RGB SMD LED 3.7x3.5x2.8mm Full-Color - Voltage Red 1.7-2.4V, Green/Blue 2.5-3.3V - Power up to 68mW per Die - English Technical Datasheet

1. Product Overview

1.1 General Description

The RF-W1SA35IS-A40 is a full-color RGB SMD LED designed for high-performance display and lighting applications. It features a compact 3.7mm x 3.5mm x 2.8mm package with a matte surface and high contrast design. The device integrates three independent LED chips (Red, Green, Blue) in a single package, offering rich color mixing capabilities. The LED is water-resistant to IPX6, making it suitable for outdoor environments. With a wide viewing angle of 110 degrees and high luminous intensity, it delivers excellent visibility from various angles. The product is RoHS compliant and Pb-free reflow soldering compatible, meeting modern environmental standards.

1.2 Features

• Extremely wide viewing angle (110°).
• High luminous intensity with low power dissipation.
• Good reliability and long operational life.
• Water-resistant to IPX6 level.
• Moisture sensitivity level: 5a (MSL 5a).
• RoHS compliant and Pb-free reflow soldering applicable.
• Matte surface finish for improved contrast.
• Surface brush design for high contrast.

1.3 Applications

• Outdoor full-color video screens and displays.
• Indoor and outdoor decorative lighting.
• Amusement park lighting and entertainment systems.
• General-purpose color indication and signage.

2. Technical Parameters

2.1 Electrical and Optical Characteristics (at Ts=25°C)

The table below summarizes key electrical and optical parameters for each color chip. Forward voltage (VF) ranges for Red: 1.7V to 2.4V, Green: 2.5V to 3.3V, Blue: 2.5V to 3.3V at IF=20mA. Dominant wavelength ranges are 617-628nm (Red), 520-545nm (Green), and 460-475nm (Blue) with binning steps of 5nm for Red and 3nm for Green/Blue. Spectrum radiation bandwidth is 24nm (Red), 38nm (Green), and 30nm (Blue). Luminous intensity (IV) ranges: Red min 730mcd, typ 1100mcd, max 1600mcd; Green min 1540mcd, typ 2300mcd, max 3450mcd; Blue min 380mcd, typ 570mcd, max 850mcd. Intensity binning ratio is 1:1.3 for all colors. Reverse current (IR) is a maximum of 6μA at VR=5V. Viewing angle is 110°.

2.2 Absolute Maximum Ratings

The absolute maximum ratings indicate the limits beyond which device damage may occur. Forward current: Red 25mA, Green/Blue 20mA. Reverse voltage: 5V for all colors. Operating temperature range: -30°C to +85°C. Storage temperature range: -40°C to +100°C. Power dissipation: Red 60mW, Green/Blue 68mW. Junction temperature (TJ) maximum: 115°C. Electrostatic discharge (ESD) withstand voltage (HBM): 1000V. Care must be taken to ensure power dissipation does not exceed the absolute maximum ratings. All measurements are made under standardized environments specified by the manufacturer.

2.3 Binning System

To ensure color consistency and brightness uniformity, each color chip is binned by dominant wavelength, luminous intensity, and forward voltage. The dominant wavelength bins for Red are 5nm increments, and for Green/Blue 3nm increments. Luminous intensity is grouped with a 1:1.3 ratio per bin. Forward voltage bins are also provided for each color. These bins are marked on the product label and enable customers to select LEDs with tight tolerances for uniform displays.

3. Performance Curves

3.1 Forward Voltage vs. Forward Current

The curve (Fig 1-6) shows the relationship between forward voltage and forward current for the three colors. As forward voltage increases from 1.5V to 3.5V, forward current rises exponentially, with Red showing lower voltage at the same current compared to Green and Blue. This helps in designing appropriate current limiting circuits.

3.2 Forward Current vs. Relative Intensity

Fig 1-7 illustrates that relative intensity increases with forward current. At 25mA, relative intensity reaches approximately 250% for Red, 200% for Green, and 180% for Blue compared to the reference point. Linear behavior up to around 20mA indicates optimal efficiency; beyond that, thermal effects may reduce lumen maintenance.

3.3 Luminous Intensity vs. Ambient Temperature

Fig 1-8 shows that luminous intensity decreases as ambient temperature rises. At 100°C, relative intensity drops to about 80% of the value at 25°C. Proper thermal management is essential to maintain brightness in high-temperature environments.

3.4 Solder Temperature vs. Forward Current Derating

Fig 1-9 provides a derating curve for forward current based on solder point temperature (Ts). For example, at Ts=85°C, the maximum forward current must be reduced to approximately 10mA for Green and Blue, and 15mA for Red. This ensures the junction temperature remains within safe limits.

3.5 Spectrum Distribution

Fig 1-10 shows the normalized emission spectra of Red, Green, and Blue chips. The Red peak is around 620-625nm, Green around 530nm, and Blue around 465nm. The narrow bandwidths enable good color saturation and mixing capabilities.

3.6 Radiation Pattern (Directivity)

Fig 1-11 and 1-12 illustrate the angular radiation distribution in X-X and Y-Y directions. The intensity remains above 50% at ±60°, confirming the wide 110° viewing angle. This makes the LED suitable for large-area displays where uniformity is required.

4. Mechanical Dimensions and Packaging

4.1 Package Dimensions

The package outline is 3.7mm x 3.5mm x 2.8mm (LxWxH). The top view shows a 6-pin configuration with anode/cathode for each color: 1R+, 2R-, 3G+, 4G-, 5B+, 6B-. A pin mark indicates polarity. The bottom view shows the solder pads. A recommended soldering pattern is provided (Fig 1-5) to ensure proper heat dissipation and mechanical stability. The package includes a glue filling layer (Fig 1-6) for additional protection. All dimensions are in millimeters with tolerances of ±0.1mm unless otherwise noted.

4.2 Carrier Tape and Reel Dimensions

The LEDs are packaged in carrier tape with a pitch suitable for automated pick-and-place. The reel dimensions: A=400.2mm, B=100.0mm, C=14.3mm, D=2.6mm, E=16.4mm, F=12.7mm. The carrier tape width is typically 16mm. Tolerances are ±0.1mm unless noted. Each reel contains 4000 pcs.

4.3 Label Information

The label includes part number, lot number, binning codes for intensity (IV), forward voltage (VF), wavelength (Wd), forward current (IF), and quantity (QTY). Manufacturing date is also indicated. This information is essential for traceability and ensuring matched bins in an assembly.

4.4 Moisture Resistant Packaging

The LEDs are shipped in anti-static and moisture-proof aluminum foil bags with desiccant and a humidity indicator card. This protects the MSL 5a sensitive devices during storage and transport. The bag is vacuum sealed to maintain low humidity inside.

5. Soldering Guidelines

5.1 Reflow Soldering Profile

A standard Pb-free reflow profile is recommended. Key parameters: average ramp-up rate ≤4°C/s, preheat from 150°C to 200°C for 60-120s, time above 217°C (TL) ≤60s, peak temperature (TP) ≤245°C for ≤10s, and time within 5°C of peak ≤30s. Cooling rate ≤6°C/s. Total time from 25°C to peak ≤8 minutes. Only one reflow cycle is allowed. Nitrogen reflow is recommended to prevent oxidation and maintain optical performance. The use of middle-temperature solder paste is suggested.

5.2 Hand Soldering and Repair

If hand soldering is necessary, use a soldering iron set below 300°C and keep contact time under 3 seconds. Only one hand soldering operation is allowed. Repair after soldering is not recommended; if unavoidable, use a double-head soldering iron and pre-validate the impact on LED characteristics.

5.3 Cleaning

Do not use water, benzene, or thinner for cleaning. Isopropyl alcohol (IPA) is recommended. If other solvents are used, confirm they do not attack the LED package. Avoid ionic liquids containing chlorine or sulfur elements, as they may cause corrosion.

6. Handling Precautions

6.1 Storage Conditions

The moisture-proof packaging is valid for 6 months if stored under 30°C and 60% RH. Before opening, check for air leaks; if found, bake the product before use. After opening, use within 12 hours under 30°C/60% RH. Unused material must be stored under 30°C/10% RH and baked before next use (65±5°C for 24 hours). Baking requirements depend on the production date and dampness state as detailed in the table.

6.2 Electrostatic Discharge (ESD) Protection

All equipment handling the LEDs must be properly grounded. Use anti-static wrist straps, pads, uniforms, gloves, and containers. Damaged LEDs may exhibit lower forward voltage or failure to light at low current.

6.3 Reverse Voltage Protection

The reverse current of normal LEDs is very small, but repeated reverse voltage exceeding 5V can cause damage and increase reverse current, affecting display gray scale. Design circuits to ensure reverse voltage never exceeds 5V.

6.4 Safe Operating Temperature

The LED surface temperature should be below 55°C, and the lead temperature below 75°C during operation. Proper thermal management with adequate PCB copper area and spacing is required to keep the junction temperature below the maximum 115°C. Drive current must be derated based on ambient temperature.

6.5 Design and Usage Directions

• Forward current per chip must not exceed the absolute maximum.
• Constant current driving is recommended for each color.
• Total power dissipation must stay within limits when multiple dice are lit.
• Avoid reverse voltage; ensure power is switched off when not in use. For long-term storage, dehumidify before reuse.
• In matrix drive, ensure reverse voltage does not exceed rating. Protect against lightning surges.
• Age the display after assembly to detect defects, using proper current levels and condensation-free environment.
• For harsh environments (high humidity, salts, sulfides), provide additional protection.
• Initial power-on after installation should be at 20% wattage for an initial period to relieve moisture.
• For rental displays, use matched bins for color and brightness uniformity. When shipping, use moisture-proof packaging and protect LEDs physically.

6.6 Other Handling Notes

Do not touch the epoxy surface directly; handle by the side surfaces with tweezers. Avoid bare hand contact to prevent contamination. Do not stack assembled PCBs to avoid damage to the resin and wire bonds. Refer to the manufacturer's full user manual for additional precautions.

6.7 Declaration

This specification is provided in both English and Chinese; the Chinese version is authoritative. The manufacturer reserves the right to modify specifications without prior notice. The valid specification is the one signed by both parties before volume production.

7. Reliability Testing

7.1 Test Items and Conditions

The LED is subjected to various reliability tests as per JEDEC and JEITA standards. Tests include resistance to soldering heat (260°C peak, 3 times), thermal shock (-40°C to +100°C, 500 cycles), moisture resistance (85°C/85%RH + 3 reflows), high temperature storage (100°C for 1000h), low temperature storage (-40°C for 1000h), room temperature operating life (25°C, 20mA for 1000h), high temperature high humidity life (85°C/85%RH, 10mA for 500h), temperature humidity storage (85°C/85%RH for 1000h), and low temperature operating life (-40°C, 20mA for 1000h). Sample size is 22pcs with acceptance criteria of 0/1 defects.

7.2 Failure Criteria

Judgment criteria: Forward voltage shift ≤10%, reverse current ≤10μA at 5V, luminous intensity degradation average ≤30%, and no mechanical defects like cracks, delamination, or dead lights. The reliability tests are conducted on single/strip LEDs under good thermal dissipation; actual application conditions may affect lifetime.

8. Ordering Information

The standard packaging unit is a reel of 4000 pieces. The product is supplied with a label indicating part number, lot number, bin codes, and quantity. For ordering, customers must specify the desired wavelength, intensity, and voltage bins. Contact the supplier for availability of specific bins.

9. Application Recommendations

9.1 Drive Circuit Design

Use constant current drivers for each color channel to maintain consistent brightness and color mixing. The forward voltage variation among bins should be considered when designing the compliance voltage of the driver. Series resistors or linear regulators may be used for small batches, but PWM dimming with constant current is preferred for large displays to avoid color shift.

9.2 Thermal Management

Since the maximum junction temperature is 115°C, proper heat sinking through PCB copper planes and thermal vias is necessary. For dense pixel pitches, consider increasing spacing or using forced convection. Derate the drive current as per the solder temperature derating curve (Fig 1-9) to avoid overheating.

9.3 Color Mixing and Calibration

To achieve accurate white balance, calibrate the PWM ratios of RGB channels using a colorimeter. The narrow bandwidths (especially Red and Blue) provide a wide color gamut, but binning variations require compensation. Use the bin codes from the label to sort LEDs into groups with tight tolerances.

9.4 Environmental Considerations

The IPX6 rating allows outdoor use in rain, but prolonged exposure to high humidity, salt spray, or corrosive gases (e.g., hydrogen sulfide) may degrade performance. Provide conformal coating or encapsulation for outdoor modules. In coastal areas, use additional protective measures.