1. Product Overview
1.1 General Description
The RF-RUB190TS-BD is a high-brightness red surface-mount LED fabricated using a red chip. It comes in a compact package with dimensions of 1.6mm x 0.8mm x 0.7mm, making it suitable for space-constrained applications. This LED is designed for general use and offers excellent performance in optical indicator and display applications.
1.2 Features
- Extremely wide viewing angle of 140 degrees.
- Suitable for all SMT assembly and solder processes.
- Moisture sensitivity level: Level 3 (MSL3).
- RoHS compliant, ensuring environmental friendliness.
1.3 Applications
- Optical indicators in consumer electronics.
- Switch and symbol backlighting.
- General-purpose display and status indication.
2. Technical Parameters
2.1 Electrical and Optical Characteristics
At an ambient temperature of 25°C and a forward current of 20mA, the LED exhibits the following characteristics (typical values):
| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Spectral Half Bandwidth | Δλ | – | 15 | – | nm |
| Forward Voltage (Bin B0) | VF | 1.8 | – | 2.0 | V |
| Forward Voltage (Bin C0) | VF | 2.0 | – | 2.2 | V |
| Forward Voltage (Bin D0) | VF | 2.2 | – | 2.4 | V |
| Dominant Wavelength (Bin F00) | λD | 625 | – | 630 | nm |
| Dominant Wavelength (Bin G00) | λD | 630 | – | 635 | nm |
| Dominant Wavelength (Bin H00) | λD | 635 | – | 640 | nm |
| Luminous Intensity (Bin 1BP) | IV | 30 | – | 90 | mcd |
| Viewing Angle | 2θ1/2 | – | 140 | – | deg |
| Reverse Current | IR | – | – | 10 | μA |
| Thermal Resistance (Junction to Solder) | RTHJ-S | – | – | 450 | K/W |
2.2 Absolute Maximum Ratings
| Parameter | Symbol | Rating | Unit |
|---|---|---|---|
| Power Dissipation | Pd | 72 | mW |
| Forward Current | IF | 30 | mA |
| Peak Forward Current (Pulse) | IFP | 60 | mA |
| ESD (HBM) | ESD | 2000 | V |
| Operating Temperature | Topr | -40 to +85 | °C |
| Storage Temperature | Tstg | -40 to +85 | °C |
| Junction Temperature | Tj | 95 | °C |
Care must be taken not to exceed these absolute maximum ratings under any condition. The forward current should be limited by appropriate series resistors to avoid thermal runaway.
3. Binning System
3.1 Forward Voltage Bins
Three forward voltage bins are defined: B0 (1.8-2.0V), C0 (2.0-2.2V), and D0 (2.2-2.4V). Each bin ensures tight voltage distribution for consistent performance in arrays.
3.2 Wavelength Bins
Dominant wavelength is sorted into three bins: F00 (625-630nm), G00 (630-635nm), and H00 (635-640nm). This allows selecting the exact red hue required.
3.3 Luminous Intensity Bins
Luminous intensity is categorized under bin 1BP with a range of 30 to 90 mcd. The intensity binning ensures uniform brightness in multiple-LED applications.
4. Performance Curves Analysis
4.1 Forward Voltage vs. Forward Current
As shown in Fig.1-6, the forward voltage increases with forward current, a typical behavior for LEDs. At 20mA, the voltage typically falls within the bin ranges.
4.2 Relative Intensity vs. Forward Current
Figure 1-7 illustrates that relative intensity rises linearly with forward current up to about 20mA, then gradually saturates. Operating at 20mA provides a good balance between brightness and efficiency.
4.3 Temperature Dependencies
Figures 1-8 and 1-9 show that relative intensity decreases with increasing ambient temperature, and the maximum allowable forward current derates as pin temperature rises. Proper thermal management is essential for maintaining performance and reliability.
4.4 Wavelength Shift
Figure 1-10 indicates that the dominant wavelength remains stable with forward current, shifting only slightly within the bin range across 0-30mA. This ensures consistent color over typical operating conditions.
4.5 Spectral Distribution
The LED emits a narrow spectrum peaking around 625-640nm, as per Figure 1-11. The full width at half maximum is about 15nm, providing a pure red color.
4.6 Radiation Pattern
Figure 1-12 shows a wide radiation pattern with a viewing angle of 140°. The intensity drops to 50% at ±70°, making it suitable for indicator applications where visibility from multiple angles is desired.
5. Mechanical and Package Information
5.1 Package Dimensions
The LED package measures 1.6mm x 0.8mm x 0.7mm (length x width x height). The exact dimensions are shown in the package outline drawings (Fig.1-1 to 1-4). All dimensions are in millimeters with a tolerance of ±0.2mm unless otherwise specified.
5.2 Polarity and Soldering Patterns
Polarity is indicated by a mark on the package (Fig.1-4). The recommended soldering pattern (Fig.1-5) consists of two pads: 0.8mm x 0.8mm each, with a pitch of 2.4mm. Proper alignment ensures reliable solder joints.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
The LED is suitable for SMT reflow soldering with the profile shown in Fig.3-1. Key parameters: preheat from 150°C to 200°C for 60-120 seconds, ramp-up rate ≤3°C/s, time above 217°C (TL) 60-150 seconds, peak temperature 260°C for up to 10 seconds. Cooling rate ≤6°C/s. The total time from 25°C to peak should be no more than 8 minutes. Do not perform reflow more than twice.
6.2 Hand Soldering
If hand soldering is necessary, keep the iron temperature below 300°C and limit contact to less than 3 seconds. Only one hand soldering attempt is allowed.
6.3 Precautions
After soldering, avoid mechanical stress or rapid cooling. Do not mount components on warped PCBs. Use a double-head soldering iron if repair is unavoidable, but repair is generally not recommended.
7. Packaging and Ordering Information
7.1 Packaging Specifications
The LEDs are packaged in reels of 4000 pieces. Carrier tape dimensions are as per Fig.2-1: 8mm wide tape with a pitch of 4mm. The reel diameter is 178mm. A moisture barrier bag with desiccant is used for storage.
7.2 Label Information
Labels include part number, spec number, lot number, bin code, luminous flux, chromaticity bin, forward voltage, wavelength, quantity, and date. This allows full traceability.
7.3 Storage Conditions
Before opening the aluminum bag, store at ≤30°C and ≤75% RH for up to 1 year. After opening, storage at ≤30°C and ≤60% RH for 168 hours (7 days) is allowed. If the shelf life is exceeded, bake at 60±5°C for 24 hours before use.
8. Application Notes
8.1 Circuit Design
Each LED should have a current-limiting resistor to keep the forward current within the absolute maximum rating. The driving circuit must be designed so that only forward voltage is applied during operation; reverse voltage can cause damage.
8.2 Thermal Management
Effective heat dissipation is critical. The junction temperature must not exceed 95°C. Consider using thermal vias or a heatsink if operating at high ambient temperatures or high currents.
8.3 ESD Protection
These LEDs are ESD sensitive (HBM 2000V). Use proper ESD precautions during handling and assembly, such as grounded workstations and antistatic packaging.
8.4 Environmental Considerations
Avoid exposing the LEDs to sulfur-containing compounds exceeding 100PPM. For external materials, bromine and chlorine each should be <900PPM, and total <1500PPM. VOCs from adhesives can also cause discoloration; test all materials for compatibility.
9. Typical Application Example
Consider a status indicator panel using multiple RF-RUB190TS-BD LEDs. By selecting G00 wavelength bin (630-635nm) and matching forward voltage bins within C0, uniform brightness and color can be achieved. Each LED is driven at 20mA via a series resistor. The wide viewing angle ensures visibility across the panel. Proper thermal design using PCB copper pours prevents overheating.
10. Common Questions
10.1 What is the typical forward voltage at 20mA?
The typical forward voltage falls in the range of 1.8 to 2.4V depending on the bin (B0/C0/D0). For most applications, the voltage is around 2.0V.
10.2 Can I drive the LED at 30mA continuous?
Yes, the absolute maximum forward current is 30mA. However, operating near the maximum may reduce lifetime if thermal management is inadequate. It is recommended to stay at 20mA for optimal reliability.
10.3 How is the LED affected by temperature?
The light output decreases at higher temperatures. Derating of forward current is necessary above 25°C, as shown in Fig.1-9. Keep the junction temperature below 95°C.
11. Principle of Operation
This LED is based on a red chip that emits light through electroluminescence. When a forward bias is applied, electrons and holes recombine in the semiconductor material, releasing photons with energy corresponding to red wavelengths (625-640nm). The narrow spectral width indicates a high purity of the emitted color.
12. Trends and Developments
LED technology continues to evolve towards higher efficacy, smaller packages, and better color consistency. The RF-RUB190TS-BD represents a compact, high-brightness solution typical of current surface-mount LEDs. Future trends may include even smaller dimensions (e.g., 1.0x0.5mm) and higher reliability through improved materials.