RGB LED Full Color Specification - Size 2.8x2.7x2.45mm - Voltage R:1.7-2.4V G/B:2.5-3.3V - Power 60/68mW per chip - English Technical Document

1. Product Overview

The RF-W1SA27HS-M42 is a full-color SMD LED package designed for high-contrast applications. It features an all-black surface to minimize reflection and maximize contrast in display applications. The compact dimensions of 2.8mm x 2.7mm x 2.45mm make it suitable for high-density pixel arrangements.

1.1 General Description

This LED integrates three separate red, green, and blue chips in a single package, capable of producing a wide color gamut. The product is designed with an extremely wide viewing angle of 110 degrees, ensuring uniform color perception across a broad audience. It is rated IPX6 for water resistance, making it robust for outdoor installations. The moisture sensitivity level is 5a, requiring careful handling and storage. Additionally, the product is RoHS compliant and compatible with lead-free reflow soldering processes.

1.2 Features

• Extremely wide viewing angle (110°)
• High luminous intensity with low power dissipation
• Good reliability and long operational life
• Water-resistant to IPX6 standard
• Moisture sensitivity level: 5a
• RoHS compliant and Pb-free reflow soldering capable
• Matte surface finish

1.3 Applications

• Outdoor full-color video screens
• Indoor and outdoor decorative lighting
• Amusement attractions and entertainment lighting
• General signage and display purposes

2. Technical Parameters

2.1 Electrical and Optical Characteristics (at Ts=25°C)

The following table summarizes the key electrical and optical parameters for each color chip:

All parameters measured at IF = 20mA for each chip, unless otherwise noted. Measurement tolerances: forward voltage ±0.1V, dominant wavelength ±1nm, luminous intensity ±10%.

2.2 Absolute Maximum Ratings

Care must be taken to ensure that the power dissipation does not exceed the maximum rating. The product should not be operated at conditions exceeding these limits.

2.3 Binning System

The LEDs are sorted into bins based on forward voltage (VF), luminous intensity (Iv), and dominant wavelength (λD). The binning range for luminous intensity is 1:1.3. For wavelength, red chips have a bin step of 5nm, while green and blue have 3nm per bin. The label includes the part number, lot number, and bin codes for IV, VF, Wd, and IF.

3. Performance Characteristics

3.1 Forward Voltage vs. Forward Current

Figure 1-6 shows the relationship between forward voltage and forward current for each color. As forward voltage increases, forward current rises non-linearly. The red chip has a lower threshold voltage compared to green and blue, consistent with its lower forward voltage range.

3.2 Relative Intensity vs. Forward Current

Figure 1-7 illustrates the relative intensity as a function of forward current. The output intensity increases with current, but the rate of increase slows at higher currents due to thermal effects.

3.3 Luminous Intensity vs. Ambient Temperature

Figure 1-8 shows the relative intensity as the ambient temperature varies from -30°C to 85°C. Intensity decreases with rising temperature, particularly for the blue chip. Proper thermal management is essential to maintain performance.

3.4 Solder Temperature vs. Forward Current

Figure 1-9 indicates the maximum allowable forward current at different solder pad temperatures. Higher temperatures reduce the maximum current to avoid overheating the LED junction.

3.5 Spectrum Distribution

Figure 1-10 presents the normalized spectral emission of the red, green, and blue chips. The red peak is around 620nm, green around 530nm, and blue around 465nm. The spectra are relatively narrow, enabling good color purity for display applications.

3.6 Radiation Patterns

Figures 1-11 and 1-12 show the radiation intensity versus angle in the X-X and Y-Y directions, respectively. The LED exhibits a broad, nearly Lambertian emission pattern with a half-power angle of about 55 degrees from normal, resulting in a wide viewing angle of 110 degrees total.

4. Mechanical Information

4.1 Package Dimensions

The LED package dimensions are 2.8mm (length) x 2.7mm (width) x 2.45mm (height). All tolerances are ±0.1mm unless otherwise noted. The package has six leads: 1R+, 2R- for red, 3G+, 4G- for green, 5B+, 6B- for blue. The pin 1 mark is indicated on the top view. The bottom view shows the soldering pads.

4.2 Polarity

The polarity is shown in Figure 1-4. The anode and cathode for each color are clearly marked. Reverse bias protection circuits should be included in the design to prevent damage.

4.3 Soldering Patterns

Figure 1-5 provides the recommended soldering pad layout. Dimensions are provided for proper PCB footprint design. Additionally, the package includes glue filling (Figure 1-6) to protect the wire bonds.

5. Packaging

5.1 Packaging Specification

The LEDs are packaged in tape and reel format with 10,000 pieces per reel. The carrier tape dimensions are specified in Figure 2-1, and the reel dimensions in Figure 2-2 (outer diameter 400mm, inner diameter 100mm, width 12.4mm, etc.).

5.2 Label and Moisture Barrier

Each reel is labeled with part number, lot number, bin codes for luminous intensity (IV), forward voltage (VF), wavelength (Wd), forward current (IF), quantity (QTY) in thousands, and date code. The reel is sealed in an anti-static and moisture-proof aluminum foil bag with desiccant and a humidity indicator card (HIC) to maintain low moisture levels.

5.3 Cardboard Box

Multiple reels are packed in a cardboard box for shipping. The box dimensions are provided in Figure 2-5.

6. Reliability

6.1 Reliability Test Items

The product is tested under various stress conditions as per JEDEC standards: resistance to soldering heat (260°C, 3 times), thermal shock (-40°C to 100°C, 500 cycles), moisture resistance (85°C/85%RH + reflow), high temperature storage (100°C, 1000h), low temperature storage (-40°C, 1000h), room temperature operating life (25°C, 20mA, 1000h), high temperature high humidity life test (85°C/85%RH, 10mA, 500h), temperature humidity storage (85°C/85%RH, 1000h), and low temperature life test (-40°C, 20mA, 1000h).

6.2 Failure Criteria

After reliability tests, the LEDs are judged based on: forward voltage shift less than 10%, reverse current less than 10μA, average luminous intensity degradation less than 30%, and no mechanical damage (cracks, delamination, dead chips).

7. SMT Reflow Soldering

7.1 Reflow Profile

The recommended reflow soldering profile is shown in Figure 3-1 and Table 3-1. Key parameters: ramp-up rate ≤4°C/s, preheating from 150°C to 200°C for 60-120s, time above 217°C (TL) ≤60s, peak temperature 245°C for ≤10s, cooling rate ≤6°C/s. Total time from 25°C to peak ≤8 minutes. Only one reflow is allowed. Use of middle temperature solder paste is recommended.

7.2 Hand Soldering and Repair

If hand soldering is necessary, use a soldering iron at a temperature below 300°C for less than 3 seconds, and only once. Repair should be avoided, but if needed, use a double-head soldering iron. After soldering, allow the product to cool to room temperature before handling.

7.3 Cleaning

Do not clean with water, benzene, or thinner. Isopropyl alcohol (alcohol) is recommended. Avoid ionic liquids containing chlorine (Cl) or sulfur (S).

8. Handling Precautions

8.1 Storage

The moisture-proof package should be stored at ≤30°C and ≤60% RH for up to 6 months. After opening, the LEDs must be used within 12 hours in a controlled environment (≤30°C, ≤60% RH). Unused material should be stored at ≤30°C and ≤10% RH and baked at 65±5°C for 24 hours before next use. For products dampened or older than 6 months, baking time increases (24-48h) or return to factory.

8.2 Static Electricity

Static discharge can damage the LED, causing lower forward voltage or no light. All equipment and personnel should be properly grounded. Use anti-static wrist straps, pads, and containers.

8.3 Reverse Voltage Protection

The reverse current is normally small, but excessive reverse voltage (above 5V) can rapidly increase leakage current and cause gray scale issues in displays. Design to keep reverse voltage below 5V.

8.4 Thermal Management

To ensure long life, the LED surface temperature should be kept below 55°C, and lead temperature below 75°C in operation. Proper PCB thermal design and spacing are critical. The junction temperature must not exceed 115°C.

9. Application Design Recommendations

Use constant current drivers for each color to maintain consistent brightness. Ensure the total power dissipation does not exceed the maximum ratings. When using matrix drive, avoid reverse voltage during off-time. Degradation can occur if the LEDs are not used for long periods; dehumidify before re-use. For rental displays, bin selection ensures color uniformity. Avoid environments with hydrogen sulfide or high salt content.

10. Technology Comparison

Compared to standard RGB LEDs, this device features an all-black surface that enhances contrast by reducing light reflection from the package. The IPX6 rating provides protection against powerful water jets, making it ideal for outdoor use. The wide viewing angle of 110 degrees surpasses many competing products that offer only 90-100 degrees. Additionally, the moisture sensitivity level 5a requires careful handling but allows for lead-free reflow compatibility.

11. Frequently Asked Questions

Q: Why is baking required before soldering?
A: To remove moisture absorbed by the package, which can cause popcorning during reflow, leading to internal damage.

Q: Can I drive all three colors at full current simultaneously?
A: The maximum total power dissipation must be considered. While each chip can operate at its max current, the combined heat may exceed thermal limits. Appropriate heatsinking and current derating are necessary.

Q: How can I ensure color uniformity across many LEDs?
A: Use LEDs from the same bin codes for luminous intensity and wavelength. The datasheet specifies binning ranges to facilitate matching.

12. Case Studies

In a large outdoor full-color video screen installation, thousands of these LEDs were used with a pixel pitch of 10mm. The all-black surface significantly improved contrast ratio compared to conventional gray-surface LEDs, enabling better readability under direct sunlight. The IPX6 rating ensured reliable operation during rainstorms. With proper thermal management, the screen achieved a brightness of over 5000 nits and a lifespan exceeding 50,000 hours.

13. Operating Principle

RGB LEDs combine three semiconductor chips that emit different wavelengths (red: AlInGaP, green and blue: InGaN). By varying the forward current to each chip, the human eye perceives a wide range of colors through additive color mixing. The package design includes a reflector cup and transparent resin to extract light efficiently and achieve the desired beam pattern.

14. Development Trends

The trend in outdoor LED displays is toward higher brightness, better color uniformity, and enhanced environmental durability. This LED's all-black surface and IPX6 rating align with the demand for higher contrast and weather resistance. Future developments may include even smaller packages, higher efficacy, and integration with smart control systems.