RF-W2S118TS-A42-E1 LED Datasheet - 3.2x1.0x1.48mm - Orange/Green/Blue - Voltage 1.8-3.5V - Power 48-70mW - English Technical Specifications

1. Product Overview

The RF-W2S118TS-A42-E1 is a high-performance tri-color SMD LED designed for general indication and display applications. It integrates blue, green, and orange LED chips in a compact 3.2mm x 1.0mm x 1.48mm package, offering excellent color mixing and wide viewing angle. The device is suitable for all SMT assembly processes and is RoHS compliant, with a moisture sensitivity level of 3. Its small footprint and low profile make it ideal for space-constrained designs requiring multiple colors.

1.1 Key Features

• Extremely wide viewing angle (140° typical) for uniform light distribution.
• Suitable for all SMT assembly and reflow soldering processes.
• Moisture sensitivity level: Level 3 (168 hours floor life after opening bag).
• RoHS compliant, environmentally friendly.
• Tri-color output: Orange (620-630nm), Green (515-530nm), Blue (465-475nm).

1.2 Applications

• Optical indicators and status signals.
• Switches, symbols, and display backlighting.
• General-purpose illumination in consumer electronics, automotive, and industrial equipment.

2. Technical Parameter Deep Dive

All parameters are measured at Ts=25°C unless otherwise noted. The following sections provide detailed interpretation of electrical, optical, and thermal characteristics.

2.1 Electrical / Optical Characteristics (IF=20mA)

2.2 Absolute Maximum Ratings

3. Binning System Explanation

The LED is binned by dominant wavelength, luminous intensity, and forward voltage to ensure consistency in production. The bin codes are indicated on the product label.

3.1 Dominant Wavelength Bins

Orange: Codes E00-F00 (620-630nm). Green: D10-F20 (515-530nm). Blue: D10-E20 (465-475nm). Each bin covers a 2.5nm or 5nm range for tight color control.

3.2 Luminous Intensity Bins

Intensity bins are coded as 1DW, 1AP, G20, etc., each covering a specific range (e.g., 70-90 mcd for 1DW, 90-120 mcd for 1AP). Orange has the widest range (1DW to 1CL) up to 900 mcd. Green ranges from 1DW to 1GK (70-260 mcd). Blue ranges from 1DW to 1AU (70-330 mcd).

3.3 Forward Voltage Bins

Orange uses code 1L (1.8-2.4V). Green and Blue use code 1N (2.8-3.5V).

4. Performance Curves Analysis

The datasheet provides typical optical characteristic curves to help designers predict behavior under various conditions.

4.1 Forward Voltage vs. Forward Current (Fig.1-6)

As forward current increases from 0 to 30mA, forward voltage rises non-linearly. At 20mA, VF is approximately 2.0V for orange and 3.0V for green/blue. This curve is essential for designing current-limiting resistors.

4.2 Relative Intensity vs. Forward Current (Fig.1-7)

Relative intensity increases almost linearly with forward current up to 30mA, with slight saturation at higher currents. Operating at 20mA provides a good balance of brightness and efficiency.

4.3 Pin Temperature vs. Relative Intensity (Fig.1-8)

As ambient temperature rises from 25°C to 100°C, relative intensity drops by about 20% for all colors. Thermal management is important in high-temperature environments to maintain consistent brightness.

4.4 Pin Temperature vs. Forward Current (Fig.1-9)

The maximum allowable forward current decreases with increasing pin temperature to avoid exceeding the junction temperature limit. For example, at 85°C, the current must be reduced to approximately 15mA.

4.5 Dominant Wavelength vs. Forward Current (Fig.1-10 to 1-12)

For blue chips, increasing current from 0 to 30mA causes a blue shift (wavelength decreases by ~3nm). Orange and green show minimal shift. This effect must be considered in multi-color applications requiring stable color.

4.6 Relative Intensity vs. Wavelength (Fig.1-13)

The spectral distribution shows narrow peaks for blue (~468nm), green (~522nm), and orange (~624nm). The full width at half maximum (FWHM) is 15nm for orange, 30nm for green and blue.

4.7 Radiation Pattern (Fig.1-14)

The viewing angle is 140° (half angle), indicating a wide, Lambertian-like distribution suitable for uniform area illumination.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED package measures 3.20mm x 1.00mm x 1.48mm (length x width x height). Top and side views are provided in the datasheet. The bottom view shows four pads: pad 1 (polarity mark, likely cathode for blue?), pad 2 (green anode), pad 3 (blue anode), pad 4 (orange anode). Polarity marking is indicated by a triangle or notch on top.

5.2 Recommended Soldering Pad Layout

The recommended PCB footprint includes four rectangular pads: 0.80mm x 0.35mm for each, with 1.30mm pitch between rows. Adequate thermal relief and solder mask openings are suggested for reliable assembly.

5.3 Carrier Tape and Reel Dimensions

The LED is supplied on 8mm wide carrier tape with 4mm sprocket hole pitch. Tape thickness is 1.25mm. Reel diameter is 178mm (7 inches), with a hub diameter of 60mm and a 13mm spindle hole. Each reel contains 3000 pieces.

5.4 Label Information

Labels on the reel include part number, spec number, lot number, bin code (luminous flux, chromaticity, forward voltage, wavelength), quantity, and date code.

5.5 Moisture Barrier Bag (MBB)

The reel is sealed in an aluminum moisture barrier bag with a desiccant and humidity indicator card. The bag is vacuum-packed to maintain moisture level below the specified threshold.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile is based on JEDEC J-STD-020. Key parameters: Preheat from 150°C to 200°C for 60-120 seconds. Ramp-up rate ≤3°C/s. Time above 217°C: 60-150 seconds. Peak temperature: 260°C (max 10 seconds). Cooling rate ≤6°C/s. Total time from 25°C to peak: max 8 minutes. Reflow can be performed twice, but the interval between reflows should not exceed 24 hours to avoid moisture absorption damage.

6.2 Hand Soldering

If hand soldering is necessary, use a soldering iron at <300°C for less than 3 seconds per pad, and only once. Do not apply mechanical force during cooling.

6.3 Storage and Baking

Before opening the MBB, store at ≤30°C and ≤75% RH for up to 1 year. After opening, the LEDs must be used within 168 hours under ≤30°C and ≤60% RH. If the humidity indicator shows exposure or the storage time is exceeded, bake at 60°C ±5°C for more than 24 hours before use.

7. Packaging and Ordering Information

The standard packaging is 3000 pieces per reel on 8mm tape. Each reel is individually labeled and sealed in a moisture barrier bag. For bulk orders, multiple reels are packed in a cardboard box. The part number RF-W2S118TS-A42-E1 includes specific configuration details. Contact supplier for custom binning or packaging options.

8. Application Design Recommendations

8.1 Typical Applications

Status indicators, pushbutton backlighting, RGB decorative lighting, display panels, automotive interior lighting, and consumer electronics.

8.2 Design Considerations

• Current Limiting: Always use series resistors to limit current to 20mA per channel. A small change in supply voltage can cause large current variation due to the LED's exponential I-V characteristic.
• Thermal Management: The maximum junction temperature is 95°C. Ensure adequate heat sinking through PCB copper planes. Derate current at high ambient temperatures.
• ESD Protection: The LED is rated for 1000V HBM. Use standard ESD precautions during handling and assembly. Consider adding TVS diodes for robust designs.
• Color Mixing: For white light generation, drive all three chips with appropriate PWM or analog currents. The wide viewing angle helps uniform mixing.
• Environment: Avoid exposure to sulfur, chlorine, bromine compounds exceeding recommended limits (S <100ppm, Br <900ppm, Cl <900ppm, total halogens <1500ppm).

9. Technology Comparison

Compared to conventional 3528 or 2835 SMD LEDs, the RF-W2S118TS-A42-E1 offers a smaller footprint (3.2x1.0mm vs typical 3.5x2.8mm) and a very wide viewing angle (140° vs typical 120°). It is one of the thinnest (1.48mm) tri-color LEDs available, making it suitable for slim designs. The integrated three chips allow independent control for dynamic color mixing without external optics.

10. Frequently Asked Questions

1. What is the maximum current for each color? The absolute maximum forward current is 20mA DC, and 60mA pulsed (1/10 duty, 0.1ms). Do not exceed these ratings to avoid damage.
2. Can I use all three colors simultaneously at 20mA each? Yes, but ensure the total power dissipation does not cause the junction temperature to exceed 95°C. In practice, the package can handle 48mW (orange) + 70mW (green) + 70mW (blue) = 188mW total, which is within safe limits if thermal design is adequate.
3. What is the typical luminous intensity for each color? Orange: 70-900 mcd, Green: 70-330 mcd, Blue: 70-260 mcd (at 20mA). These ranges depend on binning. Check the bin code on the label for exact values.
4. How should I clean the LED after soldering? Use isopropyl alcohol (IPA). Do not use solvents that may attack the silicone encapsulant. Ultrasonic cleaning is not recommended.
5. What is the storage humidity requirement? After opening the moisture barrier bag, the LEDs must be used within 168 hours (7 days) under <60% RH and <30°C. Baking is required if these conditions are violated.
6. Is the LED compatible with lead-free reflow? Yes, the peak temperature of 260°C complies with lead-free soldering standards.

11. Design Case Study: Multi-Color Status Indicator

In a typical network switch, the RF-W2S118TS-A42-E1 can be used to indicate link status (green), activity (orange), and error (blue). Each LED is driven by a constant-current source at 15mA to reduce power and extend life. The wide viewing angle ensures visibility from multiple angles. The compact size allows dense placement on a 1U panel. Thermal analysis shows that with a 0.5oz copper PCB and adequate via stitching, the junction temperature stays below 75°C at 25°C ambient.

12. Operating Principle

Each color chip is a semiconductor diode that emits light when forward biased. The orange chip uses AlGaInP technology, while green and blue use InGaN technology. The emitted wavelength is determined by the bandgap of the semiconductor materials. The silicone encapsulant protects the chips and provides a refractive index matching for efficient light extraction.

13. Market Trends and Future Developments

The trend in LED packaging is toward smaller footprints, higher luminous efficacy, and multi-color integration. This device reflects the industry shift to miniaturization with maintaining high performance. Future improvements may include higher thermal conductivity substrates and tighter color binning to enable better consistency in modular displays.