degrees, providing a wide, uniform light distribution suitable for area lighting.
• Forward Current vs. Dominant Wavelength (Fig. 1-13): The dominant wavelength shifts slightly to longer values as current increases, approximately +0.03 nm per mA.
• Spectrum Distribution (Fig. 1-14): The spectral peak is centered around 615–620 nm with a narrow full-width at half-maximum (FWHM), characteristic of AlGaInP red LEDs.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED is housed in a PLCC4 package with overall dimensions of 3.50 mm (length) × 2.80 mm (width) × 1.85 mm (height). The top view shows a clear polarity mark. The bottom view reveals four terminals: pin 1 (cathode) identified by a chamfered corner, and pins 2, 3, and 4 (anode and other connections). All dimensions have a tolerance of ±0.2 mm unless otherwise specified.

5.2 Soldering Pad Pattern

The recommended PCB landing pattern (soldering pads) dimensions are provided: 2.60 mm × 1.60 mm for the anode side and 4.60 mm × 0.80 mm for the cathode side. Proper pad design ensures reliable solder joint formation and heat dissipation.

5.3 Polarity Identification

The polarity is indicated by a notch or chamfer on the package body. Pin 1 is the cathode (C) and pins 2, 3, 4 are the anode (A). Incorrect polarity can damage the LED; always verify the orientation before soldering.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow soldering profile follows JEDEC standards. Key parameters include: preheat from 150 °C to 200 °C for 60–120 seconds, ramp-up to 217 °C (liquidus) within 60 seconds maximum, peak temperature 260 °C for 10 seconds maximum, and cool-down at 6 °C/s maximum. Only two reflow cycles are allowed. If more than 24 hours elapse between cycles, the LEDs may absorb moisture and require baking prior to the second reflow.

6.2 Hand Soldering and Repair

For manual soldering, use a soldering iron set below 300 °C and complete the process within 3 seconds. Only one hand soldering operation is permitted. Repair after reflow is not recommended; if necessary, use a double-head soldering iron and verify LED functionality.

6.3 Handling Cautions

The silicone encapsulant is soft and can be damaged by excessive pressure. Use appropriate pick-and-place nozzles with controlled force. Avoid bending the PCB after soldering. Do not apply mechanical stress or vibration during cooling. Rapid cooling (quenching) after reflow is prohibited.

7. Packaging and Ordering Information

7.1 Carrier Tape and Reel

The LEDs are supplied on 8 mm wide carrier tape with 4 mm pitch. Each reel contains 2,000 units. The tape has a cover tape peeled from the top. Reel dimensions: diameter 330 ±1 mm, hub diameter 100 ±1 mm, and width 13.0 ±0.5 mm.

7.2 Moisture Barrier Packaging

The reels are vacuum-sealed in a moisture barrier bag (MBB) with a humidity indicator card and desiccant. The moisture sensitivity level (MSL) is Level 2 (floor life >1 year at ≤30 °C/≤75% RH, but recommended use within 24 hours after opening). If the bag is damaged or storage conditions are exceeded, baking at 60 ±5 °C for >24 hours is required before use.

7.3 Label Information

Each reel carries a label with part number, specification number, lot number, bin code (including forward voltage, luminous intensity, and wavelength bins), quantity, and date code. The label format follows standard industry practice.

8. Application Suggestions

The LED is primarily intended for automotive lighting—both interior (dashboard, ambient lighting) and exterior (tail lamps, turn signals, brake lights). The wide 120° viewing angle is advantageous for signaling applications where uniform light distribution is required. When designing arrays, ensure adequate thermal management by using metal-core PCBs or heat sinks. String configurations should include current-limiting resistors to prevent thermal runaway. The device is also suitable for general-purpose indicator lamps and decorative lighting where high brightness and reliability are needed.

9. Technical Comparison

Compared to conventional through-hole red LEDs, this PLCC4 package offers significant advantages: smaller footprint, compatibility with automated SMT assembly, wider viewing angle, and a more consistent light pattern. The AlGaInP material provides higher luminous efficiency and better temperature stability than older GaAsP technologies. Additionally, the AEC-Q101 qualification ensures robust performance under harsh automotive conditions (vibration, moisture, temperature cycling).

10. Frequently Asked Questions

Q: What is the recommended driving current for maximum lifetime?

A: For optimal reliability, operate at 50 mA typical. The absolute maximum forward current is 70 mA (DC) or 100 mA peak (1/10 duty cycle, 10 ms pulse). Higher currents reduce lifespan due to increased junction temperature.

Q: Can I use this LED in series with others?

A: Yes, but ensure that the total forward voltage does not exceed the supply voltage. Use a series resistor to limit current. Because of forward voltage binning, parallel strings may require individual resistors to balance current.

Q: How should I clean the LED after soldering?

A: Use isopropyl alcohol. Avoid ultrasonic cleaning, which can damage internal wire bonds. Do not use solvents that may attack the silicone encapsulant.

Q: What ESD precautions are necessary?

A: The LED can withstand 2000 V HBM, but ESD protection during handling is still required. Use grounded workstations, ionizers, and anti-static packaging.

11. Practical Application Cases

Automotive Tail Light: An array of 10–20 LEDs placed on a PCB with a heat sink provides a bright, uniform red stop/tail light. The wide viewing angle ensures compliance with ECE R7 visibility requirements. The AEC-Q101 qualification gives automakers confidence in long-term reliability.

Interior Ambient Lighting: A single LED diffused through a light guide creates a soft red glow for dashboard accent lighting. The compact package allows integration into thin panels.

Industrial Status Indicator: The high brightness makes it suitable for outdoor signage and status lights. The 120° beam angle eliminates the need for secondary optics in many applications.

12. Working Principle

This red LED is based on the AlGaInP (Aluminum Gallium Indium Phosphide) multi-quantum well (MQW) structure. When a forward bias is applied, electrons from the n-type layer and holes from the p-type layer recombine in the active region, releasing energy in the form of photons. The bandgap of the AlGaInP material is engineered to produce light in the red spectrum (612–620 nm). The device is grown on a GaAs substrate, which is later removed or thinned to improve light extraction. The PLCC4 package includes a reflector cup and a clear silicone encapsulant that shapes the radiation pattern.

13. Technology Trends

The automotive LED market is moving toward higher efficiency, smaller packages, and better thermal performance. AlGaInP red LEDs continue to improve in luminous efficacy and reliability. The trend toward matrix lighting and adaptive driving beams increases demand for individually addressable LEDs. The integration of LEDs with smart drivers and diagnostics (e.g., LIN bus) is also growing. This product, with its AEC-Q101 qualification, aligns with the industry‘s push for zero-defect quality in automotive electronics. Future developments may include even narrower spectral widths for color purity and higher temperature ratings for under-hood applications.