LED Orange 1.0x0.5x0.4mm Voltage 1.7-2.4V Power 48mW Technical Datasheet Overview

1. Product Overview

This orange LED is fabricated using an orange chip and is housed in an extremely compact package measuring 1.0mm x 0.5mm x 0.4mm. It is designed for general purpose indicator and display applications where space is at a premium. The LED offers an extremely wide viewing angle of 140 degrees, making it suitable for applications where uniform light distribution is required. It is compatible with all SMT assembly and soldering processes and has a moisture sensitivity level of 3 (MSL 3). The component is RoHS compliant, meeting current environmental standards.

1.1 Features

• Extremely wide viewing angle (140°).
• Suitable for all SMT assembly and solder processes.
• Moisture sensitivity level: Level 3.
• RoHS compliant.

1.2 Applications

• Optical indicators.
• Switch and symbol displays.
• General use in consumer electronics, automotive interior, and industrial controls.

2. Technical Parameter Analysis

2.1 Optical and Electrical Characteristics

The electrical and optical characteristics are specified at a test condition of Ts = 25°C and a forward current of 5 mA (unless otherwise noted). The forward voltage (VF) is binned across several ranges from a minimum of 1.7 V to a maximum of 2.4 V. The dominant wavelength (λD) spans from 615 nm to 630 nm, covering the orange spectrum. Luminous intensity (IV) ranges from 8 mcd to 100 mcd depending on the bin. The spectral half bandwidth is typically 15 nm, indicating a relatively pure color output. The reverse current (IR) at VR = 5V is limited to a maximum of 10 µA. Thermal resistance from junction to solder point (RTHJ-S) is 450 °C/W at IF = 5 mA.

2.2 Absolute Maximum Ratings

The absolute maximum ratings must not be exceeded during operation to prevent damage. Power dissipation (Pd) is 48 mW. Continuous forward current (IF) is 20 mA, while peak forward current (IFP) can reach 60 mA at a 1/10 duty cycle and 0.1 ms pulse width. Electrostatic discharge withstand voltage (HBM) is 2000 V. Operating temperature range (Topr) is -40°C to +85°C, and storage temperature range (Tstg) is identical. Junction temperature (Tj) must not exceed 95°C.

3. Bin Classification System

3.1 Forward Voltage Bins

The forward voltage is categorized into seven bins (A2, B1, B2, C1, C2, D1, D2) with ranges from 1.7-1.8 V up to 2.3-2.4 V. This allows designers to select LEDs with similar VF for uniform brightness in series or parallel configurations.

3.2 Dominant Wavelength Bins

The dominant wavelength is divided into six bins: D10 (615-617.5 nm), D20 (617.5-620 nm), E10 (620-622.5 nm), E20 (622.5-625 nm), F10 (625-627.5 nm), and F20 (627.5-630 nm). This fine binning ensures color consistency across production lots.

3.3 Luminous Intensity Bins

Luminous intensity is sorted into six bins: A00 (8-12 mcd), B00 (12-18 mcd), C00 (18-28 mcd), D00 (28-43 mcd), E00 (43-65 mcd), and F00 (65-100 mcd). The ±10% tolerance on intensity measurements must be accounted for in system design.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

Figure 1-6 shows the typical forward voltage vs. forward current curve. At 5 mA the forward voltage is approximately 2.0 V (typical). At 20 mA the forward voltage rises to about 2.8 V. The relationship is exponential, typical for GaP and GaAsP LEDs.

4.2 Relative Intensity vs. Forward Current

Figure 1-7 indicates that relative intensity increases nearly linearly with forward current up to about 7.5 mA, then begins to saturate.

4.3 Temperature Effects

Figure 1-8 shows that relative intensity decreases with increasing ambient temperature. At 100°C the intensity is about 70% of the value at 25°C. Figure 1-9 illustrates the maximum forward current derating at high pin temperatures. At a pin temperature of 100°C, the maximum forward current is reduced to approximately 15 mA.

4.4 Dominant Wavelength vs. Forward Current

Figure 1-10 shows a slight red shift (increase in wavelength) as forward current increases, from about 620 nm at 0.1 mA to 623 nm at 15 mA. This effect must be considered in color-critical applications.

4.5 Spectral Distribution

Figure 1-11 presents the relative intensity vs. wavelength at Ta=25°C. The peak wavelength is near 620 nm with a full width at half maximum (FWHM) of about 15 nm. The spectrum is clean with no secondary peaks.

4.6 Radiation Pattern

Figure 1-12 shows the radiation pattern. The LED emits light nearly uniformly across angles up to ±70°, with relative intensity dropping to 0.5 at approximately ±80°. The wide pattern makes it ideal for indicator and backlighting applications where a broad beam is desired.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The package dimensions are 1.0 mm x 0.5 mm x 0.4 mm (length x width x height). Figure 1-1 (top view) and Figure 1-3 (side view) detail the exact outlines. All dimensions have a tolerance of ±0.2 mm unless otherwise noted.

5.2 Soldering Patterns

Figure 1-5 provides recommended soldering patterns. The anode pad (pad 1) and cathode pad (pad 2) are designed for mechanical stability and thermal dissipation. The bottom view (Figure 1-2) and polarity marking (Figure 1-4) indicate which pad is which.

5.3 Polarity Identification

The LED has a polarity mark on the top view (a corner chamfer or dot) to indicate the cathode (pad 2). Correct orientation is essential for operation.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Profile

Figure 3-1 provides the recommended reflow soldering temperature profile. Key parameters: preheat from 150°C to 200°C for 60-120 seconds; temperature ramp-up ≤3°C/s; time above 217°C (TL) 60-120 seconds; peak temperature (TP) 260°C with a maximum duration of 10 seconds; cooling rate ≤6°C/s. The total time from 25°C to peak should not exceed 8 minutes. Reflow soldering should not be performed more than twice. If more than 24 hours elapse between two soldering operations, the LED may be damaged.

6.2 Hand Soldering

When hand soldering, keep the iron temperature below 300°C and soldering time under 3 seconds. Hand soldering should be done only once.

6.3 Repairing

Repairing should be avoided after soldering. If necessary, use a double-head soldering iron. Confirm in advance that the LED characteristics will not be damaged.

6.4 Cautions

Do not mount components on warped PCB portions. After soldering, avoid mechanical stress or vibration during cooling. Do not rapidly cool the device.

6.5 Storage Conditions

7. Packaging and Ordering Information

7.1 Packaging Specifications

Each reel contains 4000 pieces. The carrier tape dimensions are shown in Figure 2-1 (pitch 2.00 mm, width 8.00 mm, depth 0.61 mm). The reel dimensions (Figure 2-2) include an outer diameter of 178 mm ±1 mm and a hub diameter of 60 mm ±0.1 mm. The label (Figure 2-3) includes Part Number, Spec Number, Lot Number, Bin Code, Luminous flux, Chromaticity Bin, Forward Voltage, Wavelength, Quantity, and Manufacture Date.

7.2 Moisture Resistant Packing

The LEDs are shipped in moisture barrier bags with desiccant and a humidity indicator card (Figure 2-4). The bag is marked with ESD precautions.

7.3 Cardboard Box

Reels are packed in cardboard boxes for shipping (Figure 2-5).

8. Application Recommendations

Typical applications include optical indicators in consumer electronic devices (e.g., smartphone status, appliance controls), automotive interior lighting (button backlighting, telltales), and industrial control panels. Due to the wide viewing angle, these LEDs are also suitable for edge-lit or direct backlighting of small displays. Designers must ensure adequate heat dissipation, especially when operating at high currents or in elevated ambient temperatures. The maximum junction temperature of 95°C should not be exceeded. Current limiting resistors are mandatory, as the forward voltage varies with temperature and current.

9. Technology Comparison

Compared to standard indicator LEDs, this component offers a significantly smaller footprint (1.0x0.5mm vs typical 3.2x1.6mm) and a wider viewing angle (140° vs typical 120°). The low power dissipation (48 mW max) makes it suitable for battery-powered devices. The fine binning in wavelength and intensity ensures tighter color and brightness matching in multi-LED arrays, which is an advantage over generic LEDs that have wider tolerances.

10. Frequently Asked Questions

1. What is the storage life before opening? The LED can be stored in the unopened moisture barrier bag for up to one year at ≤30°C and ≤75% RH.
2. What happens if the desiccant has faded? If the moisture absorbent material has faded or the storage time has been exceeded, baking at 60±5°C for 24 hours is required before use.
3. How to protect against ESD? Use grounded workstations, wrist straps, and conductive containers. The LED is rated for 2 kV HBM, but precautions are recommended for sensitive handling.
4. Can this LED be used in high-sulfur environments? The sulfur content in the environment should be ≤100 PPM. Additionally, the halogen content (bromine and chlorine) in mating materials must be controlled to prevent corrosion.

11. Practical Application Example

In a portable medical device requiring a small orange indicator for alarm notification, using this 1.0x0.5mm LED allowed the PCB to be miniaturized. With a forward current of 5 mA, the luminous intensity of 28 mcd (bin D00) was sufficient for visibility in daylight conditions. The wide viewing angle ensured the alarm was visible from various angles. The low operating current helped extend battery life.

12. Principle of Operation

This LED is based on a direct bandgap semiconductor (likely AlGaInP or GaAsP material system). When a forward bias is applied across the p-n junction, electrons from the n-side recombine with holes in the p-side, releasing energy in the form of photons. The energy bandgap determines the dominant wavelength. The orange emission results from a specific alloy composition. The quantum efficiency and output power are influenced by the junction temperature, current density, and material quality.

13. Development Trends

The trend in indicator LEDs is toward smaller packages (down to 0.6x0.3mm) with higher brightness and lower power consumption. Future developments include integration of multiple chips in a single package, improved thermal management, and tighter binning for consistent color. The use of silicone encapsulants enhances reliability, although compatibility with external materials remains a concern. The industry continues to drive toward full compliance with environmental regulations (ROHS, REACH) and higher electrostatic discharge immunity.