RF-P28Q6-IRJ-FT Infrared LED 850nm Specification - Size 2.8x3.5x2.11mm - Voltage 1.6V - Power 80mW

1. Product Overview

1.1 General Description

This product is an infrared LED utilizing a PPA (Polyphthalamide) package. It offers high reliability and is widely used in security monitoring and sensor applications. The device has compact dimensions of 2.80 mm × 3.50 mm × 2.11 mm (length × width × height). The PPA package provides robust mechanical protection and excellent heat dissipation.

1.2 Features

• Low forward voltage, ensuring energy efficiency.
• Peak wavelength λp = 850 nm, suitable for near-infrared applications.
• Pb-free reflow soldering compatible, meeting environmental standards.
• Moisture sensitivity level: Level 5 (MSL 5), requiring careful handling.
• RoHS compliant, free from hazardous substances.

1.3 Applications

• Surveillance systems and security cameras.
• Infrared illumination for cameras and night vision equipment.
• Machine vision systems for industrial automation.

2. Package Dimensions and Soldering Patterns

The package outline is illustrated in the specification drawings. The top view shows a rectangular body of 2.80 mm × 3.50 mm. The side view indicates a thickness of 2.11 mm. A polarity mark is present on one corner to identify the cathode. The bottom view reveals the contact pads: two larger pads for anode and cathode, with dimensions provided for PCB layout. The recommended soldering pattern (footprint) is given in Figure 1-5, with pad dimensions of 1.85 mm × 1.25 mm and a pitch of 1.80 mm. All dimensions are in millimeters with a tolerance of ±0.2 mm unless otherwise specified.

3. Electrical and Optical Characteristics

3.1 Electrical/Optical Parameters at Ts=25°C

Table 1-1 lists the key electrical and optical characteristics measured at a solder point temperature of 25°C. The forward current (IF) is set at 50 mA for all measurements. The reverse current (IR) at VR=5V is typically very low (<10 µA). The forward voltage (VF) ranges from 1.4 V typical to 1.6 V maximum. The peak wavelength (λp) is 850 nm, with a spectral radiation bandwidth (Δλ) of 30 nm, indicating a relatively narrow emission spectrum centered in the near-infrared. The total radiant flux (Φe) is typically 28 mW, with a minimum of 14 mW. The viewing angle (2θ1/2) is 70 degrees, providing a moderately wide emission pattern. The thermal resistance from junction to solder point (RθJ-S) is 50 °C/W, which is important for thermal management.

3.2 Absolute Maximum Ratings

Table 1-2 provides the absolute maximum ratings that must not be exceeded to prevent damage. The power dissipation (PD) is limited to 80 mW. The forward current (IF) should not exceed 50 mA (note: at 1/10 duty cycle, 0.1 ms pulse width, the current can be higher, but DC operation is limited to 50 mA). The reverse voltage (VR) is 5 V. The electrostatic discharge (ESD) withstand voltage (HBM) is 2000 V. The operating temperature range is -40°C to +85°C, and storage temperature range is also -40°C to +85°C. The junction temperature (TJ) should not exceed 105°C. Proper heat sinking and current derating are required to stay within these limits.

4. Typical Optical Characteristics Curves

The specification includes several typical characteristic curves to aid in design.

4.1 Forward Voltage vs. Forward Current (Fig. 1-6)

This curve shows the relationship between forward voltage (VF) and forward current (IF). As IF increases from 0 to 60 mA, VF increases from approximately 1.3 V to 1.7 V. The curve is nonlinear, typical for LEDs.

4.2 Forward Current vs. Relative Intensity (Fig. 1-7)

Relative intensity increases nearly linearly with forward current up to 50 mA. At 50 mA, the relative intensity is about 100% (reference point). This indicates that higher current produces proportionally more radiant power, but thermal effects may limit at higher currents.

4.3 Temperature vs. Relative Intensity (Fig. 1-8)

As the solder point temperature (Ts) increases from 5°C to 125°C, the relative intensity decreases gradually. At 85°C, the relative intensity drops to about 80% of the value at 25°C. This thermal derating should be considered in high-temperature environments.

4.4 Spectrum Distribution (Fig. 1-9)

The spectral emission spans from about 800 nm to 900 nm, with a peak at 850 nm. The full width at half maximum (FWHM) is approximately 30 nm, confirming the narrow bandwidth.

4.5 Radiation Diagram (Fig. 1-10)

The radiation pattern shows the relative luminous intensity as a function of angle. The half-angle (50% intensity) is about 35 degrees from the optical axis, corresponding to a total viewing angle of 70 degrees.

4.6 Temperature vs. Forward Current Derating (Fig. 1-11)

This curve indicates the maximum allowable forward current as a function of solder point temperature. At 25°C, the maximum current is 50 mA. As temperature increases, the allowable current decreases linearly to zero at approximately 105°C (junction temperature limit). This derating is critical for reliable operation.

5. Packaging Information

5.1 Carrier Tape and Reel

The LEDs are packaged in carrier tape with a polarity mark for orientation. Each reel contains 3,500 pieces. The reel dimensions are: outer diameter A = 330.2 ± 2 mm, inner hub diameter B = 12.7 ± 0.3 mm, width C = 79.5 ± 1 mm, and spindle hole D = 14.3 ± 0.2 mm. The tape feed direction is indicated.

5.2 Label Form Specification

Labels on each reel include Part Number, Spec Number, Lot Number, Bin Code, Quantity, and Date. Additionally, the bin code indicates the total radiant flux (Φe), peak wavelength (WLP), and forward voltage (VF) for binning purposes.

5.3 Moisture Resistant Packing

The reels are placed in a moisture barrier bag with a desiccant, along with a humidity indicator card. The bag is then sealed and labeled. This packaging protects the LEDs from moisture absorption, given their MSL Level 5 rating.

5.4 Cardboard Box

Multiple reels are packed in a cardboard box for shipment. The box is labeled with product information and handling precautions.

6. Reliability Test Items and Criteria

6.1 Reliability Tests

The LEDs undergo several reliability tests per JEDEC standards: Reflow (260°C max, 3 cycles), Temperature Cycle (-40°C to 100°C, 100 cycles), Thermal Shock (-40°C to 100°C, 300 cycles), High Temperature Storage (100°C, 1000 hours), Low Temperature Storage (-40°C, 1000 hours), and Life Test (25°C, IF=50mA, 1000 hours). The acceptance criterion is 0 failures out of 10 samples (0/1).

6.2 Criteria for Judging Damage

After reliability tests, the following limits apply: forward voltage (VF) must not exceed the upper standard level (USL) multiplied by 1.1; reverse current (IR) must not exceed USL multiplied by 2.0; total radiant flux (Φe) must not be less than the lower standard level (LSL) multiplied by 0.7. These criteria ensure that the LEDs maintain acceptable performance after stress.

7. SMT Reflow Soldering Instructions

7.1 Reflow Profile

The recommended reflow soldering profile is shown in Figure 3-1. Key parameters: average ramp-up rate ≤ 3°C/s; preheating temperature range 160°C to 200°C with a duration of 60-120 seconds; time above 220°C (TL) is 60 seconds max; peak temperature (TP) is 260°C with a hold time within 5°C of peak for up to 5 seconds; cooling ramp-down ≤ 6°C/s. The total time from 25°C to peak should be within 8 minutes. Only two reflow cycles are allowed. If more than 24 hours pass after the first reflow, the LEDs may be damaged.

7.2 Hand Soldering and Repairing

If hand soldering is needed, use a soldering iron at less than 300°C for less than 3 seconds, and perform only once. Repairing should generally be avoided; if necessary, use a double-head soldering iron and confirm no damage.

7.3 Cautions

Do not mount components on warped PCB areas. Avoid mechanical stress or vibration during cooling. Do not rapidly cool the devices after soldering.

8. Handling Precautions and Storage Conditions

8.1 Environmental Considerations

The LED operating environment should have sulfur content below 100 PPM in mating materials. Bromine and chlorine content in external materials should each be less than 900 PPM, with total less than 1500 PPM. VOCs from fixture materials can penetrate the silicone encapsulant and cause discoloration; therefore, only compatible materials should be used.

8.2 Mechanical Handling

Components should be handled along the side surfaces using forceps. Do not touch the silicone lens directly, as this may damage the internal circuitry.

8.3 Circuit Design

Each LED's current must not exceed the absolute maximum rating. Use current-limiting resistors to prevent current surges. The driving circuit must allow forward voltage only when ON; reverse voltage can cause migration and damage. Thermal design is crucial—adequate heat sinking is required to keep junction temperature below 105°C.

8.4 Storage Conditions

Before opening the aluminum bag, store at ≤30°C and ≤75% RH for up to 1 year from the date of packaging. After opening, store at ≤30°C and ≤60% RH, and complete soldering within 48 hours. If the moisture indicator shows excessive humidity or the storage time is exceeded, bake the LEDs at 60±5°C for at least 24 hours before use.

8.5 ESD Protection

LEDs are sensitive to electrostatic discharge (ESD) and electrical overstress (EOS). Proper ESD precautions should be taken during handling and assembly. The ESD withstand voltage (HBM) is 2000 V, but protection is still recommended.