White LED 3.5x2.8x1.84mm, 3.1V, 30mA, 91mW - PLCC2 Package Specification

1. Product Overview

This white LED is fabricated using a blue chip combined with phosphor to produce white light. It is housed in a compact PLCC2 package measuring 3.50mm x 2.80mm x 1.84mm (length x width x height). The device is designed for general lighting applications, particularly automotive interior lighting and switches, and complies with AEC-Q101 stress test qualification guidelines for automotive-grade discrete semiconductors. Key features include an extremely wide viewing angle, suitability for all SMT assembly and solder processes, and availability in tape and reel packaging. The moisture sensitivity level is Level 2 per JEDEC standards, and the component meets RoHS and REACH requirements.

2. Technical Parameter Analysis

2.1 Optical & Electrical Characteristics (Ts=25°C)

At a test current of 3mA, the forward voltage (VF) ranges from 2.5V to 3.1V, with typical values around 2.7V to 3.1V. The reverse current (IR) at VR=5V is a maximum of 10 µA, ensuring low leakage. Luminous intensity (IV) at 3mA is between 23 mcd and 53 mcd, depending on the bin. The viewing angle (2θ1/2) is typically 120 degrees, providing wide dispersion of light. Thermal resistance from junction to solder point (RTHJ-S) is rated at 300 °C/W maximum.

2.2 Absolute Maximum Ratings

The device can withstand a power dissipation (PD) of up to 91 mW. Maximum forward continuous current is 30 mA, while peak forward current (1/10 duty cycle, 10ms pulse) can reach 100 mA. Reverse voltage is limited to 5V. Electrostatic discharge withstand (HBM) is 2000V. Operating and storage temperature ranges are both -40°C to +100°C, with a junction temperature maximum of 120°C. Designers must ensure that power dissipation does not exceed the absolute maximum rating, and current should be limited using appropriate resistors to prevent thermal runaway.

3. Binning System

3.1 Forward Voltage and Luminous Intensity Bins (IF=3mA)

The LED is sorted into bins for forward voltage and luminous intensity. Voltage bins include E2 (2.5-2.6V), F1 (2.6-2.7V), F2 (2.7-2.8V), G1 (2.8-2.9V), G2 (2.9-3.0V), H1 (3.0-3.1V). Luminous intensity bins are C20 (23-28 mcd), D10 (28-35 mcd), D20 (35-43 mcd), E10 (43-53 mcd). This binning allows customers to select LEDs with consistent electrical and optical performance for their specific applications.

3.2 Chromaticity Binning

The LED is also binned for color coordinates based on CIE 1931 (x,y) chromaticity. Four main bins are defined: M02, M03, P02, P03. Each bin has a rectangular region in the chromaticity diagram, ensuring color consistency. For example, M02 covers x=0.2766-0.2866, y=0.2397-0.2477; M03 covers x=0.2857-0.2957, y=0.2557-0.2637; P02 covers x=0.2674-0.2820, y=0.2317-0.2397; P03 covers x=0.2766-0.2911, y=0.2477-0.2557. These bins correspond to white light with correlated color temperatures in the warm white to neutral white range.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (IV Curve)

The typical forward voltage vs. forward current characteristic (Fig. 1-7) shows an exponential increase: at 2.5V the current is near zero, rising to about 5mA at 2.7V, 15mA at 2.9V, and 30mA at 3.1V. This curve is essential for designing drive circuits, as small voltage variations lead to large current changes. A series resistor is recommended for current regulation.

4.2 Relative Intensity vs. Forward Current

The relative luminous intensity increases with forward current in a sublinear manner (Fig. 1-8). At 3mA, intensity is approximately 100%; at 1mA it drops to about 40%; at 5mA it reaches about 170%. Operating at higher currents increases brightness but also generates more heat, so thermal management is critical.

4.3 Temperature Dependence

Figures 1-9 to 1-11 show the effect of solder temperature (Ts) on performance. Relative intensity decreases slightly with increasing temperature: at 100°C, intensity drops to about 90% of the 25°C value. Maximum forward current must be derated as temperature rises. Forward voltage also decreases with temperature (approximately -2mV/°C), which affects power consumption. Color shift with temperature (Fig. 1-13) shows a slight movement in the chromaticity diagram; the x coordinate increases about 0.005 and y decreases about 0.005 from 25°C to 105°C.

4.4 Radiation Pattern

The radiation diagram (Fig. 1-12) indicates a nearly Lambertian emission pattern with relative intensity dropping to 50% at about ±60°, confirming the 120° viewing angle. This wide distribution is ideal for applications requiring uniform illumination across a broad area.

4.5 Spectrum

The spectrum (Fig. 1-14) shows a blue peak around 450nm from the InGaN chip and a broad yellow phosphor peak centered near 550nm, resulting in white light emission. The spectral distribution covers 400-700nm.

5. Mechanical & Packaging Information

5.1 Package Dimensions

The LED package is 3.50mm long, 2.80mm wide, and 1.84mm high (top view). Bottom view shows a central anode pad (2.50mm x 2.18mm) and a cathode pad (0.75mm x 2.00mm). The polarity mark is indicated on the package. Recommended soldering pattern (land pattern) has dimensions: 2.40mm x 1.25mm for cathode, 4.45mm x 2.40mm overall. Tolerances are ±0.2mm unless otherwise noted.

5.2 Tape and Reel Packaging

LEDs are packaged in carrier tape with a pitch of 8mm, 2000pcs per reel. Reel dimensions: diameter 178±1mm, width 60±1mm, hub diameter 13.0±0.5mm. The tape has a polarity mark and top cover tape. Labeling includes part number, spec number, lot number, bin code, luminous flux (or intensity), chromaticity bin, forward voltage, wavelength code, quantity, and date code.

5.3 Moisture Barrier Packaging

The reels are placed in moisture barrier bags with a humidity indicator and desiccant. After opening, LEDs should be used within 24 hours if stored at ≤30°C/≤60%RH. If storage exceeds recommended time, baking at 60±5°C for >24 hours is required.

6. Soldering Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile (Fig. 3-1, Table 3-1) specifies: average ramp-up rate ≤3°C/s; preheating from 150°C to 200°C for 60-120s; time above 217°C (TL) max 60s; peak temperature (TP) 260°C for max 10s; cooling rate ≤6°C/s. Total time from 25°C to peak max 8 minutes. Only two reflow cycles are allowed; if more than 24 hours between cycles, baking is required before second reflow.

6.2 Hand Soldering and Repair

Hand soldering: iron temperature <300°C, time <3s, one time only. Repair after reflow is not recommended, but if necessary, use a double-head iron. Avoid mechanical stress on the silicone encapsulant during heating.

6.3 Special Considerations

The LED encapsulant is silicone, which is soft. Avoid excessive pressure on the top surface during pick-and-place. Do not mount on warped PCBs or bend the board after soldering. Do not apply force or vibration during cooling. Rapid cooling after reflow is not allowed.

7. Ordering & Storage Information

7.1 Packaging Quantity

Standard packaging quantity is 2000 pieces per reel. For higher volumes, reels are packed in cardboard boxes. Labeling follows the format shown in the datasheet.

7.2 Storage Conditions

Unopened moisture barrier bags: temperature ≤30°C, humidity ≤75%, shelf life 1 year from date of manufacture. After opening: recommended use within 24 hours at ≤30°C/≤60%RH. If not used within 24 hours, bake at 60±5°C for >24 hours before use. The desiccant should remain blue; if it has faded, baking is required.

8. Application Recommendations

8.1 Typical Applications

This white LED is ideally suited for automotive interior lighting such as dome lights, map lights, ambient lighting, and dashboard backlighting. It is also suitable for switches and indicators in automotive and consumer electronics. The wide viewing angle and compact size make it versatile for space-constrained designs.

8.2 Design Considerations

Thermal management is critical: a proper PCB pad and heat sink should be used to keep junction temperature ≤120°C. Use current-limiting resistors; do not exceed 30mA continuous forward current. For pulse applications, limit peak current to 100mA with 10% duty cycle. ESD protection measures are required as the device can be damaged by discharges >2000V (HBM). Avoid exposing the LED to environments with sulfur >100ppm or halogens (Br<900ppm, Cl<900ppm, total <1500ppm) to prevent corrosion or discoloration. Cleaning is recommended with isopropyl alcohol; ultrasonic cleaning may damage the LED.

9. Technical Comparison

Compared to similar PLCC2 white LEDs, this device offers AEC-Q101 qualification, ensuring reliability for automotive applications. The wide viewing angle (120°) provides better light distribution than narrower-angle LEDs. The binning options for voltage, intensity, and color allow tight tolerance matching. The maximum operating temperature of 100°C (ambient) and 120°C junction temperature is competitive. However, the relatively low luminous intensity (max 53mcd at 3mA) may require multiple devices for higher brightness needs. The package height of 1.84mm is a bit taller than some ultra-thin LEDs, but still suitable for most designs.

10. Frequently Asked Questions

Q: Can I drive this LED directly from a 3.3V supply?
A: Not directly; you must use a series resistor. At 3.3V, the forward voltage could be as low as 2.5V, leading to excessive current. Calculate resistor value: R = (Vsupply - VF) / I. For 30mA, assuming VF=2.7V, R = (3.3-2.7)/0.03 = 20Ω. Use nearest standard value and check power dissipation.

Q: What is the typical color temperature?
A: Based on the chromaticity bins, the color temperature ranges from about 3000K to 5000K depending on bin. For example, M02 and M03 bins correspond to warm white, while P02 and P03 are slightly cooler. Exact CCT can be calculated from xy coordinates using approximation formulas.

Q: How do I handle multiple LEDs in series or parallel?
A: When connecting in series, the forward voltages add; ensure total voltage available is sufficient. For parallel branches, each LED should have its own series resistor to balance current. Thermal distribution must be considered.

Q: Is this LED suitable for outdoor use?
A: The operating temperature range is -40 to +100°C, which covers most indoor and automotive environments. However, the package is not UV-stabilized and may suffer degradation if exposed to direct sunlight. For outdoor applications, additional protection (e.g., conformal coating) may be needed.

11. Practical Usage Examples

Example 1: Automotive Dome Light
A dome light requires uniform illumination. Using 6 of these white LEDs arranged in a circular array, each driven at 20mA, provides sufficient brightness for interior lighting. The wide viewing angle ensures no dark spots. A lens can be added to diffuse light further. The LEDs are soldered onto an aluminum PCB for heat dissipation.

Example 2: Pushbutton Backlighting
For a switch, one LED is placed behind the button. Operating at 3mA, it provides about 30mcd, sufficient for a small indicator. The LED is surface-mounted on the PCB, and a light pipe directs light to the button. The low current minimizes heat generation.

12. Operating Principle

The white LED operates on the principle of phosphor conversion. A blue InGaN/GaN LED chip emits blue light at around 450nm. This blue light excites a yellow-emitting phosphor (typically YAG:Ce), which down-converts part of the blue light into broad yellow emission. The combination of remaining blue and yellow light appears white to the human eye. The exact color temperature is determined by the phosphor composition and concentration. The LED is driven by a forward current, which injects electrons and holes into the active region, recombining to produce photons.

13. Development Trends

The trend in white LEDs for automotive and general lighting is toward higher efficacy (lm/W) and better color rendering. Future iterations of this PLCC2 package may use more efficient phosphors with narrower emission bands to achieve higher efficacy and improved color quality. Additionally, integration with smart driving and color-tunable systems is expected. The AEC-Q101 qualification indicates a push toward higher reliability for harsh environments. Miniaturization continues, with thinner packages and smaller footprints appearing. However, thermal management remains a key challenge as power densities increase.