RGBW LED 3.5x3.7x2.6mm Datasheet - Forward Voltage 1.7-3.4V - Power 60-68mW - Full Color Weatherproof

1. Product Overview

This RGBW LED is a compact surface-mount device integrating four individual LED chips (Red, Green, Blue, and White) in a single package measuring 3.5mm x 3.7mm x 2.6mm. Designed for high-performance full-color applications, it offers an extremely wide viewing angle of 110 degrees and is rated IPX6 water-resistant, making it ideal for both indoor and outdoor environments. The matte surface reduces glare, and the component is RoHS compliant and Pb-free reflow solderable. With a moisture sensitivity level of 5a, proper handling and storage are required to ensure reliability.

2. Features and Benefits

• Extremely wide viewing angle (110°).
• High luminous intensity with low power dissipation.
• Water-resistant to IPX6 standard.
• Moisture sensitivity level 5a.
• RoHS compliant and lead-free reflow soldering compatible.
• Matte surface for reduced reflections.
• Single package with four independent color channels (R, G, B, W).

3. Applications

• Outdoor full-color video screens.
• Indoor and outdoor decorative lighting.
• Amusement park lighting and displays.
• General signage and architectural lighting.

4. Electrical and Optical Characteristics

All measurements are taken at an ambient temperature of 25°C (Ts=25°C) unless otherwise noted. The following tables summarize the key electrical and optical parameters per chip.

4.1 Forward Voltage (VF)

4.2 Dominant Wavelength (λD) and Luminous Intensity (IV)

Tested at IF=20mA per chip. Wavelength bins are per 5nm (Red) or 4nm (Green/Blue). White is defined by correlated color temperature (CCT) bins (50A, 50B, 50C). Luminous intensity is binned with a 1:1.4 ratio range.

4.3 Spectrum Bandwidth and Viewing Angle

The spectral half-width (Δλ) for Red is 24nm, Green is 38nm, and Blue is 30nm. The viewing angle (2θ1/2) is 110 degrees for all colors.

5. Absolute Maximum Ratings

Stresses beyond those listed may cause permanent damage. Exposure to absolute maximum ratings for extended periods can affect device reliability.

6. Binning System

Products are sorted into bins for luminous intensity, dominant wavelength (or CCT for white), and forward voltage. The intensity ratio within a bin is 1:1.4. Wavelength bins for Red are 5nm steps; Green and Blue are 4nm steps. White is binned by CIE color coordinates (50A, 50B, 50C). Forward voltage bins are defined per chip but not explicitly listed; typical distribution follows the min-max ranges above. All measurements have tolerances: VF ±0.1V, wavelength ±1nm, intensity ±10%, color coordinates ±0.01.

7. Typical Optical Characteristics Curves

7.1 Forward Voltage vs. Forward Current

The forward voltage increases with forward current. At low currents (below 10mA), the voltage rises steeply; above 20mA, the curve becomes more linear. The red chip has the lowest forward voltage; green, blue, and white are similar but higher.

7.2 Forward Current vs. Relative Intensity

Relative luminous intensity increases superlinearly with forward current. At 20mA, the intensity is normalized to 100%. For safe operation, do not exceed absolute maximum current ratings.

7.3 Luminous Intensity vs. Ambient Temperature

Intensity degrades as temperature rises. At 70°C, relative intensity drops to approximately 80% of the value at 25°C. Proper thermal management is essential to maintain brightness and longevity.

7.4 Solder Temperature vs. Forward Current

To avoid thermal damage, the maximum forward current must be derated as the solder point temperature increases. At 100°C, the allowable current is reduced to near zero.

7.5 Spectrum Distribution

The spectral curves show narrow peaks for red (617-628nm), green (520-545nm), and blue (460-475nm). The white LED has a broad spectrum covering the visible range, with correlated color temperature bins around 4000K and 5000K.

7.6 Radiation Diagram

The radiation pattern is approximately Lambertian, with maximum intensity at 0° and half-power at ±55°. This wide distribution is suitable for uniform illumination over large areas.

8. Mechanical and Packaging Information

8.1 Package Dimensions

The LED package is 3.5mm x 3.7mm x 2.6mm (length x width x height). Pin 1 is marked with a dot. The bottom view shows 8 solder pads: pins 1 (B-), 2 (R-), 3 (G-), 4 (W-), 5 (R+), 6 (G+), 7 (B+), 8 (W+). Polarity is indicated by the + and - symbols on the bottom. A glue filling is applied for protection. Soldering patterns (recommended PCB land pattern) are provided in the datasheet with dimensions in millimeters, tolerance ±0.1mm.

8.2 Carrier Tape and Reel

Products are packaged in carrier tape (4,000 pieces per reel). The reel has dimensions: outer diameter (A) 400±2mm, inner diameter (B) 100.0±0.4mm, hub width (C) 14.3±0.3mm, tape width (D) 2.6±0.2mm, pitch (E) 16.4±0.3mm, sprocket hole diameter (F) 12.7±0.8/-0.3mm. Carrier tape thickness is 1.9mm (T).

8.3 Label Information

Each reel is labeled with part number, lot number (including packing machine, serial number, bin code, quantity in thousands), luminous intensity bin (IV), forward voltage bin (VF), wavelength bin (Wd), forward current (IF), quantity (QTY), and date (DATE).

8.4 Moisture Resistant Packing

The reel is placed in an anti-static, moisture-proof aluminum foil bag together with a desiccant and a humidity indicator card (HIC). The bag is vacuum-sealed to prevent moisture absorption.

8.5 Cardboard Box

Multiple sealed bags are packed in a cardboard box for shipping. The box provides mechanical protection during transport.

9. Reliability Test Items and Conditions

The following tests are performed to ensure product reliability (sample size 22 pieces, acceptance criteria 0/1 failure):

• Resistance to Soldering Heat: 260°C max, 3 times
• Thermal Shock: -40°C to 100°C, 15 min each, 500 cycles
• Moisture Resistance: Preconditioning 85°C/85%RH/12h + reflow
• High Temperature Storage: 100°C, 1000h
• Low Temperature Storage: -40°C, 1000h
• Room Temperature Operating Life: 25°C, IF=20mA, 1000h
• High Temperature High Humidity Life: 85°C/85%RH, IF=10mA, 500h
• Temperature Humidity Storage: 85°C/85%RH, 1000h
• Low Temperature Life: -40°C, IF=20mA, 1000h

Judgment criteria: VF change within ±10%, IR ≤10μA at 5V, average IV degradation ≤30%, no internal cracks or abnormal appearance.

10. SMT Reflow Soldering Instructions

10.1 Reflow Profile

Use a standard lead-free reflow profile. Key parameters: preheat from 150°C to 200°C in 60-120s; time above 217°C (TL) ≤60s; peak temperature (TP) 245°C with time within 5°C of peak ≤30s and tp ≤10s; cooling rate ≤6°C/s. Total time from 25°C to peak ≤8 minutes. Do not reflow more than once. Use only middle temperature solder paste. Nitrogen reflow is recommended to prevent oxidation.

10.2 Hand Soldering

If hand soldering is necessary, use a soldering iron set below 300°C for less than 3 seconds per joint. Hand soldering should be done only once.

10.3 Repairing

Repair is not recommended. If unavoidable, use a double-head soldering iron to simultaneously heat both pads and remove the LED. Confirm that characteristics are not compromised.

10.4 Cleaning

Do not clean with water, benzene, or thinner. Isopropyl alcohol (IPA) is recommended. Avoid solvents containing chlorine or sulfur. Confirm cleaning agent compatibility before use.

11. Handling Precautions

11.1 Storage

Store in moisture-proof anti-static packaging at ≤30°C and ≤60% RH. Suggested shelf life: 6 months. Unopened packages with no leaks can be stored up to 12 months with baking before use. After opening, use within 12 hours (environment ≤30°C/60% RH). Unused parts must be stored in dry environment (≤30°C/≤10% RH) and baked before next use (65±5°C for 24-48h depending on exposure).

11.2 Static Electricity

LEDs are sensitive to electrostatic discharge. Use grounded equipment, anti-static wrist straps, mats, and containers. Avoid handling unless adequately protected.

11.3 Reverse Voltage Protection

Reverse voltage exceeding 5V can damage the LED. Ensure circuit design prevents reverse bias. In matrix driving, implement protection to avoid reverse overvoltage.

11.4 Safe Operating Temperature

Keep LED surface temperature below 55°C and lead temperature below 75°C to prevent rapid degradation. Proper thermal management (PCB heat sinking, spacing) is required to keep junction temperature below 115°C.

11.5 Current Driving

Use constant current drivers for each chip. Do not exceed rated forward current. When multiple chips operate simultaneously, ensure total power dissipation does not exceed the package max rating (68mW for each G/B/W, 60mW for R).

11.6 Environmental Considerations

Avoid exposure to corrosive gases (e.g., hydrogen sulfide, salt) and environments with high humidity. If used in coastal or volcanic areas, lifetime may be reduced. After long storage or transport, dehumidify before use. Initially power at 20% wattage to dry out any absorbed moisture before full power.

12. Application Recommendations

• For outdoor full-color video walls, use matched bins to ensure uniform color and brightness.
• Design PCBs with adequate copper area for heat dissipation. Maintain spacing between LEDs to avoid thermal crowding.
• Protect against lightning surges and high transients. Series resistors or current limiting is necessary.
• For rental displays, select LEDs with same reflow cycle count. After repair, matching is critical.
• Implement aging tests (e.g., 48h at nominal current) to screen for early failures.

13. Technical Comparison

Compared to standard 3528 or 5050 RGB LEDs, this 3.5x3.7mm RGBW offers a wider viewing angle (110° vs typical 120° for 5050 not necessarily wider), IPX6 water resistance (not common in standard SMD LEDs), and matte surface for reduced glare. The integrated white chip simplifies color mixing and eliminates the need for an additional white LED. The 5a moisture sensitivity level allows shorter floor life but requires careful handling.

14. Common Questions

Q: How to prevent ESD damage? Use anti-static workstation, grounded tools, and avoid plastic containers. Store in anti-static bags.

Q: Can I use this LED in a 5V circuit without a resistor? No. The forward voltage is lower than 5V for all chips; without current limiting, excessive current will destroy the LED. Always use a constant current source or series resistor.

Q: What is the lifetime? The LEDs are rated for long life under specified conditions. Proper thermal management and stable current are critical. The datasheet provides reliability test data but not explicit L70 hours; typical high-quality LEDs can exceed 50,000 hours at rated current if junction temperature is controlled.

15. Practical Use Cases

In an outdoor LED video wall, each pixel uses one RGBW LED. The wide 110° viewing angle ensures consistent color from side angles. The IPX6 rating allows the display to withstand rain. White chip improves color gamut and brightness for white content. Designers must account for voltage drops across long cables and use proper power supply with redundancy.

16. Operating Principle

The red, green, blue, and white chips are independent GaN-based (G/B) or AlInGaP (R) diodes that emit light when forward biased. White chip is a blue LED with yellow phosphor to produce white light. By varying the current to each chip, any color within the gamut can be produced. The four chips are mounted on a common substrate and encapsulated with transparent epoxy that forms a lens for wide radiation.

17. Development Trends

Miniaturization continues: smaller packages like 2.0x2.0mm with even more chips are emerging. Higher efficacy and luminance per chip are driven by improved epitaxial structures. Integrated smart control (e.g., addressable RGBW) is becoming popular. Reliability enhancements such as higher IP ratings and better corrosion resistance are demanded for outdoor applications.