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LED 1.0x1.0x0.25mm Tri-Color Orange/Green/Blue - Forward Voltage 1.6-3.0V - Power 44-60mW - English Technical Documentation

Complete technical specification of the RF-W11010TS-A42-P0 tri-color LED (Orange, Green, Blue) featuring 1.0x1.0x0.25mm package, forward voltage 1.6-3.0V, power dissipation 44-60mW, wide viewing angle of 140°, and RoHS compliance. Includes optical/electrical parameters, reliability tests, soldering guidelines, packaging details, and handling precautions.
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PDF Document Cover - LED 1.0x1.0x0.25mm Tri-Color Orange/Green/Blue - Forward Voltage 1.6-3.0V - Power 44-60mW - English Technical Documentation

1. Product Overview

The RF-W11010TS-A42-P0 is a compact tri-color surface-mount LED fabricated using blue, green, and orange chips. It is housed in an ultra-small package measuring 1.0 mm × 1.0 mm × 0.25 mm, making it ideal for space-constrained applications. This component offers an extremely wide viewing angle of 140°, ensuring uniform light distribution. It is suitable for all standard SMT assembly and solder processes. The LED meets RoHS requirements and has a moisture sensitivity level of 3 (MSL 3). Its primary applications include optical indicators, switches, symbols, displays, and general-purpose signaling.

2. Technical Parameter Interpretation

2.1 Optical and Electrical Characteristics

At an ambient temperature of 25°C and a test current of 2 mA, the LED exhibits the following electrical and optical parameters across its three color channels:

2.2 Absolute Maximum Ratings

The device must not exceed the following limits at 25°C:

3. Binning System Description

The LED is sorted into bins for dominant wavelength, luminous intensity, and forward voltage. Each reel label specifies the Part Number, Spec Number, Lot Number, Bin Code, and measured values for flux (or intensity), chromaticity bin, forward voltage, and wavelength code. This binning allows customers to select tightly controlled color and brightness groups for uniform lighting in multi-device applications. The tester voltage condition for binning is set at 5 V (not the operating 2 mA).

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

The voltage-current characteristic shows a typical diode curve: as forward current increases from 0 to 30 mA, forward voltage rises approximately logarithmically, with the orange channel saturating at a lower voltage than green and blue.

4.2 Forward Current vs. Relative Intensity

Relative luminous intensity increases linearly with forward current up to 20 mA, enabling straightforward dimming control via current regulation.

4.3 Temperature Dependence

Pin (ambient) temperature affects performance: relative intensity drops by about 10% from 25°C to 100°C. The maximum allowable forward current derates from 20 mA at low temperatures to approximately 10 mA at 100°C. Dominant wavelength shifts slightly with current—orange shifts from ~626 nm at 2 mA to ~623 nm at 30 mA, green from ~526 nm to ~521 nm, and blue from ~471 nm to ~467 nm—indicating a blue shift with increasing current.

4.4 Spectral Distribution

The relative spectral intensity peaks at approximately 625 nm (orange), 527 nm (green), and 470 nm (blue). The spectral half bandwidth is narrow (15 nm for orange, 30 nm for green and blue), ensuring good color purity.

4.5 Radiation Pattern

The radiation diagram shows a near-Lambertian emission pattern with a viewing angle of 140°, providing wide and uniform light dispersion suitable for indicator and backlight applications.

5. Mechanical and Packaging Information

5.1 Package Dimensions and Pinout

The package is 1.0 mm × 1.0 mm × 0.25 mm with four terminals visible from the bottom view. Pin 1 is Orange (cathode?), Pin 2 Green, Pin 3 Blue, and Pin 4 is common anode (or cathode) as per the polarity diagram. The recommended soldering pattern matches the bottom pad layout. All dimensions have a tolerance of ±0.1 mm unless otherwise noted.

5.2 Reel and Packaging

Each reel contains 4000 pieces in 8 mm wide carrier tape. Reel dimensions: A = 8.0±0.1 mm (width), B = 178±1 mm (diameter), C = 60±1 mm (hub diameter), D = 13.0±0.5 mm (center hole). The reel is placed in a moisture barrier bag with a desiccant and humidity indicator card, then packed in a cardboard box for shipping. Label information includes part number, spec number, lot number, bin code, quantity, and date.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

Recommended reflow soldering follows the JEDEC profile with a peak temperature of 260°C (max 10 s). Preheating ramp rate should not exceed 3°C/s. The preheat zone (Tsmin to Tsmax) is between 150°C and 200°C for 60–120 seconds. The time above 217°C (tL) should be 60–150 seconds. Cooling ramp rate ≤6°C/s. Total time from 25°C to peak must not exceed 8 minutes. Only two reflow cycles are allowed, and the interval between cycles should be less than 24 hours to avoid moisture absorption damage.

6.2 Hand Soldering and Rework

Hand soldering is permitted only once, with a soldering iron below 300°C for less than 3 seconds. Rework should use a double-head iron; mechanical force must be avoided. Do not apply pressure to the silicone lens surface.

6.3 Storage and Moisture Precautions

Unopened reels may be stored at ≤30°C and ≤75% RH for up to one year. After opening, the devices must be used within 24 hours at ≤30°C and ≤60% RH. If the moisture indicator indicates excessive moisture or the storage time is exceeded, baking at 60±5°C for >24 hours is required before use.

7. Application Recommendations

Typical applications include:

Design considerations: Use series current-limiting resistors to avoid exceeding maximum ratings. Thermal management is critical—ensure adequate heat sinking to keep junction temperature below 95°C. Avoid exposure to sulfur, chlorine, bromine compounds (>100 PPM sulfur, >900 PPM single halogen, total halogens <1500 PPM) as they can corrode internal materials. VOCs from adhesives and fixtures may penetrate the silicone encapsulant, causing discoloration and light loss; compatibility testing is recommended.

8. Technical Comparison and Differentiation

Compared to standard single-color 1.0×1.0 mm LEDs, this tri-color device integrates three independent channels in the same footprint, reducing board space and assembly cost. The wide 140° viewing angle offers superior coverage over many narrow-beam LEDs. The low thermal resistance (450°C/W) enables better heat dissipation than older packages. The combination of narrow spectral half bandwidth and fine binning ensures consistent color reproduction across batches.

9. Frequently Asked Questions

Q: Can I drive all three channels simultaneously at 20 mA?
Yes, but total power dissipation (44+60+60 = 164 mW) may exceed the package’s thermal capacity if insufficient heat sinking is provided. Derating may be necessary.

Q: How should I clean the LED after soldering?
Use isopropyl alcohol. Avoid ultrasonic cleaning, which may damage internal bonds. Ensure cleaning solvents do not dissolve the silicone encapsulant.

Q: What ESD precautions are required?
Use grounded workstations, wrist straps, and ionizers. The HBM rating of 1000 V means it can be damaged by typical human contact; proper handling is essential.

10. Practical Application Cases

Case 1 – RGB Status Indicator: In a network switch, three RF-W11010TS-A42-P0 LEDs are placed side by side. Each color indicates link speed (green=1 Gbps, orange=100 Mbps, blue=10 Mbps). The wide viewing angle ensures visibility from all ports.

Case 2 – Multicolor Backlight for Tactile Switch: The LED is mounted under a translucent switch cap. By driving the orange and blue channels with PWM, a custom purple hue is achieved, providing aesthetic differentiation.

11. Principles of LED Operation

Each color channel is a direct-bandgap semiconductor chip. When forward biased, electrons recombine with holes in the active region, emitting photons with energy corresponding to the bandgap. The orange chip uses an AlInGaP material system, while the green and blue chips use InGaN on sapphire. The silicone encapsulant protects the chips and provides a refractive index match to improve light extraction.

12. Industry Trends and Future Outlook

Miniaturization continues with packages shrinking below 1.0×0.5 mm. Multi-color integration in small footprints is becoming standard for IoT devices and wearables. Higher efficacy and better color rendering are expected through improved epitaxial structures and phosphor techniques. The trend toward automated optical inspection and tighter binning will further enhance production quality.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.