Table of Contents
- 1. Product Overview
- 2. Technical Parameter Interpretation
- 2.1 Electrical and Optical Characteristics (at Ts=25°C)
- 2.2 Absolute Maximum Ratings (at Ts=25°C)
- 3. Binning System
- 4. Performance Curve Analysis
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Carrier Tape and Reel Dimensions
- 5.3 Label Information
- 5.4 Moisture Resistant Packaging
- 5.5 Reliability Test Items
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Repairing and Cleaning
- 7. Packaging and Ordering Information
- 8. Application Recommendations
- 8.1 Typical Applications
- 8.2 Design Considerations
- 9. Handling Precautions
- 10. Frequently Asked Questions
- 11. Technology Principles and Trends
- 12. Typical Application Cases
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This document provides the complete technical specification for the RF-W1SA28IS-A47 full-color SMD LED. The device integrates red, green, and blue LED chips in a compact 2.8mm x 2.7mm x 2.45mm package with a matte surface finish for high contrast. It is designed for outdoor full-color video screens, decorative lighting, amusement applications, and general use. The LED features extremely wide viewing angle (110°), high luminous intensity, low power dissipation, good reliability, and long life. It is water-resistant to IPX6, RoHS compliant, and suitable for Pb-free reflow soldering. Moisture sensitivity level is 5a.
2. Technical Parameter Interpretation
2.1 Electrical and Optical Characteristics (at Ts=25°C)
The following table summarizes the key electrical and optical parameters measured at a forward current of 20mA (R, G, B) unless otherwise noted.
- Forward Voltage (VF): Red chip: min 1.7V, max 2.4V; Green and Blue chips: min 2.5V, max 3.3V. Tolerance ±0.1V.
- Dominant Wavelength (λD): Red: 617~628nm (bin step 5nm); Green: 520~545nm (bin step 3nm); Blue: 460~475nm (bin step 3nm). Tolerance ±1nm.
- Spectral Radiation Bandwidth (Δλ): Red: 24nm; Green: 38nm; Blue: 30nm.
- Luminous Intensity (IV): Minimum: Red 580mcd, Green 1130mcd, Blue 300mcd; Average: Red 870mcd, Green 1700mcd, Blue 460mcd; Maximum: Red 1300mcd, Green 2550mcd, Blue 690mcd. Tolerance ±10%. Intensity bin ratio is 1:1.3.
- Reverse Current (IR): Measured at VR=5V, typical value ≤6μA.
- Viewing Angle (2θ1/2): 110°.
2.2 Absolute Maximum Ratings (at Ts=25°C)
- Forward Current (IF): Red: 25mA; Green: 20mA; Blue: 20mA.
- Reverse Voltage (VR): 5V for all colors.
- Operating Temperature (TOPR): -30°C to +85°C.
- Storage Temperature (TSTG): -40°C to +100°C.
- Power Dissipation (PD): Red: 60mW; Green: 68mW; Blue: 68mW.
- Junction Temperature (TJ): 105°C for all colors.
- Electrostatic Discharge (ESD, HBM): 1000V.
3. Binning System
The LED is sorted by dominant wavelength, luminous intensity, and forward voltage. Wavelength bin steps are 5nm for red and 3nm for green and blue. Luminous intensity bins are grouped in a ratio of 1:1.3. Forward voltage bins are not explicitly listed but production tolerances are controlled. The bin code is printed on the label for traceability.
4. Performance Curve Analysis
The typical optical characteristics curves provide insight into the device performance under various conditions:
- Forward Voltage vs. Forward Current (Fig 1-6): Shows the typical forward current versus forward voltage for R, G, B. At 20mA, forward voltages are approximately 2.0V (R), 2.8V (G), 2.8V (B).
- Relative Intensity vs. Forward Current (Fig 1-7): Relative luminous intensity increases with forward current, but not linearly; at higher currents efficiency decreases.
- Luminous Intensity vs. Ambient Temperature (Fig 1-8): Intensity decreases with rising temperature. At 85°C, intensity can drop to about 50% of the value at 25°C for green and blue, while red is less affected.
- Maximum Forward Current vs. Solder Temperature (Fig 1-9): The maximum allowable forward current derates as ambient temperature increases, reaching zero at 100°C for all colors.
- Spectrum Distribution (Fig 1-10): Emission spectra show narrow peaks for each color with minimal overlap, ensuring good color purity.
- Radiation Patterns (Fig 1-11, 1-12): The LED has a symmetric wide viewing angle of 110° in both X-X and Y-Y directions, enabling uniform light distribution.
5. Mechanical and Packaging Information
5.1 Package Dimensions
The package size is 2.8mm (length) × 2.7mm (width) × 2.45mm (height). All dimensions have a tolerance of ±0.1mm unless otherwise noted. The device has a top view with a pin mark for orientation. The bottom view shows six pads: 1R+, 2R-, 3G+, 4G-, 5B+, 6B-. Polarity is indicated by the pin mark and pad shape. Recommended soldering patterns are provided in the specification. The device is filled with glue (glue filling) for environmental protection.
5.2 Carrier Tape and Reel Dimensions
LEDs are packaged in carrier tape with a pitch of 4.0mm. Reel outer diameter is 400mm ±2mm, inner diameter is 100.0mm ±0.4mm, width is 12.4mm ±0.3mm. Standard quantity is 10,000 pcs per reel.
5.3 Label Information
Each reel has a label containing Part Number, Lot Number (including packing machine number, serial number, bin code, and quantity in K), Luminous Intensity (IV) bin, Forward Voltage (VF) bin, Wavelength (Wd) bin, Forward Current (IF) condition, Quantity (QTY), and Date of manufacture.
5.4 Moisture Resistant Packaging
LEDs are packed in anti-static moisture-proof aluminum foil bags with desiccant and a humidity indicator card (CF-HIC). The bag is sealed. Storage conditions: temperature ≤30°C, humidity ≤60% RH. Suggested storage life is less than 6 months. If the package is opened, the LEDs must be soldered within 12 hours under ≤30°C/60%RH. Unused material must be stored in a dry environment (≤30°C/≤10%RH) and baked before next use according to the pre-treatment table (e.g., 65±5°C for 12-48 hours depending on storage duration and condition).
5.5 Reliability Test Items
The device undergoes reliability testing per JEDEC and JEITA standards, including: Resistance to Soldering Heat (260°C, 3 times), Thermal Shock (-40°C to 100°C, 500 cycles), Moisture Resistance (85°C/85%RH + reflow), High Temperature Storage (100°C, 1000h), Low Temperature Storage (-40°C, 1000h), Room Temperature Operating Life (25°C, IF=20mA, 1000h), High Temperature High Humidity Life (85°C/85%RH, IF=10mA, 500h), Temperature Humidity Storage (85°C/85%RH, 1000h), Low Temperature Life (-40°C, IF=20mA, 1000h). Acceptance criteria: VF change ≤10%, IR ≤10μA, luminous intensity degradation ≤30%, no physical damage.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
The recommended reflow soldering profile is based on SAC305 solder paste. Key parameters: ramp-up rate ≤4°C/s, preheat temperature 150-200°C for 60-120s, time above liquidus (217°C) ≤60s, peak temperature 245°C (max 10s at peak), cooling rate ≤6°C/s. Only one reflow is allowed. It is recommended to use nitrogen atmosphere to prevent oxidation. The LED is designed for reflow soldering only; hand soldering is allowed with iron temperature <300°C for <3 seconds, one time only.
6.2 Repairing and Cleaning
Repair of soldered LEDs is not recommended. If unavoidable, use a double-head soldering iron and confirm no damage. Cleaning should be done with alcohol; avoid water, benzene, thinner, or ionic liquids containing Cl and S elements.
7. Packaging and Ordering Information
The standard packaging unit is 10,000 pcs per reel. Reels are enclosed in anti-static moisture-proof bags with desiccant and humidity indicator. 22 reels are packed in a cardboard box. Ordering is done via the full part number which includes bin codes. Refer to the label for specific bins.
8. Application Recommendations
8.1 Typical Applications
- Outdoor full-color video screens
- Indoor and outdoor decorative lighting
- Amusement park lighting
- General signage and display
8.2 Design Considerations
- Always drive each LED chip with a constant current source to ensure uniform brightness and color.
- Ensure reverse voltage does not exceed 5V, especially in matrix drive applications.
- Provide proper thermal management: keep LED surface temperature below 55°C and solder joint temperature below 75°C during operation. Junction temperature must not exceed 105°C.
- For outdoor use, consider IPX6 rating applies to the LED itself; the final assembly must also meet environmental requirements.
- Before first power-up after long storage or damp conditions, operate the display at 20% power for an initial period to dry out moisture.
- Avoid environments with high humidity, condensation, hydrogen sulfide, or salt mist unless additional protection is provided.
9. Handling Precautions
- Storage: moisture-proof and anti-static packaging. Store at ≤30°C/≤60%RH. Use within 6 months. After opening, solder within 12 hours. If not used, store at ≤30°C/≤10%RH and bake before use.
- Static electricity: all equipment must be properly grounded. Use wrist straps, mats, and conductive containers.
- Reverse voltage: protect against reverse voltage >5V.
- Mechanical handling: do not touch the epoxy surface directly; handle by the sides with tweezers. Do not stack assembled PCBs to avoid damage to the resin.
- Do not use in environments where the LED will be exposed to water condensation, frost, dust, corrosive gases, or salt spray without additional protection.
10. Frequently Asked Questions
Q: What is the maximum forward current for each color? A: Red: 25mA, Green: 20mA, Blue: 20mA.
Q: Can I drive all three colors simultaneously at maximum current? A: Yes, but total power dissipation (R+G+B) must not exceed the sum of individual maximums (60+68+68=196mW). Thermal management must ensure junction temperature stays below 105°C.
Q: How should I store unused LEDs after opening the moisture-proof bag? A: Store at ≤30°C and ≤10% RH. If the storage time exceeds the limits or the humidity indicator shows dampness, bake at 65±5°C for 12-48 hours before use.
Q: Is the LED compatible with lead-free soldering? A: Yes, the peak reflow temperature is 245°C, suitable for Pb-free solder paste.
Q: What is the warranty on the LED? A: The manufacturer provides reliability test data but specific warranty terms should be agreed upon separately. The device is designed for long life under rated conditions.
11. Technology Principles and Trends
Full-color SMD LEDs combine red, green, and blue chips in one package to produce a wide color gamut. The red chip is typically based on AlInGaP material, while green and blue are based on InGaN. The wide viewing angle is achieved by the package geometry and encapsulation. Future trends include higher luminous efficacy, smaller package sizes, and improved thermal management. The IPX6 waterproof rating allows use in outdoor environments without additional sealing, which is increasingly demanded in architectural lighting and digital signage.
12. Typical Application Cases
The RF-W1SA28IS-A47 LED is suitable for outdoor LED video walls where high brightness and waterproofness are required. For example, a stadium display using this LED can achieve pixel pitches from P4 to P10 with good contrast and color consistency. In decorative lighting, the wide viewing angle and small package enable seamless light strips. The low forward voltage helps reduce power consumption in battery-powered applications.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |